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公开(公告)号：US08692274B2
公开(公告)日：2014-04-08
申请号：US13448413
申请日：2012-04-17
申请人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
发明人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/648 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 导热透明液体填充密封空间。
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公开(公告)号：US08349627B2
公开(公告)日：2013-01-08
申请号：US12976977
申请日：2010-12-22
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.
摘要翻译： 本发明公开了一种制造发光二极管（LED）封装结构的方法。 该方法包括以下步骤：提供具有基板和第一突起的载体，其中第一突起设置在基板上并具有凹部。 粘合层和LED芯片设置在凹部的底部，其中粘合层结合在载体和LED芯片之间，并且凹部的宽度与LED芯片的宽度之间的比率大于1 并且小于或等于1.5，使得在LED芯片的侧壁和凹部的内侧壁之间存在间隙。
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公开(公告)号：US20120199862A1
公开(公告)日：2012-08-09
申请号：US13448413
申请日：2012-04-17
申请人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
发明人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
IPC分类号： H01L33/50
CPC分类号： H01L33/648 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 导热透明液体填充密封空间。
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4.发明授权公开(公告)号：US08115218B2
公开(公告)日：2012-02-14
申请号：US12501496
申请日：2009-07-13
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L33/508 , H01L33/54 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
摘要翻译： 发光二极管（LED）封装结构包括载体，第一突起，LED芯片和粘合层。 第一突起设置在载体上并且具有第一开口以使载体露出。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。
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5.发明申请公开(公告)号：US20090230417A1
公开(公告)日：2009-09-17
申请号：US12126935
申请日：2008-05-26
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
摘要翻译： 本发明公开了一种包括载体，第一突起，LED芯片和粘附层的发光二极管（LED）封装结构。 第一突起设置在载体上并且具有第一开口以暴露载体，其中第一突起由导热材料形成。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。
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公开(公告)号：US20110092002A1
公开(公告)日：2011-04-21
申请号：US12976977
申请日：2010-12-22
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.
摘要翻译： 本发明公开了一种制造发光二极管（LED）封装结构的方法。 该方法包括以下步骤：提供具有基板和第一突起的载体，其中第一突起设置在基板上并具有凹部。 粘合层和LED芯片设置在凹部的底部，其中粘合层结合在载体和LED芯片之间，并且凹部的宽度与LED芯片的宽度之间的比率大于1 并且小于或等于1.5，使得在LED芯片的侧壁和凹部的内侧壁之间存在间隙。
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7.发明授权公开(公告)号：US07923746B2
公开(公告)日：2011-04-12
申请号：US12126935
申请日：2008-05-26
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
摘要翻译： 本发明公开了一种包括载体，第一突起，LED芯片和粘附层的发光二极管（LED）封装结构。 第一突起设置在载体上并且具有第一开口以暴露载体，其中第一突起由导热材料形成。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。
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公开(公告)号：US20100213479A1
公开(公告)日：2010-08-26
申请号：US12575470
申请日：2009-10-08
申请人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
发明人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/648 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/10155 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.
摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和高导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 高导热透明液体填充密封空间。
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9.发明申请公开(公告)号：US20090267102A1
公开(公告)日：2009-10-29
申请号：US12501496
申请日：2009-07-13
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/56 , H01L33/508 , H01L33/54 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
摘要翻译： 发光二极管（LED）封装结构包括载体，第一突起，LED芯片和粘合层。 第一突起设置在载体上并且具有第一开口以使载体露出。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。 粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。
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公开(公告)号：US08178890B2
公开(公告)日：2012-05-15
申请号：US12575470
申请日：2009-10-08
申请人： Chao-Wei Li , Chien-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
发明人： Chao-Wei Li , Chien-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/648 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/10155 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.
摘要翻译： 提供了包括载体基板，至少一个LED芯片，光学元件和高导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。 光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。 高导热透明液体填充密封空间。
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