公开(公告)号：US20090152121A1

公开(公告)日：2009-06-18

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok MOON ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： C25D5/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07886436B2

公开(公告)日：2011-02-15

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K3/10

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07675756B2

公开(公告)日：2010-03-09

申请号：US11593088

申请日：2006-11-06

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07737529B2

公开(公告)日：2010-06-15

申请号：US11582954

申请日：2006-10-19

申请人： Jin Seok Moon ,  Seung Eun Lee ,  Hyung Mi Jung ,  Yul Kyo Chung ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Seung Eun Lee ,  Hyung Mi Jung ,  Yul Kyo Chung ,  Seung Hyun Sohn

IPC分类号： H01L29/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179

摘要： The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.

摘要翻译： 本发明提供一种其中嵌有薄膜电容器的PCB及其制造方法。 PCB包括形成在绝缘基板上的下电极; 通过低温成膜形成在下电极上的非晶顺电膜; 形成在所述非晶正电介质膜上的缓冲层; 形成在缓冲层上的金属种子层; 以及形成在金属籽晶层上的上电极。

公开(公告)号：US20120017435A1

公开(公告)日：2012-01-26

申请号：US13200983

申请日：2011-10-06

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： A method of manufacturing a PCB having electronic components embedded therein, including: preparing a copper foil layer including a thin copper foil coated with a resin layer; fixing electronic components onto the resin layer; forming a core layer in which the electronic components are embedded; forming internal layer circuits which are electrically connected to the electronic components; forming an insulating layer on the internal layer circuits; and forming external layer circuits on the insulating layer such that the external layer circuits are electrically connected to the internal layer circuits.

摘要翻译： 一种制造其中嵌有电子元件的PCB的方法，包括：制备包括涂覆有树脂层的薄铜箔的铜箔层; 将电子部件固定到树脂层上; 形成其中嵌入有电子部件的芯层; 形成电连接到所述电子部件的内层电路; 在内层电路上形成绝缘层; 以及在所述绝缘层上形成外层电路，使得所述外层电路电连接到所述内层电路。

公开(公告)号：US20110034606A1

公开(公告)日：2011-02-10

申请号：US12906540

申请日：2010-10-18

申请人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

发明人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

IPC分类号： C08K3/22

CPC分类号： H05K1/162 ,  H01G4/206 ,  H01L2924/0002 ,  H05K2201/0209 ,  H01L2924/00

摘要： Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature.

摘要翻译： 本文公开了一种具有小的电容变化与温度的复合电介质组合物，其包括表现出电容与温度的正或负变化的聚合物基体和陶瓷填料的组合，所述陶瓷填料表现出与温度成反比的电容的负或正变化 与聚合物基体的相同; 以及通过使用相同组成制备的信号匹配嵌入式电容器。 特别地，本发明提供一种复合电介质组合物，其包含显示电容与温度的正或负变化的聚合物基质和表现出与聚合物基体相反的电容变化的陶瓷填料; 以及具有相同组成并且具有不大于5％的电容与温度变化的信号匹配嵌入式电容器，并且Dgr; C / C×100（％）。 本发明的复合电介质组合物由于电容随温度的变化小而可用于制备信号匹配嵌入式电容器。

公开(公告)号：US20080158777A1

公开(公告)日：2008-07-03

申请号：US11979770

申请日：2007-11-08

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Seung Eun Lee ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Seung Eun Lee ,  Yee Na Shin

IPC分类号： H01G4/06 ,  H01G4/00

CPC分类号： H05K1/162 ,  H01G4/232 ,  H01G4/30 ,  H01G4/33 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09781

摘要： There are provided a capacitor and a thin film capacitor-embedded multi-layer wiring board. The capacitor includes: first and second electrodes connected to first and second polarities; a dielectric layer formed therebetween; and at least one floating electrode disposed inside the dielectric layer and having overlaps with the first and second electrodes. The wiring board includes: an insulating body having a plurality of insulating layers thereon; a plurality of conductive patterns and conductive vias formed on the insulating layers, respectively, to constitute an interlayer circuit; and a thin film capacitor embedded in the insulating body, wherein the thin film capacitor includes a first electrode layer, a first dielectric layer, at least one floating electrode layer, a second dielectric layer and a second electrode layer sequentially formed, and wherein the first and second electrode layers are connected to the interlayer circuit and the floating electrode layer is not directly connected thereto.

