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公开(公告)号：US12095014B2
公开(公告)日：2024-09-17
申请号：US17512489
申请日：2021-10-27
Applicant: NICHIA CORPORATION
Inventor： Toru Hashimoto
CPC classification number: H01L33/58 , H01L27/153 , H01L33/005 , H01L33/62
Abstract: A light-emitting device includes: a light-emitting element having an upper surface, a lower surface opposite to the upper surface, and lateral surfaces between the upper surface and the lower surface; a plurality of electrodes electrically connected to the light-emitting element and disposed on the lower surface of the light-emitting element; and a resin member covering the upper surface, the lower surface, and the lateral surfaces of the light-emitting element, the resin member having an upper surface, a lower surface opposite to the upper surface, and lateral surfaces between the upper surface and the lower surface. A portion of each of the electrodes is exposed at the lower surface of the resin member. A plurality of grooves are defined in the lower surface of the resin member, each of the grooves extending from a position apart from the electrode to an outer edge of the lower surface of the resin member.
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公开(公告)号：US11480319B2
公开(公告)日：2022-10-25
申请号：US17169094
申请日：2021-02-05
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Toru Hashimoto , Keiji Emura
IPC: F21V14/06 , F21V5/04 , G02F1/13357 , G02F1/1335 , F21V8/00 , F21V9/08 , F21V13/14 , F21Y105/16
Abstract: A light emitting module includes: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole that, in a schematic top view, is located between the sectioning groove and the light source placement part; and a light source located in the light source placement part. A refractive index of an inside of the light adjusting hole is lower than a refractive index of the light guide member. In the schematic top view, the light adjusting hole is not positioned on a first straight line connecting a center of the light source and a farthest point in the sectioning groove, the farthest point being farthest from the center of the light source.
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13.发明授权公开(公告)号：US11411133B2
公开(公告)日：2022-08-09
申请号：US16683956
申请日：2019-11-14
Applicant: NICHIA CORPORATION
Inventor： Toru Hashimoto , Masato Aihara
IPC: H01L21/00 , H01L33/00 , H01L33/60 , H01L25/075 , H01L33/62
Abstract: A method of manufacturing a light-emitting device includes: providing an intermediate structure including: layered bodies in a light-reflective member, a semiconductor layered body, and a light-transmissive member; forming at least one first groove at a first surface of the intermediate structure; forming at least one electrically conductive film, each disposed on the first surface and inside a respective one of the at least one first groove; exposing a portion of the light-reflective member in an inter-electrode region; forming a hole having a width equal to or greater than a width of the at least one first groove and having a depth equal to or greater than a depth of the at least one first groove; and cutting the light-reflective member and the at least one electrically conductive film along the at least one first groove to obtain a plurality of light-emitting devices.
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公开(公告)号：US11342314B2
公开(公告)日：2022-05-24
申请号：US17151904
申请日：2021-01-19
Applicant: NICHIA CORPORATION
Inventor： Daisuke Kasai , Tadao Hayashi , Toru Hashimoto
IPC: H01L25/075 , H01L33/60 , H01L33/50 , F21V8/00
Abstract: A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.
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公开(公告)号：US11201258B2
公开(公告)日：2021-12-14
申请号：US16684011
申请日：2019-11-14
Applicant: NICHIA CORPORATION
Inventor： Tadaaki Ikeda , Toru Hashimoto
Abstract: A method for manufacturing a light emitting device includes: providing an intermediate structure including first and second layered structures arranged in a first direction in a light reflecting member, wherein each of the layered structures includes a first and second electrodes arranged in a second direction, and wherein the intermediate structure has a first surface at which the first and second electrodes are exposed; on the first surface, forming a first hole in the light reflecting member between the first electrodes as viewed in the second direction; on the first surface, forming a second hole in the light reflecting member between the second electrodes as viewed in the second direction; forming a conductive film on exposed surfaces of the first and second electrodes, and in the first and second holes; and severing the light reflecting member and the conductive film at positions that pass through the first and second holes.
