公开(公告)号：US09552925B2

公开(公告)日：2017-01-24

申请号：US14712008

申请日：2015-05-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akio Masunari ,  Taisuke Kanzaki

IPC: H01G4/12 ,  H01G4/232 ,  H01G4/008 ,  H01G4/30

CPC classification number: H01G4/1227 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/2325 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes a ceramic body, and external electrodes on opposite side surfaces of the ceramic body. The ceramic body includes an inner layer portion including a plurality of ceramic layers, and first and second internal electrodes each arranged at interfaces between the ceramic layers defining the inner layer portion, and also includes outer layer portions arranged on an upper surface and a lower surface of the inner layer portion. The ceramic layers defining the inner layer portion include as a main component a perovskite-type compound containing Ba and Ti. The amount of Mg contained in the ceramic layers defining the inner layer portion preferably is 0 to about 0.4 part by mole per 100 parts by mole of Ti, for example. The thickness of the ceramic layers defining the inner layer portion preferably is not more than about 0.55 μm, for example.

Abstract translation: 多层陶瓷电容器包括陶瓷体和在陶瓷体的相对侧表面上的外部电极。 陶瓷体包括包含多个陶瓷层的内层部分，以及分别设置在限定内层部分的陶瓷层之间的界面处的第一和第二内部电极，还包括布置在上表面和下表面上的外层部分 的内层部分。 限定内层部分的陶瓷层包括作为主要成分的包含Ba和Ti的钙钛矿型化合物。 限定内层部分的陶瓷层中所含的Mg的量优选例如相对于每100份摩尔Ti为0〜约0.4份摩尔。 限定内层部分的陶瓷层的厚度优选不超过例如约0.55μm。

公开(公告)号：US09275797B2

公开(公告)日：2016-03-01

申请号：US14011499

申请日：2013-08-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shoichiro Suzuki ,  Koichi Banno ,  Akihiro Shiota ,  Masahiro Otsuka ,  Taisuke Kanzaki ,  Masanori Nakamura

IPC: H01G4/12 ,  H01B3/12 ,  C04B35/468 ,  C04B35/626 ,  C04B35/638 ,  H01G4/30 ,  B82Y30/00

CPC classification number: H01G4/1227 ,  B82Y30/00 ,  C04B35/4682 ,  C04B35/62675 ,  C04B35/62685 ,  C04B35/638 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/44 ,  C04B2235/5454 ,  C04B2235/781 ,  C04B2235/785 ,  H01B3/12 ,  H01G4/1236 ,  H01G4/30

Abstract: A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodes 8 and 9 on outer surfaces of the multilayer body. The composition of the multilayer body includes a perovskite-type compound containing Ba and Ti (where a part of Ba may be substituted by Ca, and a part of Ti may be substituted by Zr) as a primary ingredient, and further includes M (where M is at least one of Cu, Zn, Li, K, and Na) and Bi. The total content of M and Bi is equal to or greater than 3 molar parts when the total content of Ti and Zr is 100 molar parts. The crystal particle size of the dielectric ceramic is 30 nm or more and 150 nm or less.

Abstract translation: 提供可以在足够低的温度下烧结并且在高温下具有所需电阻率的电介质陶瓷，以及使用电介质陶瓷的多层陶瓷电子部件（多层陶瓷电容器等）。 多层陶瓷电容器包括具有多个层压电介质陶瓷层的多层体和在介电陶瓷层之间的界面处的多个内部电极; 以及在多层体的外表面上的外部电极8和9。 多层体的组成包括含有Ba和Ti（其中Ba的一部分可以被Ca取代，Ti的一部分可以被Zr取代）的钙钛矿型化合物作为主要成分，并且还包括M（其中 M是Cu，Zn，Li，K和Na中的至少一种）和Bi。 当Ti和Zr的总含量为100摩尔份数时，M和Bi的总含量等于或大于3摩尔份。 电介质陶瓷的结晶粒径为30nm以上且150nm以下。

公开(公告)号：US09064638B2

公开(公告)日：2015-06-23

申请号：US13803925

申请日：2013-03-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shoichiro Suzuki ,  Masanori Nakamura ,  Koichi Banno ,  Taisuke Kanzaki ,  Akihiro Shiota ,  Masahiro Otsuka

IPC: C04B35/468 ,  H01G4/06 ,  H01G4/30 ,  C04B35/49 ,  H01B3/12 ,  H01G4/12 ,  H01G4/00 ,  C04B35/626 ,  C01G25/00 ,  C01G29/00