摘要翻译： 提供电容器和薄膜电容器嵌入式多层布线板。 电容器包括：连接到第一和第二极性的第一和第二电极; 在它们之间形成介电层; 以及至少一个浮置电极，其布置在电介质层的内部并与第一和第二电极重叠。 布线板包括：绝缘体，其上具有多个绝缘层; 分别形成在绝缘层上的多个导电图案和导电通孔，以构成层间电路; 以及嵌入在所述绝缘体中的薄膜电容器，其中所述薄膜电容器包括依次形成的第一电极层，第一电介质层，至少一个浮置电极层，第二电介质层和第二电极层，并且其中所述第一电极层 并且第二电极层连接到层间电路，并且浮动电极层不直接连接到其上。

公开(公告)号：US20090277673A1

公开(公告)日：2009-11-12

申请号：US12215414

申请日：2008-06-27

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Byoung Chan Kim ,  Moon Il Kim ,  Kwan Kyu Kim ,  Yee Na Shin

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/025 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/063 ,  H05K2203/1152 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/4913 ,  H01L2924/00

摘要： Provided is a PCB having electronic components embedded therein, the PCB including a core layer having electronic components embedded therein and a resin layer formed thereon and thereunder; internal layer circuits formed on the resin layer and being electrically connected to the electronic components; an insulating layer formed on the internal layer circuits; and external layer circuits formed on the insulating layer and being electrically connected to the internal layer circuits.

摘要翻译： 本发明提供一种嵌入其中的电子部件的PCB，该PCB包括嵌入其中的电子部件的芯层和在其上形成的树脂层。 形成在树脂层上并与电子部件电连接的内层电路; 形成在所述内层电路上的绝缘层; 以及形成在绝缘层上并与内部层电路电连接的外部层电路。

公开(公告)号：US20080100986A1

公开(公告)日：2008-05-01

申请号：US11907563

申请日：2007-10-15

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Sung Taek Lim ,  Hyung Mi Jung

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Sung Taek Lim ,  Hyung Mi Jung

IPC分类号： H01G4/00 ,  H01L21/20

CPC分类号： H01G4/33 ,  H01G4/228 ,  H05K1/162 ,  H05K3/388 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0179 ,  H05K2201/035 ,  H05K2201/09509 ,  H05K2201/09763

摘要： Provided is a method of manufacturing a capacitor embedded printed circuit board. In the method, a laminated body is prepared, including a laminated plate having first and second copper films on both sides thereof, where at least one bottom electrode is provided on at least one side. A dielectric layer is formed on the at least one bottom electrode. A metal layer is formed on a top surface of the dielectric layer where a capacitor is to be formed. A conductive paste layer is formed on at least one region of a top surface of the metal layer, where the conductive paste layer and the metal layer is provided as a top electrode. An insulation resin layers are formed on both sides of the laminated plate, respectively. A conductive via is formed in the insulation resin layer such that it is connected to the conductive paste layer.

摘要翻译： 提供一种制造电容器嵌入式印刷电路板的方法。 在该方法中，制备层压体，其包括其两侧具有第一和第二铜膜的层压板，其中在至少一侧上设置有至少一个底部电极。 在所述至少一个底部电极上形成介电层。 在要形成电容器的电介质层的顶表面上形成金属层。 在金属层的顶表面的至少一个区域上形成导电浆料层，其中导电浆料层和金属层设置为顶部电极。 绝缘树脂层分别形成在层压板的两侧。 导电通孔形成在绝缘树脂层中，使其与导电糊层连接。

公开(公告)号：US07293356B2

公开(公告)日：2007-11-13

申请号：US11325557

申请日：2006-01-03

申请人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Hyun Ju Jin ,  Eun Tae Park

发明人： Seung Hyun Sohn ,  Yul Kyo Chung ,  Hyun Ju Jin ,  Eun Tae Park

IPC分类号： H01K3/10

CPC分类号： H05K1/162 ,  H05K3/025 ,  H05K3/381 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/09309 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

摘要翻译： 本发明涉及一种制造具有嵌入式多层无源器件的印刷电路板的方法，特别涉及一种制造具有嵌入式多层电容器的印刷电路板的方法，其中形成电容器以具有多个 PCB中的层增加电容。