公开(公告)号：US20170069677A1

公开(公告)日：2017-03-09

申请号：US15270367

申请日：2016-09-20

申请人： NIKON CORPORATION

发明人： Osamu SARUWATARI ,  Shigeru AOKI ,  Kazuya OKAMOTO ,  Isao SUGAYA ,  Masashi OKADA ,  Hiroshi OHKI

IPC分类号： H01L27/146 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L27/14634 ,  G01S7/4863 ,  G01S7/4876 ,  G01S7/4914 ,  G01S7/493 ,  G01S17/89 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L25/50 ,  H01L27/14643 ,  H01L31/10 ,  H01L2924/0002 ,  H04N5/3745 ,  H01L2924/00

摘要： A detector comprises a plurality of photoelectric converters to output an electrical signal corresponding to an incident light, and a plurality of filter circuits provided corresponding to each of the plurality of photoelectric converters or to each of a plurality of element groups respectively including a predetermined number of the photoelectric converters of the plurality of photoelectric converters, the plurality of filter circuits attenuating a signal having a predetermined frequency from the electrical signal output from the plurality of photoelectric converters,In the above-described detector, the plurality of photoelectric converters may be provided in a first substrate, and the plurality of filter circuits may be provided in a second substrate laminated on the first substrate.

摘要翻译： 在上述检测器中，多个光电转换器可以设置在第一基板中，并且多个滤波器电路可以设置在层叠在第一基板上的第二基板中。

公开(公告)号：US20220148978A1

公开(公告)日：2022-05-12

申请号：US17455611

申请日：2021-11-18

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Kazuya OKAMOTO ,  Hajime MITSUISHI ,  Minoru FUKUDA

IPC分类号： H01L23/544 ,  B23K20/02 ,  H01L21/67 ,  H01L21/683 ,  B23K20/00 ,  B23K37/04 ,  H01L21/68 ,  H01L21/687 ,  B23K20/24 ,  H01L23/00 ,  B65H31/34

摘要： A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.

公开(公告)号：US20210242044A1

公开(公告)日：2021-08-05

申请号：US17235780

申请日：2021-04-20

申请人： NIKON CORPORATION

发明人： Hajime MITSUISHI ,  Isao SUGAYA ,  Masaki TSUNODA ,  Kazuhiro SUZUKI ,  Takashi SHIOMI ,  Minoru FUKUDA

IPC分类号： H01L21/67 ,  H01L21/683

摘要： Provided is a substrate bonding apparatus comprising: a first holding unit for holding a first substrate; and a second holding unit for holding a second substrate, wherein the substrate bonding apparatus is configured to bond the first substrate and the second substrate by, after forming a contact region between a part of the first substrate and a part of the second substrate, expanding the contact region to form an initially bonded region and releasing the second substrate having the initially bonded region formed thereon from the second holding unit.

公开(公告)号：US20200091015A1

公开(公告)日：2020-03-19

申请号：US16698238

申请日：2019-11-27

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Hajime MITSUISHI

IPC分类号： H01L21/66 ,  H01L23/00 ,  H01L21/687 ,  H01L21/68 ,  H01L21/67

摘要： When distortion occurs in substrates before bonding, this distortion dissipates when the hold on the substrate by a holding section is released, and misalignment occurs between the two bonded substrates. Provided is a substrate bonding method for bonding a first substrate held by a first holding section and a second substrate held by a second holding section, by releasing the hold on at least one of the first substrate and the second substrate, the substrate bonding method including determining which of the first substrate and the second substrate is to be released from the hold or continued to be held, based on information concerning distortion of at least one of the first substrate and the second substrate, wherein the information concerning the distortion includes information concerning distortion occurring in a bonding process of the first substrate and the second substrate.