CPC classification number: H01G4/30 ,  C01G25/006 ,  C01G29/006 ,  C04B35/468 ,  C04B35/4682 ,  C04B35/49 ,  C04B35/62685 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3248 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/6562 ,  C04B2235/768 ,  C04B2235/79 ,  H01B3/12 ,  H01G4/00 ,  H01G4/1227

Abstract: A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba1-x-yCaxSry)m(Ti1-zZrz)O3 (1.005≦m≦1.2, 0≦x+y≦0.2, and 0≦z≦0.2) as a major component and an amount of Bi relative to 100 parts by mol of the major component which is 1.0 part by mol or more and 40 parts by mol or less.

Abstract translation: 提供能够进行低温烧制并且具有良好的介电特性的电介质陶瓷，以及使用其的叠层陶瓷电子元件。 含有（Ba1-x-yCaxSry）m（Ti1-zZrz）O3（1.005＆nlE; m＆nlE; 1.2,0＆nlE; x + y＆nlE; 0.2和0＆amp; nlE; z＆nlE; 0.2）的介电陶瓷作为主要成分， 相对于100份（摩尔）为1.0份摩尔以上且40份（摩尔）以下的主成分。

公开(公告)号：US12249462B2

公开(公告)日：2025-03-11

申请号：US18422421

申请日：2024-01-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taisuke Kanzaki ,  Kosuke Onishi ,  Akitaka Doi

IPC: H01G4/248 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

公开(公告)号：US12100558B2

公开(公告)日：2024-09-24

申请号：US18121042

申请日：2023-03-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taisuke Kanzaki ,  Kosuke Onishi

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/232

Abstract: A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.

公开(公告)号：US11915877B2

公开(公告)日：2024-02-27

申请号：US18124019

申请日：2023-03-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taisuke Kanzaki ,  Kosuke Onishi ,  Akitaka Doi

IPC: H01G4/248 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/248 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

公开(公告)号：US11636982B2

公开(公告)日：2023-04-25

申请号：US17205067

申请日：2021-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taisuke Kanzaki ,  Kosuke Onishi

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer to extend from a surface layer of the underlying electrode layer to an interface of the multilayer body, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other, an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other, and an interface between the metal component included in the underlying electrode layer and the multilayer body.

公开(公告)号：US09478358B2

公开(公告)日：2016-10-25

申请号：US14732849

申请日：2015-06-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Taisuke Kanzaki ,  Akio Masunari

IPC: C04B35/468 ,  H01G4/30 ,  H01G4/008 ,  B32B18/00 ,  C04B35/638 ,  H01G4/12

CPC classification number: H01G4/30 ,  B32B18/00 ,  C04B35/4682 ,  C04B35/638 ,  C04B2235/3206 ,  C04B2235/3224 ,  C04B2235/3239 ,  C04B2235/3267 ,  C04B2235/3418 ,  C04B2235/6021 ,  C04B2235/6562 ,  C04B2237/06 ,  C04B2237/12 ,  C04B2237/346 ,  C04B2237/704 ,  H01G4/0085 ,  H01G4/1227 ,  H01G4/1263

Abstract: A multilayer ceramic capacitor that includes dielectric layers made mainly of a perovskite compound containing Ba and Ti and optionally Zr and Hf, and inner electrodes having an average thickness of approximately 0.5 μm or less. The Mg content of the dielectric layers is approximately in the range of 0≦Mg≦0.4 (parts by mole) based on a total of 100 parts by mole of Ti, Zr, and Hf. The proportion of Mg-containing defects in the inner electrodes is approximately 20% or more.

Abstract translation: 一种多层陶瓷电容器，其包括主要由含有Ba和Ti的钙钛矿化合物和任选的Zr和Hf构成的电介质层，以及平均厚度为约0.5μm或更小的内部电极。 介电层的Mg含量相对于Ti，Zr，Hf总计为100份摩尔，大致在0≤Mg≤0.4（摩尔比）的范围内。 内部电极中含Mg缺陷的比例约为20％以上。

公开(公告)号：US09202626B2

公开(公告)日：2015-12-01

申请号：US14031198

申请日：2013-09-19

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shoichiro Suzuki ,  Koichi Banno ,  Taisuke Kanzaki ,  Akihiro Shiota

