公开(公告)号：US20200335472A1

公开(公告)日：2020-10-22

申请号：US16918872

申请日：2020-07-01

申请人： NIKON CORPORATION

发明人： Kazuya OKAMOTO ,  Isao SUGAYA ,  Naohiko KURATA ,  Masashi OKADA ,  Hajime MITSUISHI

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L23/544 ,  H01L21/66 ,  B23K37/04 ,  H01L21/68

摘要： A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

公开(公告)号：US20150083786A1

公开(公告)日：2015-03-26

申请号：US14497424

申请日：2014-09-26

申请人： NIKON CORPORATION

发明人： Kazuya OKAMOTO ,  Isao SUGAYA ,  Naohiko KURATA ,  Masashi OKADA ,  Hajime MITSUISHI

IPC分类号： H01L23/00 ,  B23K37/04 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L24/75 ,  B23K37/04 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/68 ,  H01L22/12 ,  H01L22/20 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54493 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75102 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/758 ,  H01L2224/75802 ,  H01L2224/75804 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81047 ,  H01L2224/8109 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/8115 ,  H01L2224/8116 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

摘要： A substrate bonding apparatus that bonds a first substrate and a second substrate together, comprising a joining section that joins the first substrate and second substrate together aligned to each other for stacking; a detecting section that detects an uneven state on at least one of the first substrate and second substrate prior to joining by the joining section; and a determining section that determines whether the uneven state detected by the detecting section satisfies a predetermined condition, wherein the joining section does not join the first substrate and the second substrate if it is determined by the determining section that the uneven state does not satisfy the predetermined condition.

摘要翻译： 一种将第一基板和第二基板结合在一起的基板接合装置，包括将第一基板和第二基板连接在一起的接合部分，彼此对准以便堆叠; 检测部，其在由所述接合部接合之前，检测所述第一基板和所述第二基板中的至少一个上的不均匀状态; 以及确定部，其确定由所述检测部检测到的所述不均匀状态是否满足预定条件，其中如果由所述确定部确定所述接合部不接合所述第一基板和所述第二基板，所述不均匀状态不满足 预定条件。

公开(公告)号：US20130226334A1

公开(公告)日：2013-08-29

申请号：US13862661

申请日：2013-04-15

申请人： Nikon Corporation

发明人： Kazuya OKAMOTO

IPC分类号： H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67253 ,  H01L21/67259 ,  H01L25/0657 ,  H01L25/50 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

摘要： A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

摘要翻译： 堆叠装置，其堆叠各自具有与电路图案和电极连续布置的多个芯片的芯片组件，包括：允许任意移动的多个级，其上放置芯片组件; 存储单元，其存储在堆叠处理期间当放置在所述多个级上的所述芯片组件施加热量时期望发生的每个芯片处的电极的位置的估计变化范围; 以及控制单元，其基于从所述存储单元提供的每个芯片处的所述电极的所述位置的估计的变化范围和所述位置信息，所述控制单元在所述堆叠处理期间设定要相对于彼此假设的所述多个级的位置， 在芯片组件处形成的单个芯片并且控制多个级中的至少一个级。

公开(公告)号：US20180020153A1

公开(公告)日：2018-01-18

申请号：US15717078

申请日：2017-09-27

申请人： NIKON CORPORATION

发明人： Wataru FUNAMIZU ,  Kazuya OKAMOTO

IPC分类号： H04N5/232 ,  H04N5/369 ,  H04N5/225

CPC分类号： H04N5/23212 ,  H04N5/2256 ,  H04N5/3696

摘要： An image sensor includes: a first light-receiving unit that: receives a modulated optical signal having being reflected on an image-capturing target and including a modulated component with an intensity modulated at a predetermined modulation frequency; and outputs a first electrical signal; a second light-receiving unit that: receives a reference optical signal with an intensity modulated in synchronization with the modulated optical signal; and outputs a second electrical signal; and a detecting unit that: is provided to a substrate stacked on a substrate including the first light-receiving unit; refers to the second electrical signal; and detects, from the first electrical signal, a third electrical signal corresponding to the modulated component.

