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26 条记录 (耗时 0.032 秒)

    Substrate treating apparatus with inter-unit buffers
    16.
    发明授权
    Substrate treating apparatus with inter-unit buffers 有权
    具有单位间缓冲液的基板处理装置

    公开(公告)号：US08545118B2

    公开(公告)日：2013-10-01

    申请号：US12324794

    申请日：2008-11-26

    申请人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

    发明人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

    IPC分类号： G03D5/00

    CPC分类号： B05C13/00 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225

    摘要： The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.

    摘要翻译： 本发明提供涂覆单元，热处理单元和用于将基底输送到这些处理单元中的每一个的第一主输送机构。 基板通过接收器从第一主输送机构传送到第二主输送机构。 当基板不能放置在接收器上时，将该基板放置在缓冲器上。 因此，第一主输送机构可以继续输送其它基板。 处理单元中的其它基材在处理单元之间没有延迟地输送，以接收包括涂覆处理和热处理的一系列处理。 这防止了在基板上形成膜的处理质量的降低。

    MULTI-LINE SUBSTRATE TREATING APPARATUS
    17.
    发明申请
    MULTI-LINE SUBSTRATE TREATING APPARATUS 审中-公开
    多线基板处理设备

    公开(公告)号：US20090139833A1

    公开(公告)日：2009-06-04

    申请号：US12324788

    申请日：2008-11-26

    申请人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

    发明人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

    IPC分类号： B65G43/08

    CPC分类号： H01L21/67178 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742

    摘要： A substrate treating apparatus includes substrate treatment lines arranged one over another, each for treating substrates while transporting the substrates substantially horizontally. The apparatus further includes an interface section for transporting the substrates between the substrate treatment lines and an exposing machine having a plurality of exposing stages, the exposing machine being provided separately from the apparatus, and a controller for controlling transport of the substrates in the interface section to cause all the substrates similarly treated in each of the substrate treatment lines to be exposed on one of the exposing stages. This apparatus can uniform the quality of treatment among a plurality of substrates receiving the same type of treatment in the same substrate treating line.

    摘要翻译： 基板处理装置包括彼此重叠布置的基板处理线，每个基板处理线基本上水平地输送基板，用于处理基板。 该装置还包括用于在基板处理线之间输送基板的接口部分和具有多个曝光台的曝光机，所述曝光机与所述装置分开设置，以及用于控制所述基板在所述界面部分中的传送的控制器 使得在每个基板处理线中类似地处理的所有基板在一个曝光阶段上暴露。 该装置可以在同一基板处理线中接收相同类型处理的多个基板之间使处理质量均匀。

    Substrate processing apparatus and substrate processing system
    19.
    发明授权
    Substrate processing apparatus and substrate processing system 失效
    基板加工装置及基板处理系统

    公开(公告)号：US07531039B2

    公开(公告)日：2009-05-12

    申请号：US10669520

    申请日：2003-09-24

    申请人： Masanobu Sato ,  Kenya Morinishi

    发明人： Masanobu Sato ,  Kenya Morinishi

    IPC分类号： B05C11/02 ,  B05C13/02 ,  B05B1/28

    CPC分类号： H01L21/68707 ,  B08B17/00 ,  C03C17/001 ,  H01L21/67017 ,  H01L21/68735

    摘要： Of a substrate-facing surface 24 of an atmosphere blocking member 2, a central area 241 which is faced with an approximately central portion of a substrate S is a flat surface while a periphery edge area 242 which is faced with a periphery edge of the substrate S is an angled surface which becomes closer to the substrate S with a distance toward a periphery edge of the substrate-facing surface 24. Hence, a micro-space SP between the substrate S and the atmosphere blocking member 2 becomes gradually narrower in a direction R which is toward the periphery edge of the substrate S. As an atmosphere gas is fed into the micro-space SP, the atmosphere gas is compressed in the vicinity of a periphery edge of the micro-space SP and a pressure rises. As a result, the micro-space SP becomes positively pressurized as compared with a mist-splashed atmosphere, which effectively prevents a mist from invading other major surface S2 of the substrate S.

    摘要翻译： 在大气阻挡构件2的面向基板的表面24中，面对基板S的大致中心部分的中心区域241是平坦表面，而面向基板的周边边缘的周边边缘区域242 S是朝向与基板相对的表面24的周边的距离更靠近基板S的成角度的表面。因此，基板S和气氛阻挡构件2之间的微空间SP在方向上逐渐变窄 R朝向基板S的周边边缘。当气氛气体被馈送到微空间SP中时，气氛气体在微空间SP的周边边缘附近被压缩并且压力上升。 结果，微雾SP与雾化气氛相比变得积极加压，这有效地防止了雾侵入基片S的其它主表面S2。