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公开(公告)号：US20160172108A1
公开(公告)日：2016-06-16
申请号：US14677059
申请日：2015-04-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Jun IKEDA , Kota ZENZAI
CPC classification number: H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/2325 , H01G4/248
Abstract: A multilayer ceramic electronic component includes a ceramic element body including internal electrodes and external electrodes electrically connected to respective internal electrodes. Each of the external electrodes includes a sintered metal layer including glass and metal and a conductive resin layer including resin and metal particles. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and L1/L2 is about 0.2 or more and about 1.5 or less, where L1 is a length along the interface at which the glass of the sintered metal layer is exposed at the interface, and L2 is a length along the interface at which the metal of the sintered metal layer is exposed at the interface.
Abstract translation: 多层陶瓷电子部件包括陶瓷元件体，其包括内部电极和与各自的内部电极电连接的外部电极。 每个外部电极包括包括玻璃和金属的烧结金属层和包括树脂和金属颗粒的导电树脂层。 在多层陶瓷电容器的截面中，在烧结金属层与导电性树脂层之间的界面处存在具有内部尺寸大于入口尺寸的形状的凹部，L1 / L2为约0.2以上且约1.5以下，其中，L1是沿着烧结金属层的玻璃在界面露出的界面的长度，L2是沿烧结金属的金属的界面的长度 金属层在界面处露出。
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公开(公告)号：US20160141103A1
公开(公告)日：2016-05-19
申请号：US14669069
申请日：2015-03-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenichi HAMANAKA , Hidetaka SUGIYAMA , Kota ZENZAI
Abstract: A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section including a first interface between the sintered metal layer and the conductive resin layer, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface, and in a cross section including a second interface between the conductive resin layer and the plating layer, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250.
Abstract translation: 多层陶瓷电容器包括其中包括内部电极的陶瓷元件体。 外部电极设置在陶瓷元件主体的端面上，并且电连接到各个内部电极的露出部分。 每个外部电极包括烧结金属层，导电树脂层和镀层。 在包括烧结金属层和导电树脂层之间的第一界面的横截面中，烧结金属层包括多个凹槽，每个凹槽包括沿着第一界面延伸的入口和从第一界面延伸到烧结金属 每个凹部具有内部尺寸大于沿着第一界面测量的入口的尺寸的形状，并且在包括导电树脂层和镀层之间的第二界面的截面中， 在第二界面的大约1mm的长度的一部分中，从导电树脂层露出的多个金属颗粒为50〜250。
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公开(公告)号：US20140375175A1
公开(公告)日：2014-12-25
申请号：US14305096
申请日：2014-06-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenichi HAMANAKA , Kota ZENZAI , Taku DEKURA , Kiyotaka MAEKAWA
IPC: H01G4/005 , H01C7/00 , H01L41/047 , H01G4/30 , H01F27/28
CPC classification number: H01G4/30 , H01C1/148 , H01C7/008 , H01C7/18 , H01C17/288 , H01F17/0013 , H01F27/29 , H01F27/292 , H01G4/232 , H01G4/2325 , H01L41/0472 , H01L41/293 , Y10T29/417 , Y10T29/42 , Y10T29/4902 , Y10T29/49085
Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.
Abstract translation: 陶瓷电子部件包括矩形或大致矩形的平行六面体形状的叠层，其中陶瓷层和内部电极交替堆叠，外部电极设置在堆叠的表面的一部分上并与内部电极电连接。 外部电极包括覆盖堆叠表面的一部分的内部外部电极，并且包括树脂部件和金属部件的混合物以及覆盖内部外部电极并且包括金属部件的外部外部电极。 内部外部电极中的树脂成分占有的体积在规定范围内。
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公开(公告)号：US20250062074A1
公开(公告)日：2025-02-20
申请号：US18932842
申请日：2024-10-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kota ZENZAI
Abstract: An outer electrode includes a glass-free sintered layer containing no glass. A glass-free conductive paste is provided and includes a conductive metal powder and a thermosetting resin, the conductive metal powder including an alloy of tin and at least one of copper and nickel, and the glass-free conductive paste containing no glass. This composition is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to heat treatment at a temperature of about 600° C., higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is subjected to thermal decomposition or combustion and thus little of the thermosetting resin remains, and the conductive metal powder is sintered to form a unified sintered metal body.
