公开(公告)号：US06642866B2

公开(公告)日：2003-11-04

申请号：US10063204

申请日：2002-03-28

申请人： Tai-Haur Kuo ,  Kuo-Hsin Chen ,  Jyh-Fong Lin ,  Hsin-Chieh Lin

发明人： Tai-Haur Kuo ,  Kuo-Hsin Chen ,  Jyh-Fong Lin ,  Hsin-Chieh Lin

IPC分类号： H03M106

CPC分类号： H03M1/1004 ,  H03M1/0682 ,  H03M1/1023 ,  H03M1/365

摘要： An analog-to-digital data converter converts an input signal to corresponding digital signals. The data converter includes two sets of comparison units arranged in an interlaced sense to alternatively analyze the input signal, generate digital signals corresponding to the result of comparing the input signal and reference signals. Each of the comparison units has a positive output and a negative output, and the digital signal is generated by the negative output and the positive output of the comparison units in a differential way. When the comparison units of one set are performing auto-zeroing, the comparison units of the other set perform the data conversion to generate corresponding digital signals.

摘要翻译： 模拟数字数据转换器将输入信号转换成相应的数字信号。 数据转换器包括以隔行方式布置的两组比较单元，以交替地分析输入信号，产生对应于比较输入信号和参考信号的结果的数字信号。 每个比较单元具有正输出和负输出，并且数字信号以差分方式由负输出和比较单元的正输出产生。 当一组的比较单元正在执行自动归零时，另一组的比较单元执行数据转换以产生相应的数字信号。

公开(公告)号：US08760224B2

公开(公告)日：2014-06-24

申请号：US13354940

申请日：2012-01-20

申请人： Kuo-Hsin Chen

发明人： Kuo-Hsin Chen

IPC分类号： H03F1/02 ,  H03F3/45

CPC分类号： H03F3/45973 ,  H03F1/305 ,  H03F3/45475 ,  H03F2203/45048 ,  H03F2203/45528 ,  H03F2203/45536

摘要： An amplifying circuit is provided and includes a signal processor, an edge detector, and a calibration controller. The signal processor transforms amplitude information of a first and second input signals into time domain to provide first and second output signals respectively. The edge detector detects a polarity of a voltage offset from a timing relationship of the first and second output signals. The calibration controller compensates the voltage offset according to a change of the detected polarity.

摘要翻译： 提供了放大电路并且包括信号处理器，边缘检测器和校准控制器。 信号处理器将第一和第二输入信号的幅度信息转换成时域，以分别提供第一和第二输出信号。 边沿检测器检测来自第一和第二输出信号的定时关系的电压偏移的极性。 校准控制器根据检测到的极性的变化补偿电压偏移。

公开(公告)号：US20090038777A1

公开(公告)日：2009-02-12

申请号：US12187819

申请日：2008-08-07

申请人： Kuo-Hsin Chen ,  Hsuan-Chih Lin

发明人： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC分类号： F28F7/00

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： In a heat sink and the manufacturing method thereof, the heat sink includes heat dissipation fins and heat pipes, and the heat dissipation fins have through holes for the heat pipes to pass through. The heat dissipating fins also have a notch formed at the peripheral of the through hole and communicating with the through hole, and openings formed at two sides of the notch, respectively. According to the manufacturing method, after the heat pipe is assembled with the heat dissipating fin, press strips pass through the openings and are pressed inwardly to reduce the notch to make the notch and the heat pipe plastically deformed. Finally the press strips are removed.

摘要翻译： 在散热片及其制造方法中，散热片包括散热翅片和热管，散热片具有通过热管的通孔。 散热片还具有形成在通孔的周边并与通孔连通的凹口，以及形成在凹口两侧的开口。 根据制造方法，在热管与散热片组装之后，压条穿过开口并被向内压入以减小切口以使切口和热管塑性变形。 最后删除压条。

公开(公告)号：US20080041567A1

公开(公告)日：2008-02-21

申请号：US11843934

申请日：2007-08-23

申请人： Kuo-Hsin Chen ,  Hsuan-Chih Lin

发明人： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

摘要翻译： 散热模块包括导热管和散热片模块。 通过压制和堆叠制成的散热片模块安装在导热管上。 接下来，在散热片模块的顶面上设置夹具，并且力压缩热散热片模块，以便减小散热片模块的两个散热片之间的距离。 然后，将固定板设置在导热管上的散热片模块上方，并移除夹具。 最后，固定板固定在散热片模块上，散热片模块与导热管牢固固定。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20070131389A1

公开(公告)日：2007-06-14

申请号：US11297402

申请日：2005-12-09

申请人： Kuo-Hsin Chen ,  Hsuan-Chih Lin

发明人： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49368 ,  H01L2924/00

摘要： A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a distance between two fins of the thermal fin module is reduced. Finally, a fixing plate is set above the last thermal fin module on the thermal conductive pipes to fix the thermal fin modules securely engaged with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

摘要翻译： 散热装置包括导热管和多个散热片模块。 通过压制和堆叠制成的每个散热片模块安装在导热管上。 保持器位于每个两个散热片模块之间，以压缩散热片模块，从而减小散热片模块的两个散热片之间的距离。 最后，将固定板设置在导热管上的最后一个散热片模块上方，以将散热片模块固定在导热管上。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20070011877A1

公开(公告)日：2007-01-18

申请号：US11178297

申请日：2005-07-12

申请人： Kuo-Hsin Chen ,  Hsuen-Chih Lin

发明人： Kuo-Hsin Chen ,  Hsuen-Chih Lin

IPC分类号： B23P6/00

CPC分类号： B23P15/26 ,  B23P2700/09 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2021/0031 ,  F28F1/32 ,  Y10T29/49353 ,  Y10T29/49364 ,  Y10T29/49378

摘要： A method for fabricating a cooling device. The cooling device includes a heat pipe and a plurality of thin fins. First, a through hole is formed on each thin fin. The through hole includes a surrounding wall of gradually withdrawing radius, so as to stack the thin fins together. Then, the heat pipe is tightly inserted from the surrounding wall of larger radius into the through holes of the thin fins. By applying two forces of opposite directions to the thin fins, the surrounding walls of the thin fins is sequentially embedded into and compressed onto the heat pipe. In this manner, the contact area between the thin fins is increased, while the contact between the surrounding wall of the thin fins and the heat pipe becomes tighter. A cooling device of better heat dissipating rate is thus fabricated.

摘要翻译： 一种冷却装置的制造方法。 冷却装置包括热管和多个薄翅片。 首先，在每个薄翅片上形成通孔。 通孔包括逐渐缩回半径的周围壁，以将薄翅片堆叠在一起。 然后，将热管从较大半径的周围壁紧紧地插入薄翅片的通孔中。 通过向薄翅片施加相反方向的两个力，薄翅片的周围壁顺序地嵌入并压缩到热管上。 以这种方式，薄翅片之间的接触面积增加，而薄翅片的周围壁与热管之间的接触变得更紧。 因此制造了具有更好的散热速率的冷却装置。