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    ELECTRONIC COMPONENT
    3.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180042122A1

    公开(公告)日：2018-02-08

    申请号：US15669042

    申请日：2017-08-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masahiro WAKASHIMA ,  Yuta SAITO ,  Kohei SHIMADA ,  Naobumi IKEGAMI

    IPC: H05K3/34 ,  H01G4/12 ,  H01G4/005 ,  H05K1/02 ,  H01G2/06 ,  H05K1/18 ,  H01G4/232

    CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H05K1/0271 ,  H05K1/0295 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10522 ,  Y02P70/611

    Abstract: An electronic component is able to be mounted on a mounting substrate on which a first electronic component and a second electronic component are able to be mounted. When dimensions of the first electronic component and the second electronic component in a width direction is designated as W1 and W2, respectively, and dimensions of the first electronic component and the second electronic component in a length direction are designated as L1 and L2, respectively, dimensions of the electronic component in the width direction and the length direction are any one of combinations of W1 and L2, and of W2 and L1. The electronic component includes a third laminate including a pair of third principal surfaces, a pair of third side surfaces, and a pair of third end surfaces, and a pair of third external electrodes. Each of the pair of third external electrodes includes a fired layer, and a resin layer provided on an external surface of the fired layer. On each of the pair of third principal surfaces and on each of the pair of third side surfaces, a length of the resin layer along the length direction from a corresponding one of the third end surfaces to a leading end of the resin layer is less than a length of the fired layer along the length direction from a corresponding one of the third end surfaces to a leading end of the fired layer.

    MOUNTING SUBSTRATE
    5.
    发明申请
    MOUNTING SUBSTRATE 有权

    公开(公告)号：US20180040428A1

    公开(公告)日：2018-02-08

    申请号：US15669038

    申请日：2017-08-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masahiro WAKASHIMA ,  Yuta SAITO ,  Kohei SHIMADA ,  Naobumi IKEGAMI

    IPC: H01G4/38 ,  H01G4/248 ,  H05K1/18 ,  H01G4/30 ,  H01G4/012

    CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/308 ,  H05K1/0295 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10522

    Abstract: A mounting substrate on which at least any one of three kinds of electronic components including a first electronic component, a second electronic component, and a third electronic component are able to be mounted includes a pair of first edge portions and a pair of second edge portions. When a dimension of the first electronic component in its length direction is designated as L1, a dimension of the first electronic component in its width direction is designated as W1, a dimension of the second electronic component in its length direction is designated as L2, and a dimension of the second electronic component in its width direction is designated as W2, a dimension of the third electronic component in its width direction is any one of W1 and W2, and a dimension of the third electronic component in its length direction is L2 when the dimension of the third electronic component in its width direction is W1, and is L1 when the dimension of the third electronic component in its width direction is W2. At least one or more of the third electronic components are mounted on the mounting substrate.

    MULTILAYER CERAMIC CAPACITOR
    6.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20150162133A1

    公开(公告)日：2015-06-11

    申请号：US14621450

    申请日：2015-02-13

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hiroyuki WADA ,  Kohei SHIMADA ,  Kenji TAKAGI ,  Tomomi KOGA ,  Tomotaka HIRATA ,  Hitoshi NISHIMURA ,  Hiroki AWATA ,  Sui UNO

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/248 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/224 ,  H01G4/248

    Abstract: A multilayer ceramic capacitor includes a ceramic main body including an inner layer portion including third ceramic layers and a plurality of inner electrodes arranged at interfaces between the third ceramic layers, and first and second outer layer portions respectively including first and second ceramic layers, the first and second ceramic layers being arranged vertically so as to sandwich the inner layer portion. The third ceramic layers and the first and second outer layer portions contain a perovskite-type compound represented by ABO3 where A contains one or more of Ba, Sr, and Ca, B contains one or more of Ti, Zr, and Hf, and O represents oxygen) as a main component. Where a rare-earth element concentration (CR) in the third ceramic layers is compared to a rare-earth element concentration (Cr) in outermost layer portions including at least outermost surfaces of the first and second outer layer portions, CR>Cr (inclusive of Cr=0).