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公开(公告)号：US20220293345A1
公开(公告)日：2022-09-15
申请号：US17684556
申请日：2022-03-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenichi HAMANAKA , Kota ZENZAI
Abstract: A conductive paste includes a conductive metal powder and a curable resin. The conductive metal powder includes Ag, Cu, and Ni. In the conductive metal powder, a mass ratio of Ag is about 3.0 wt % or more and about 10.0 wt % or less, a mass ratio of Cu is about {(1−mass ratio of Ag/100)×70} wt % or more and about {(1−mass ratio of Ag/100)×95} wt % or less, and a mass ratio of Ni is about {(1−mass ratio of Ag/100)×5} wt % or more and about {(1−mass ratio of Ag/100)×30} wt % or less.
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Patent Agency Ranking
公开(公告)号：US20170294268A1
公开(公告)日：2017-10-12
申请号：US15484370
申请日：2017-04-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Seiji KATSUTA , Yosuke TERASHITA , Takayoshi YAMAMOTO , Atsushi ISHIDA , Kota ZENZAI
CPC classification number: H01G4/30 , H01G4/012 , H01G4/10 , H01G4/12 , H01G4/1227 , H01G4/1236 , H01G4/232 , H01G4/2325
Abstract: In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.
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公开(公告)号：US20170011853A1
公开(公告)日：2017-01-12
申请号：US15272680
申请日：2016-09-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kota ZENZAI , Hisayoshi OMORI , Takashi KANAYAMA , Kiyoyasu SAKURADA , Naoki SHIMIZU , Seiji KATSUTA , Shinji OTANI
CPC classification number: H01G4/30 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/49002
Abstract: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.
Abstract translation: 陶瓷电子部件包括陶瓷体，内电极，外电极和连接部。 内部电极设置在陶瓷体的内部。 内部电极的端部延伸到陶瓷体的表面。 外部电极设置在陶瓷体的表面上以覆盖内部电极的端部。 外部电极包括树脂和金属。 连接部被配置成从外部电极的内部延伸到陶瓷体的内部。 在设置有外部电极的陶瓷体的表面的一部分中，连接部的在内部电极的延伸方向上延伸约2.4μm以上的长度。
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公开(公告)号：US20240258029A1
公开(公告)日：2024-08-01
申请号：US18629015
申请日：2024-04-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kota ZENZAI
CPC classification number: H01G2/02 , H01G4/2325 , H01G4/248 , H01G4/30
Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated on one another, outer electrode layers on end surfaces of the multilayer body at opposite ends in a longitudinal direction and covering end surface sides of principal surfaces of the multilayer body at opposite ends in a laminating direction and end surface sides of side surfaces at opposite ends with respect to a width direction, and bumps on the end surface sides of one of the principal surfaces of the multilayer body such that the outer electrode layers covering the one principal surface are sandwiched between the bumps and the one principal surface. Each of the bumps includes tin regions, metal regions including copper, and silver regions including silver.
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公开(公告)号：US20240186066A1
公开(公告)日：2024-06-06
申请号：US18441192
申请日：2024-02-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kota ZENZAI
Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass is provided. A glass-free conductive paste including a copper-containing metal powder and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is thermally decomposed or burned and thus the thermosetting resin does not remain, and the metal powder is sintered to form a unified sintered metal body.
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公开(公告)号：US20210375544A1
公开(公告)日：2021-12-02
申请号：US17405063
申请日：2021-08-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kota ZENZAI
Abstract: A method for manufacturing a chip ceramic electronic component that includes an outer electrode including a glass-free sintered layer including no glass is provided. A glass-free conductive paste including a copper-containing metal powder and a thermosetting resin, and not including glass, is applied to cover a portion of a surface of a ceramic body. Then the ceramic body to which the glass-free conductive paste has been applied is subjected to a heat treatment at a temperature higher than or equal to a temperature about 400° C. higher than the curing temperature of the thermosetting resin. By the heat treatment, the thermosetting resin is thermally decomposed or burned and thus the thermosetting resin does not remain, and the metal powder is sintered to form a unified sintered metal body.
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