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    MODULE AND SEMICONDUCTOR COMPOSITE DEVICE
    11.
    发明公开
    MODULE AND SEMICONDUCTOR COMPOSITE DEVICE 审中-公开

    公开(公告)号：US20240332346A1

    公开(公告)日：2024-10-03

    申请号：US18678104

    申请日：2024-05-30

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji OTANI

    IPC: H03H7/01 ,  H01L25/16

    CPC classification number: H01L28/60 ,  H01L25/16 ,  H01L28/10 ,  H03H7/0115

    Abstract: A module includes a plurality of stacking layers configured to form a capacitor, one or more through-hole conductors that extend through the plurality of stacking layers in a thickness direction of the plurality of stacking layers, and one or more connection terminals that are patterned in one or more connection terminal layers. The one or more connection terminals are coupled to the one or more through-hole conductors. The one or more connection terminals are patterned with limitations in order to suppress and avoid warping and delamination during heat treatment.

    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME
    13.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20160042871A1

    公开(公告)日：2016-02-11

    申请号：US14922550

    申请日：2015-10-26

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kota ZENZAI ,  Hisayoshi OMORI ,  Takashi KANAYAMA ,  Kiyoyasu SAKURADA ,  Naoki SHIMIZU ,  Seiji KATSUTA ,  Shinji OTANI

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/248 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/252 ,  H01G13/006 ,  H05K3/1283 ,  H05K3/4664

    Abstract: A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.

    Abstract translation: 制备陶瓷体，其包括设置在陶瓷体内部的内部电极，并且内部电极的端部被引导到陶瓷体的表面。 在陶瓷体的表面上形成电极层，以覆盖内部电极的端部，含有树脂的电极层，含有第一金属成分的第一金属填料和含有第一金属成分的第二金属填料 具有比第一金属成分高的熔点的第二金属成分。 进行加热电极层的加热步骤，以形成包括位于陶瓷体表面上并含有第一和第二金属成分的金属层的电极和内部电极中所含的金属。

    METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT
    14.
    发明公开
    METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240363289A1

    公开(公告)日：2024-10-31

    申请号：US18769737

    申请日：2024-07-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji OTANI ,  Hidehiko TANAKA

    IPC: H01G4/30 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G4/012 ,  Y10T29/435

    Abstract: A method for manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming a plurality of internal electrode patterns on a main surface of the ceramic green sheet, applying a ceramic paste above the main surface of the ceramic green sheet, stacking a plurality of the ceramic green sheets, pressing the plurality of stacked ceramic green sheets, and cutting the plurality of pressed ceramic green sheets. The ceramic paste at least partially overlaps end portions of the internal electrode patterns, and a stepped region is provided on the ceramic green sheet. When cutting the ceramic green sheets in a first direction, the cutting is performed at a position of the stepped region between two of the internal electrode patterns adjacent to each other in a second direction.

    MODULE
    15.
    发明申请
    MODULE 有权

    公开(公告)号：US20220278035A1

    公开(公告)日：2022-09-01

    申请号：US17749540

    申请日：2022-05-20

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji OTANI ,  Akitomo TAKAHASHI ,  Takaaki SAKAI ,  Takeshi FURUKAWA ,  Tatsuya KITAMURA

    IPC: H01L23/498 ,  H01L49/02

    Abstract: A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for electrical connection with at least one of the voltage regulator and the load, and a through-hole conductor formed to penetrate the capacitor portion in a thickness direction of the capacitor layer. The capacitor is electrically connected to at least one of the load and the voltage regulator with the through-hole conductor interposed between the load and the voltage regulator.

    MULTILAYER CERAMIC CAPACITOR
    19.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20160379758A1

    公开(公告)日：2016-12-29

    申请号：US15173811

    申请日：2016-06-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji OTANI

    IPC: H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/005 ,  H01G4/248

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer ceramic capacitor includes a multilayer body and a pair of outer electrodes on end surfaces of the multilayer body. The multilayer body includes a stack of ceramic layers and inner electrodes electrically connected to the outer electrodes. Each of the pair of outer electrodes includes an underlying electrode layer on a surface of the multilayer body, an intermediate metal layer on a surface of the underlying electrode layer, and a conductive resin layer on a surface of the intermediate metal layer. The underlying electrode layer contains Ni, and the intermediate metal layer contains a Cu—Ni—Sn alloy.

    Abstract translation: 多层陶瓷电容器包括多层体和多层体的端面上的一对外电极。 多层体包括一层陶瓷层和电连接到外电极的内电极。 一对外电极中的每一个包括在多层体的表面上的下面的电极层，在下面的电极层的表面上的中间金属层和在中间金属层的表面上的导电树脂层。 底层电极层含有Ni，中间金属层含有Cu-Ni-Sn合金。

    MULTILAYER CERAMIC CAPACITOR
    20.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权

    公开(公告)号：US20240387106A1

    公开(公告)日：2024-11-21

    申请号：US18786664

    申请日：2024-07-29

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Shinji OTANI ,  Kazuhiko HIGASHIDE ,  Daichi TANIGUCHI

    IPC: H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor includes a multilayer body including a dielectric layer and an inner electrode alternately laminated, first and second main surfaces opposed to each other in a lamination direction, first and second side surfaces opposed to each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and first and second end surfaces opposed to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction, and, on each of the first and second end surfaces, an outer electrode coupled to the inner electrode. The inner electrode includes a main facing portion and a thin portion, a thickness of the thin portion is smaller than a thickness of the main facing portion, and the thin portion extends from an end portion of the main facing portion in the width direction to the first or second side surface.

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