公开(公告)号：US08115218B2

公开(公告)日：2012-02-14

申请号：US12501496

申请日：2009-07-13

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/508 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 发光二极管（LED）封装结构包括载体，第一突起，LED芯片和粘合层。 第一突起设置在载体上并且具有第一开口以使载体露出。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

公开(公告)号：US20130168714A1

公开(公告)日：2013-07-04

申请号：US13633878

申请日：2012-10-03

申请人： Chao-Wei Li ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/52 ,  H01L33/50

CPC分类号： H01L33/501 ,  H01L33/505 ,  H01L33/54 ,  H01L33/648

摘要： A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s.

摘要翻译： 提供了一种发光二极管封装结构，包括基板，密封组件，光学元件，至少一个发光二极管芯片和封装材料层。 密封组件设置在基板上。 光学元件设置在密封组件上，并且在光学元件，密封组件和基板之间形成封闭空间。 发光二极管芯片设置在基板上并位于封闭空间中。 包装材料层位于封闭空间中，并且至少设置在发光二极管芯片的上表面上，其中包装材料层包括具有高粘度的液体和多个固体颗粒，并且具有 高粘度大于3000mPa·s。

公开(公告)号：US20130010463A1

公开(公告)日：2013-01-10

申请号：US13410306

申请日：2012-03-02

申请人： Chao-Wei Li ,  Cheng-Da Shaw ,  Hung-Lieh Hu ,  Yi-Jen Chan

发明人： Chao-Wei Li ,  Cheng-Da Shaw ,  Hung-Lieh Hu ,  Yi-Jen Chan

IPC分类号： F21V29/00 ,  F21V21/00 ,  F21V11/00

CPC分类号： F21K9/232 ,  F21V29/713 ,  F21V29/773 ,  F21V29/777 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2115/10 ,  Y10T29/49002

摘要： An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board.

摘要翻译： 提供一种包括基座，散热构件，FPC基板和多个发光元件的照明装置。 散热构件设置在基座上。 散热构件具有中心轴线和曲面。 中心轴穿过基座，曲面围绕中心轴线。 FPC基板设置在曲面上。 发光元件设置在FPC基板上。

公开(公告)号：US08178890B2

公开(公告)日：2012-05-15

申请号：US12575470

申请日：2009-10-08

申请人： Chao-Wei Li ,  Chien-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Chien-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/648 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.

摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和高导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 高导热透明液体填充密封空间。

公开(公告)号：US20090230417A1

公开(公告)日：2009-09-17

申请号：US12126935

申请日：2008-05-26

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/00 ,  H01L21/02

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 本发明公开了一种包括载体，第一突起，LED芯片和粘附层的发光二极管（LED）封装结构。 第一突起设置在载体上并且具有第一开口以暴露载体，其中第一突起由导热材料形成。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

公开(公告)号：US07923746B2

公开(公告)日：2011-04-12

申请号：US12126935

申请日：2008-05-26

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/48

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 本发明公开了一种包括载体，第一突起，LED芯片和粘附层的发光二极管（LED）封装结构。 第一突起设置在载体上并且具有第一开口以暴露载体，其中第一突起由导热材料形成。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

公开(公告)号：US20100213479A1

公开(公告)日：2010-08-26

申请号：US12575470

申请日：2009-10-08

申请人： Chao-Wei Li ,  Chen-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

发明人： Chao-Wei Li ,  Chen-Peng Hsu ,  Yao-Jun Tsai ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/648 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.

摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和高导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 高导热透明液体填充密封空间。

公开(公告)号：US20090267102A1

公开(公告)日：2009-10-29

申请号：US12501496

申请日：2009-07-13

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/00

CPC分类号： H01L33/56 ,  H01L33/508 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.

摘要翻译： 发光二极管（LED）封装结构包括载体，第一突起，LED芯片和粘合层。 第一突起设置在载体上并且具有第一开口以使载体露出。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

公开(公告)号：USD685508S1

公开(公告)日：2013-07-02

申请号：US29431081

申请日：2012-09-04

申请人： Chao-Wei Li ,  Hung-Lieh Hu ,  Cheng-Da Shaw ,  Chen-Peng Hsu

设计人： Chao-Wei Li ,  Hung-Lieh Hu ,  Cheng-Da Shaw ,  Chen-Peng Hsu

公开(公告)号：US20110092002A1

公开(公告)日：2011-04-21

申请号：US12976977

申请日：2010-12-22

申请人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

发明人： Yao-Jun Tsai ,  Chen-Peng Hsu ,  Chao-Wei Li ,  Hung-Lieh Hu

IPC分类号： H01L33/48 ,  H01L33/42

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.

摘要翻译： 本发明公开了一种制造发光二极管（LED）封装结构的方法。 该方法包括以下步骤：提供具有基板和第一突起的载体，其中第一突起设置在基板上并具有凹部。 粘合层和LED芯片设置在凹部的底部，其中粘合层结合在载体和LED芯片之间，并且凹部的宽度与LED芯片的宽度之间的比率大于1 并且小于或等于1.5，使得在LED芯片的侧壁和凹部的内侧壁之间存在间隙。