公开(公告)号：US20090152121A1

公开(公告)日：2009-06-18

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： C25D5/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US20090114433A1

公开(公告)日：2009-05-07

申请号：US12264869

申请日：2008-11-04

申请人： Min Ji KO ,  Eun Tae Park ,  Yong Seok Choi ,  Soo Hyun Lyoo

发明人： Min Ji KO ,  Eun Tae Park ,  Yong Seok Choi ,  Soo Hyun Lyoo

IPC分类号： H05K1/02 ,  H05K3/00

CPC分类号： H05K3/4688 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/38 ,  H05K3/4629 ,  Y10T29/49124

摘要： There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with a predetermined amount of alumina powder; and an external layer having at least one second dielectric sheet laminated on the surface of the internal layer, the second dielectric sheet prepared by mixing glass powder with alumina powder in a smaller amount than the first dielectric sheet, wherein via hole conductors and internal electrodes provided in the internal layer are electrically connected to a surface electrode provided on the surface of the external layer, and the internal layer, the external layer, the via hole conductors, the internal layer, and the surface electrode are fired at a predetermined temperature.

摘要翻译： 提供了一种多层陶瓷板及其制造方法。 根据本发明的一个方面的多层陶瓷板可以包括：层叠多个第一电介质片的内层，通过将玻璃粉与预定量的氧化铝粉末混合而制备的每个第一电介质片; 以及外部层，其具有层叠在所述内层的表面上的至少一个第二电介质片，所述第二电介质片通过将玻璃粉末与比所述第一电介质片材更少量的氧化铝粉末混合而制备，其中设置有通孔导体和内部电极 在内层中电连接到设置在外层表面上的表面电极，内部层，外层，通孔导体，内层和表面电极在预定温度下烧制。

公开(公告)号：US07871482B2

公开(公告)日：2011-01-18

申请号：US12476538

申请日：2009-06-02

申请人： Yong Seok Choi ,  Seung Gyo Jeong ,  Eun Tae Park ,  Ki Pyo Hong ,  Soo Hyun Lyoo

发明人： Yong Seok Choi ,  Seung Gyo Jeong ,  Eun Tae Park ,  Ki Pyo Hong ,  Soo Hyun Lyoo

IPC分类号： C03B29/00 ,  B23B33/00 ,  A63B39/00 ,  B29C65/00 ,  B65C9/25

CPC分类号： B32B18/00 ,  C04B35/634 ,  C04B37/005 ,  C04B2235/36 ,  C04B2237/10 ,  C04B2237/341 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/595 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  H01G4/105 ,  H01G4/232 ,  H01G4/30 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2203/061 ,  Y10T156/1089

摘要： Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.

摘要翻译： 公开了一种制造多层陶瓷基板的方法。 该方法包括提供多个陶瓷块，每个陶瓷块包括具有第一表面和第二表面的陶瓷层压体，并且具有包含玻璃陶瓷部件的多个陶瓷生片的层叠结构，以及第一粘合陶瓷生片， 玻璃组分，并且设置在陶瓷层压体的第一和第二表面的与另一陶瓷层压体接触的表面上，烧制多个陶瓷块，层叠多个烧制的陶瓷块，使得第一粘合陶瓷生片 相邻的陶瓷块彼此面对，并且使用第一接合陶瓷生片的玻璃成分接合多个陶瓷块。

公开(公告)号：US08147633B2

公开(公告)日：2012-04-03

申请号：US13175813

申请日：2011-07-01

申请人： Soo Hyun Lyoo ,  Yong Seok Choi

发明人： Soo Hyun Lyoo ,  Yong Seok Choi

IPC分类号： C03C29/00 ,  C03C1/00

CPC分类号： B32B18/00 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2237/343 ,  C04B2237/56 ,  C04B2237/588 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01G4/129 ,  H01G4/30 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24926 ,  Y10T428/2495 ,  Y10T428/252

摘要： There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.

摘要翻译： 提供了制造陶瓷烧结体的方法。 根据本发明的一个方面的陶瓷烧结体的制造方法可以包括：制备至少一个具有第一陶瓷颗粒和玻璃颗粒的陶瓷片; 制备具有比玻璃颗粒和第一陶瓷颗粒小的粒径的第二陶瓷颗粒的至少一个约束片; 通过在陶瓷片和约束片彼此接触的同时交替陶瓷片和约束片形成陶瓷层压体; 并且烧结陶瓷层压体，使得当陶瓷片烧结时，不与第一陶瓷颗粒反应的组分从玻璃颗粒移动到约束片中以烧结约束片。

公开(公告)号：US20110277912A1

公开(公告)日：2011-11-17

申请号：US13175813

申请日：2011-07-01

申请人： Soo Hyun Lyoo ,  Yong Seok Choi

发明人： Soo Hyun Lyoo ,  Yong Seok Choi

IPC分类号： C04B37/00

CPC分类号： B32B18/00 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2237/343 ,  C04B2237/56 ,  C04B2237/588 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01G4/129 ,  H01G4/30 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24926 ,  Y10T428/2495 ,  Y10T428/252

摘要： There are provided a method of manufacturing a ceramic sintered body. A method of manufacturing a ceramic sintered body according to one aspect of the invention may include: preparing at least one ceramic sheet having first ceramic particles and glass particles; preparing at least one constraining sheet having second ceramic particles having a smaller particle size than the glass particles and the first ceramic particles; forming a ceramic laminate by alternating the ceramic sheet and the constraining sheet while the ceramic sheet and the constraining sheet are in contact with each other; and sintering the ceramic laminate so that components, which do not react with the first ceramic particles, from the glass particle are moved into the constraining sheet to sinter the constraining sheet when the ceramic sheet is sintered.

摘要翻译： 提供了制造陶瓷烧结体的方法。 根据本发明的一个方面的陶瓷烧结体的制造方法可以包括：制备至少一个具有第一陶瓷颗粒和玻璃颗粒的陶瓷片; 制备具有比玻璃颗粒和第一陶瓷颗粒小的粒径的第二陶瓷颗粒的至少一个约束片; 通过在陶瓷片和约束片彼此接触的同时交替陶瓷片和约束片形成陶瓷层压体; 并且烧结陶瓷层压体，使得当陶瓷片烧结时，不与第一陶瓷颗粒反应的组分从玻璃颗粒移动到约束片中以烧结约束片。

公开(公告)号：US07886436B2

公开(公告)日：2011-02-15

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K3/10

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07675756B2

公开(公告)日：2010-03-09

申请号：US11593088

申请日：2006-11-06

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。