公开(公告)号：US20170069677A1

公开(公告)日：2017-03-09

申请号：US15270367

申请日：2016-09-20

申请人： NIKON CORPORATION

发明人： Osamu SARUWATARI ,  Shigeru AOKI ,  Kazuya OKAMOTO ,  Isao SUGAYA ,  Masashi OKADA ,  Hiroshi OHKI

IPC分类号： H01L27/146 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L27/14634 ,  G01S7/4863 ,  G01S7/4876 ,  G01S7/4914 ,  G01S7/493 ,  G01S17/89 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L25/50 ,  H01L27/14643 ,  H01L31/10 ,  H01L2924/0002 ,  H04N5/3745 ,  H01L2924/00

摘要： A detector comprises a plurality of photoelectric converters to output an electrical signal corresponding to an incident light, and a plurality of filter circuits provided corresponding to each of the plurality of photoelectric converters or to each of a plurality of element groups respectively including a predetermined number of the photoelectric converters of the plurality of photoelectric converters, the plurality of filter circuits attenuating a signal having a predetermined frequency from the electrical signal output from the plurality of photoelectric converters,In the above-described detector, the plurality of photoelectric converters may be provided in a first substrate, and the plurality of filter circuits may be provided in a second substrate laminated on the first substrate.

摘要翻译： 在上述检测器中，多个光电转换器可以设置在第一基板中，并且多个滤波器电路可以设置在层叠在第一基板上的第二基板中。

公开(公告)号：US20130251494A1

公开(公告)日：2013-09-26

申请号：US13874777

申请日：2013-05-01

申请人： Nikon Corporation

发明人： Kazuya OKAMOTO

IPC分类号： H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67253 ,  H01L21/67259 ,  H01L25/0657 ,  H01L25/50 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

摘要： A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.

摘要翻译： 堆叠装置，其堆叠各自具有与电路图案和电极连续布置的多个芯片的芯片组件，包括：允许任意移动的多个级，其上放置芯片组件; 存储单元，其存储在堆叠处理期间当放置在所述多个级上的所述芯片组件施加热量时期望发生的每个芯片处的电极的位置的估计变化范围; 以及控制单元，其基于从所述存储单元提供的每个芯片处的所述电极的所述位置的估计的变化范围和所述位置信息，所述控制单元在所述堆叠处理期间设定要相对于彼此假设的所述多个级的位置， 在芯片组件处形成的单个芯片并且控制多个级中的至少一个级。

公开(公告)号：US20200043860A1

公开(公告)日：2020-02-06

申请号：US16600250

申请日：2019-10-11

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Kazuya OKAMOTO ,  Hajime MITSUISHI ,  Minoru FUKUDA

IPC分类号： H01L23/544 ,  B23K20/02 ,  H01L21/67 ,  H01L21/683 ,  B23K20/00 ,  B23K37/04 ,  H01L21/68 ,  H01L21/687 ,  B23K20/24 ,  H01L23/00 ,  B65H31/34

摘要： A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.

公开(公告)号：US20150231873A1

公开(公告)日：2015-08-20

申请号：US14695621

申请日：2015-04-24

申请人： NIKON CORPORATION

发明人： Kazuya OKAMOTO ,  Isao Sugaya

IPC分类号： B32B41/00 ,  B32B37/00 ,  B32B37/18 ,  B32B38/18

CPC分类号： B32B41/00 ,  B32B37/0046 ,  B32B37/18 ,  B32B38/18 ,  H01L21/67092 ,  H01L21/681

摘要： A substrate aligning apparatus comprising: an aligning section that aligns a first substrate and a second substrate together; an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section; a judging that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section.

摘要翻译： 一种基板对准装置，包括：将第一基板和第二基板对准在一起的对准部分; 获取部，其在从对准部执行在对准部中对准的第一基板和第二基板的时刻，获取第一基板和第二基板中的至少一个的位置信息; 基于由所述获取部获取的信息来判定所述第一基板和所述第二基板的未对准的判断。

公开(公告)号：US20140181781A2

公开(公告)日：2014-06-26

申请号：US13732796

申请日：2013-01-02

申请人： Nikon Corporation

发明人： Isao SUGAYA ,  Takahiro HORIKOSHI ,  Kazuya OKAMOTO

IPC分类号： G06F17/50

CPC分类号： G06F17/5081 ,  G06F17/5068 ,  H01L21/67092 ,  H01L24/75 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7592 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01074 ,  H01L2924/01082

摘要： The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters.

公开(公告)号：US20220148978A1

公开(公告)日：2022-05-12

申请号：US17455611

申请日：2021-11-18

申请人： NIKON CORPORATION

发明人： Isao SUGAYA ,  Kazuya OKAMOTO ,  Hajime MITSUISHI ,  Minoru FUKUDA

IPC分类号： H01L23/544 ,  B23K20/02 ,  H01L21/67 ,  H01L21/683 ,  B23K20/00 ,  B23K37/04 ,  H01L21/68 ,  H01L21/687 ,  B23K20/24 ,  H01L23/00 ,  B65H31/34

摘要： A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.