公开(公告)号：US20190027462A1

公开(公告)日：2019-01-24

申请号：US16142968

申请日：2018-09-26

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Minoru FUKUDA

IPC分类号： H01L23/00

摘要： A substrate bonding apparatus that brings a part of a surface of a first substrate and a part of a surface of a second substrate into contact in a state where a temperature difference is generated therebetween, to form contact regions at the parts, and then enlarges the contact regions to bond the first substrate and the second substrate, wherein enlargement of the contact regions starts before positional misalignment between the first substrate and the second substrate exceeds a threshold, and the threshold is set such that positional misalignment after the first substrate and the second substrate are bonded does not exceed a tolerated value.

公开(公告)号：US20170302859A1

公开(公告)日：2017-10-19

申请号：US15590732

申请日：2017-05-09

申请人： NIKON CORPORATION

发明人： Sota NAKANISHI ,  Wataru FUNAMIZU ,  Kazuya OKAMOTO ,  Shiro TSUNAI ,  Isao SUGAYA

IPC分类号： H04N5/243 ,  H01L27/146 ,  H04N5/3745

CPC分类号： H04N5/243 ,  H01L27/14 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14645 ,  H04N5/2357 ,  H04N5/3745 ,  H04N5/379

摘要： Provided is a light detecting apparatus including: a first photoelectric converting element which outputs a first electrical signal in accordance with an incident light including a modulated light component and a background light component; a filter which outputs a second electrical signal resulting from the modulated light component being reduced in the incident light; and a signal processor which subtracts the second electrical signal from the first electrical signal to reduce a component corresponding to the background light component in the first electrical signal.

公开(公告)号：US20140304674A2

公开(公告)日：2014-10-09

申请号：US13732796

申请日：2013-01-02

申请人： Nikon Corporation

发明人： Isao SUGAYA ,  Takahiro HORIKOSHI ,  Kazuya OKAMOTO

IPC分类号： G06F17/50

CPC分类号： G06F17/5081 ,  G06F17/5068 ,  H01L21/67092 ,  H01L24/75 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7592 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01074 ,  H01L2924/01082

摘要： The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters.

摘要翻译： 当接合基板时彼此相对的端子被设计成可靠地接合。 包含在半导体器件设计系统中的数值获取部分获取多个计算参数的相应数值，结点估计部分，在多个基板已按规定压力被按压的情况下 使得凸起前端面接触，基于由数值获取部获取的计算参数的各个数值，估计相应的相对的凸块是否被接合;以及变化处理部，其在 由结点估计部估计出任何凸块不会接合的情况，给出警告或进行处理，以便改变多个计算参数中的至少一个计算参数的数值。

公开(公告)号：US20240021447A1

公开(公告)日：2024-01-18

申请号：US18475895

申请日：2023-09-27

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Hajime MITSUISHI

IPC分类号： H01L21/67 ,  H01L21/68 ,  H01L21/66 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67092 ,  H01L21/67271 ,  H01L21/681 ,  H01L22/20 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/6831 ,  H01L21/68714 ,  H01L22/12

摘要： A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.

公开(公告)号：US20240014079A1

公开(公告)日：2024-01-11

申请号：US18474731

申请日：2023-09-26

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Eiji ARIIZUMI ,  Yoshiaki KITO ,  Mikio USHIJIMA ,  Masanori ARAMATA ,  Naoto KIRIBE ,  Hiroshi SHIRASU ,  Hajime MITSUISHI ,  Minoru FUKUDA ,  Masaki TSUNODA

IPC分类号： H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  H01L23/00

CPC分类号： H01L22/12 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/6838 ,  H01L21/67253 ,  H01L21/6831 ,  H01L21/68764 ,  H01L24/75 ,  H01L2224/75725 ,  H01L2224/75745 ,  H01L2224/75304 ,  H01L2224/759

摘要： To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

公开(公告)号：US20210028045A1

公开(公告)日：2021-01-28

申请号：US17037033

申请日：2020-09-29

申请人： NIKON CORPORATION

发明人： Hajirne MITSUISHI ,  Isao SUGAYA ,  Minoru FUKUDA

IPC分类号： H01L21/68 ,  H01L21/687 ,  H01L21/673 ,  H01L21/67

摘要： A stacking apparatus that stacks substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of bolding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position here the holding member is housed to a position where the first substrate is held.