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Patent Agency Ranking
公开(公告)号：US11073725B2
公开(公告)日：2021-07-27
申请号：US16365012
申请日：2019-03-26
Applicant: NICHIA CORPORATION
Inventor： Toru Hashimoto
IPC: G02F1/13357 , H01L25/075 , H01L33/36 , H01L33/50 , H01L33/56 , H01L33/62 , H01L33/58 , H01L33/32 , F21V8/00 , G02F1/1335
Abstract: The method of manufacturing a light emitting module includes: providing a light guiding plate having a first main surface serving as a light emitting surface; and a second main surface positioned opposite to the first main surface and provided with a recess; providing a light adjustment portion containing a fluorescent material; providing a light emitting element unit in which a light emitting element comprising an electrode is integrally bonded to the light adjustment portion; bonding the light adjustment portion of the light emitting element unit to the recess; and forming wiring on the electrode of the light emitting element.
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公开(公告)号：US11038084B2
公开(公告)日：2021-06-15
申请号：US16526263
申请日：2019-07-30
Applicant: NICHIA CORPORATION
Inventor： Toru Hashimoto , Takuya Nakabayashi
Abstract: A light-emitting device includes a first light-emitting element, a second light-emitting element having a peak emission wavelength different from that of the first light-emitting element, a light-guide member covering a light extracting surface and lateral surfaces of the first light-emitting element and a light extracting surface and lateral surfaces of the second light-emitting element, and a wavelength conversion layer continuously covering the light extracting surface of each of the first and second light-emitting elements and disposed apart from each of the first and second light-emitting elements, and a first reflective member covering outer lateral surfaces of the light-guide member. An angle defined by an active layer of the first light-emitting element and an active layer of the second light-emitting element is less than 180° at a wavelength conversion layer side.
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公开(公告)号：US10930624B2
公开(公告)日：2021-02-23
申请号：US16529309
申请日：2019-08-01
Applicant: NICHIA CORPORATION
Inventor： Daisuke Kasai , Tadao Hayashi , Toru Hashimoto
IPC: H01L25/075 , H01L33/60 , H01L33/50 , F21V8/00
Abstract: A light-emitting module includes a light-emitting element unit including a light-emitting element, a light-transmissive member covering a main light-emitting surface of the light-emitting element, and a first light-reflective member covering lateral surfaces of the light-emitting element; a light-transmissive light-guiding plate having a first main surface and a second main surface having a recess accommodating the light-emitting element unit; a second light-reflective member covering the second main surface and the light-emitting element unit; and a light-transmissive bonding member disposed in contact with inner lateral surfaces of the recess and outer lateral surfaces of the light-emitting element unit. At least a portion of the first light-reflective member is located outside the recess in a cross-sectional view, and is in contact with the light-transmissive bonding member. The light-transmissive bonding member has an inclined surface forming an acute angle with a corresponding outer lateral surface of the first light-reflective member.
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公开(公告)号：US10700248B2
公开(公告)日：2020-06-30
申请号：US16545770
申请日：2019-08-20
Applicant: NICHIA CORPORATION
Inventor： Tadaaki Ikeda , Toru Hashimoto
Abstract: A light emitting device includes: a rectangular substrate, a light emitting element, a reflective member disposed at one or more lateral sides of the light emitting element while being away from therefrom, a light guide member, and a light transmissive member on the light guide member. The reflective member includes one or more first reflective members opposing lateral faces of the light emitting element, and a second reflective member outside the first reflective member. The first reflective members have inner lateral faces opposing each other each having an oblique or curved portion slanted so that a distance therebetween increases towards the light transmissive member from a side close to the substrate. The second reflective member covers outer lateral faces of the light transmissive member and the first reflective members, and an upper face of the second reflective member is flush with an upper face of the light transmissive member.
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公开(公告)号：US10026873B2
公开(公告)日：2018-07-17
申请号：US15827070
申请日：2017-11-30
Applicant: NICHIA CORPORATION
Inventor： Toru Hashimoto
Abstract: A method of manufacturing a light emitting device includes: mounting at least one light emitting element on a support member with a first surface of the light emitting element facing upward; applying an adhesive to the first surface of the light emitting element by holding the support member and dipping the first surface of the light emitting element in the adhesive; and disposing a light-transmissive member on the first surface of the light emitting element via the adhesive.
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