公开(公告)号：US11760871B2

公开(公告)日：2023-09-19

申请号：US17285659

申请日：2019-10-09

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Yoshihiro Nakazumi ,  Kentaro Takano

IPC分类号： B32B3/10 ,  C08L63/00 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03 ,  H05K1/05 ,  C08J5/24

CPC分类号： C08L63/00 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  C08J5/244 ,  C08J5/249 ,  H05K1/0373 ,  H05K1/056 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2439/04 ,  C08J2463/00 ,  C08J2465/00 ,  C08L2203/20 ,  C08L2205/035 ,  H05K2201/0355

摘要： A thermosetting resin composition containing a thermosetting resin (A), boron nitride (B), and a dispersant (C) with a pH of 8 or higher.

公开(公告)号：US09974169B2

公开(公告)日：2018-05-15

申请号：US15501654

申请日：2016-01-27

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Takashi Kobayashi ,  Kentaro Takano ,  Sotaro Hiramatsu

IPC分类号： B32B27/38 ,  C08G59/50 ,  H05K1/03 ,  C08G8/28 ,  C08J5/24 ,  C08G71/04 ,  C08K3/36 ,  C08K5/098 ,  B32B15/14 ,  B32B5/02 ,  B32B15/20 ,  D06M15/564 ,  D06M101/00

CPC分类号： H05K1/0373 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G8/28 ,  C08G71/04 ,  C08J5/24 ,  C08J2375/12 ,  C08K3/36 ,  C08K5/098 ,  C08K5/3415 ,  C08K5/3477 ,  C08L61/14 ,  C08L61/34 ,  D06M15/564 ,  D06M2101/00 ,  H05K1/0346

摘要： A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

公开(公告)号：US11118012B2

公开(公告)日：2021-09-14

申请号：US16639936

申请日：2018-07-17

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Shota Koga ,  Kentaro Takano

IPC分类号： C08G73/10 ,  C08J5/24 ,  C08L79/08 ,  H05K1/05

摘要： The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a cyanate compound (B). wherein R each independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a proportion of R representing a methyl group, among all R, is 50 mol % or more, and n represents an integer of 0 to 2.

公开(公告)号：US10550228B2

公开(公告)日：2020-02-04

申请号：US15737490

申请日：2016-07-04

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Naoki Kashima ,  Katsuya Tomizawa ,  Meguru Ito ,  Tomoki Hamajima ,  Eisuke Shiga ,  Kentaro Takano ,  Shota Koga

IPC分类号： C08G73/06 ,  C08J5/24 ,  C08G59/62 ,  C08K3/22 ,  C08K3/36 ,  B32B15/088 ,  C08F226/06 ,  C08G59/40 ,  H01B3/30 ,  H05K1/03

摘要： The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

公开(公告)号：US09999126B2

公开(公告)日：2018-06-12

申请号：US15525442

申请日：2016-01-29

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.

发明人： Takashi Kobayashi ,  Kentaro Takano

IPC分类号： B32B27/38 ,  B32B15/08 ,  H05K1/03 ,  B32B15/092 ,  C08J5/24 ,  C08G8/28 ,  C08G59/40 ,  C08K3/36

CPC分类号： H05K1/0373 ,  B32B15/08 ,  B32B15/092 ,  C08G8/28 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/04 ,  C08K3/36 ,  C08K5/315 ,  C08K5/3415 ,  C08L61/04 ,  C08L61/14 ,  C08L63/00

摘要： The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): wherein n represents an integer of 1 or more; and an epoxy resin (B).