    Abstract translation: 多层陶瓷电容器包括陶瓷主体，其包括内层部分，其包括第三陶瓷层和布置在第三陶瓷层之间的界面处的多个内电极以及分别包括第一和第二陶瓷层的第一和第二外层部分， 并且第二陶瓷层垂直布置以夹住内层部分。 第三陶瓷层和第一外层和第二外层部分含有由ABO 3表示的钙钛矿型化合物，其中A含有Ba，Sr和Ca中的一种或多种，​​B包含Ti，Zr和Hf中的一种或多种，​​O 代表氧）作为主要成分。 在将第三陶瓷层中的稀土元素浓度（CR）与至少包含第一和第二外层部分的最外表面的最外层部分中的稀土元素浓度（Cr）进行比较时，CR> Cr（包括 的Cr = 0）。

    MULTILAYER CERAMIC CAPACITOR
    7.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20180268999A1

    公开(公告)日：2018-09-20

    申请号：US15916386

    申请日：2018-03-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kohei SHIMADA ,  Akio MASUNARI ,  Yuta SAITO ,  Shunsuke ABE ,  Tomoo YUGUCHI

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008

    CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor includes a laminate with a rectangular or substantially rectangular parallelepiped shape and including dielectric layers, first internal electrode layers, and second internal electrode layers that are laminated; a first external electrode connected with the first internal electrode layers; and a second external electrode connected with the second internal electrode layers. Each of the first internal electrode layers or the second internal electrode layers has a coverage in a central portion in a W direction that is lower than a coverage within about 30.000 μm from an end portion in the W direction, and has a shifting amount in the W direction of about 0.000 μm or more and about 10.000 μm or less.

    ELECTRONIC COMPONENT
    8.
    发明申请
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180040426A1

    公开(公告)日：2018-02-08

    申请号：US15669044

    申请日：2017-08-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Masahiro WAKASHIMA ,  Yuta SAITO ,  Kohei SHIMADA ,  Naobumi IKEGAMI

    IPC: H01G4/248 ,  H01G4/12 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G4/1245 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  Y02P70/611

    Abstract: An electronic component is able to be mounted on a mounting substrate including a pair of first edge portions that faces each other, and a pair of second edge portions that is perpendicular or substantially perpendicular to the pair of first edge portions and faces each other. The mounting substrate has a structure that allows at least any one of the electronic component, a first electronic component, and a second electronic component, to be mounted thereon. When a dimension of the first electronic component in a length direction is designated as L1, a dimension of the first electronic component in a width direction is designated as W1, a dimension of the second electronic component in the length direction is designated as L2, and a dimension of the second electronic component in the width direction is designated as W2, a dimension of the electronic component in the width direction is any one of W1 and W2. A dimension of the electronic component in the length direction is L2 when the dimension of the electronic component in the width direction is W1, and is L1 when the dimension of the electronic component in the width direction is W2.

    MULTILAYER CERAMIC CAPACITOR
    10.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20160005543A1

    公开(公告)日：2016-01-07

    申请号：US14855571

    申请日：2015-09-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Hiroyuki WADA ,  Kohei SHIMADA ,  Kenji TAKAGI ,  Tomomi KOGA ,  Tomotaka HIRATA ,  Hitoshi NISHIMURA ,  Hiroki AWATA ,  Sui UNO

    IPC: H01G4/30 ,  H05K1/18 ,  H01G4/12 ,  H01G4/242 ,  H05K3/30 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G2/24 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/1245 ,  H01G4/224 ,  H01G4/232 ,  H01G4/242 ,  H01G4/248 ,  H05K1/181 ,  H05K3/30 ,  H05K2201/10015

    Abstract: A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO3. The outer layer portions include first outer layers and second outer layers respectively containing oxides that differ from each other in main constituents, and boundary reaction layers are provided between the first outer layers and the second outer layers. First ceramic dielectric layers outside the boundary reaction layers differ in color from second ceramic dielectric layers inside the boundary reaction layers.

    Abstract translation: 多层陶瓷电容器包括层叠体，其包括包含陶瓷电介质层和内部电极的内层部分和包括陶瓷电介质层的外层部分。 连接到内部电极的外部电极设置在层叠体的两端。 内层部分的主要成分是由ABO 3表示的钙钛矿型化合物。 外层部分包括分别包含主要成分彼此不同的氧化物的第一外层和第二外层，并且边界反应层设置在第一外层和第二外层之间。 边界反应层之外的第一陶瓷电介质层的颜色与边界反应层内部的第二陶瓷介电层的颜色不同。

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