IPC: H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  C04B35/475 ,  C04B35/495 ,  C04B35/626 ,  C04B35/453 ,  C04B35/64

CPC classification number: H01G4/1209 ,  C04B35/453 ,  C04B35/475 ,  C04B35/495 ,  C04B35/62685 ,  C04B35/64 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3251 ,  C04B2235/3255 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

Abstract: Provided in a dielectric ceramic having flat capacitance characteristics and a high dielectric constant, and a multilayer ceramic electronic component (such as a multilayer ceramic capacitor) in which the dielectric ceramic is used. A multilayer ceramic capacitor includes a multilayer body having a plurality of dielectric ceramic layers and a plurality of internal electrodes, and external electrodes formed on the multilayer body. The composition of the multilayer body includes any of a bismuth layered compound containing Sr, Bi and Ti, a bismuth layered compound containing Sr, Bi and Nb, and a bismuth layered compound containing Ca, Bi and Ti as a primary ingredient, Bi and at least one of Cu, Ba, Zn and Li, and satisfies the conditions that if the Ti content is 400 molar parts or the Nb content is 200 molar parts, then (Bi content-Ti content) or (Bi content-Nb content) is equal to or greater than 1 molar part and less than 7.5 molar parts and the total content of Cu, Ba, Zn and Li is equal to or greater than 1 molar part and less than 10 molar parts.

Abstract translation: 提供在具有平坦电容特性和高介电常数的介电陶瓷中，以及使用电介质陶瓷的多层陶瓷电子部件（例如多层陶瓷电容器）。 多层陶瓷电容器包括具有多个介电陶瓷层和多个内部电极的多层体，以及形成在多层体上的外部电极。 多层体的组成包括含有Sr，Bi和Ti的铋层状化合物，含有Sr，Bi和Nb的铋层状化合物和含有Ca，Bi和Ti作为主要成分的铋层状化合物，Bi和 Cu，Ba，Zn和Li中的至少一种，并且满足如果Ti含量为400摩尔份或Nb含量为200摩尔份，则（Bi含量-Ti含量）或（Bi含量-Tb含量）为 等于或大于1摩尔份且小于7.5摩尔份，Cu，Ba，Zn和Li的总含量等于或大于1摩尔份且小于10摩尔份。

公开(公告)号：US20130342958A1

公开(公告)日：2013-12-26

申请号：US14011499

申请日：2013-08-27

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shoichiro Suzuki ,  Koichi Banno ,  Akihiro Shiota ,  Masahiro Otsuka ,  Taisuke Kanzaki ,  Masanori Nakamura

IPC: H01G4/12 ,  H01G4/30 ,  H01B3/12

CPC classification number: H01G4/1227 ,  B82Y30/00 ,  C04B35/4682 ,  C04B35/62675 ,  C04B35/62685 ,  C04B35/638 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/44 ,  C04B2235/5454 ,  C04B2235/781 ,  C04B2235/785 ,  H01B3/12 ,  H01G4/1236 ,  H01G4/30

Abstract: A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodes 8 and 9 on outer surfaces of the multilayer body. The composition of the multilayer body includes a perovskite-type compound containing Ba and Ti (where a part of Ba may be substituted by Ca, and a part of Ti may be substituted by Zr) as a primary ingredient, and further includes M (where M is at least one of Cu, Zn, Li, K, and Na) and Bi. The total content of M and Bi is equal to or greater than 3 molar parts when the total content of Ti and Zr is 100 molar parts. The crystal particle size of the dielectric ceramic is 30 nm or more and 150 nm or less.

Abstract translation: 提供可以在足够低的温度下烧结并且在高温下具有所需电阻率的电介质陶瓷，以及使用电介质陶瓷的多层陶瓷电子部件（多层陶瓷电容器等）。 多层陶瓷电容器包括具有多个层压电介质陶瓷层的多层体和在介电陶瓷层之间的界面处的多个内部电极; 以及在多层体的外表面上的外部电极8和9。 多层体的组成包括含有Ba和Ti（其中Ba的一部分可以被Ca取代，Ti的一部分可以被Zr取代）的钙钛矿型化合物作为主要成分，并且还包括M（其中 M是Cu，Zn，Li，K和Na中的至少一种）和Bi。 当Ti和Zr的总含量为100摩尔份数时，M和Bi的总含量等于或大于3摩尔份。 电介质陶瓷的结晶粒径为30nm以上且150nm以下。