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公开(公告)号：US20130243370A1
公开(公告)日：2013-09-19
申请号：US13775445
申请日：2013-02-25
Applicant: NITTO DENKO CORPORATION
Inventor： Yuichi Tsujita , Yasuto Ishimaru , Hiroyuki Hanazono , Naoyuki Tanaka , Yasufumi Yamamoto , Shotaro Masuda , Mayu Ozaki
IPC: G02B6/136
CPC classification number: G02B6/136 , G02B6/1221 , G02B6/138 , G02B6/43
Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.
Abstract translation: 提供了能够抑制光传播损失增加并且柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导与电路板的绝缘层的背面之间。 图案化金属层以具有多个条带。 光波导的芯设置在与通过图案化去除金属层的位置相对应的位置。
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公开(公告)号：US20170211971A1
公开(公告)日：2017-07-27
申请号：US15326702
申请日：2015-07-17
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Yuichi Tsujita
CPC classification number: G01J1/0425 , G01J1/0204 , G01J1/0209 , G01J1/0403 , G01J1/0407 , G01J1/0414 , G01J1/4204 , G02B6/42
Abstract: There is provided an optical sensor in which a reduction in size of a light-receiving part is achieved. This optical sensor is installed in a device, and includes a light-receiving element 4 for receiving light coming from outside toward the device. The optical sensor detects the state of the received light. A linear optical waveguide 2 is connected to the light-receiving element 4 so as to be capable of light propagation. The optical waveguide 2 has a front end portion serving as a light entrance portion on which light coming from the outside of the device is incident.
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公开(公告)号：US20160131834A1
公开(公告)日：2016-05-12
申请号：US14898547
申请日：2014-05-07
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Naoki Shibata , Yuichi Tsujita
IPC: G02B6/12
CPC classification number: G02B6/12002 , G02B6/12004 , G02B6/4214 , G02B6/4293
Abstract: An opto-electric hybrid module is provided, which is excellent in bending resistance and optical element mountability. In the opto-electric hybrid module, a light-path core of an optical waveguide is provided on a surface of an under-cladding layer, and non-light-path dummy cores are provided on opposite sides of the light-path core in spaced relation to the light-path core as projecting from the surface of the under-cladding layer. An electric circuit having mounting pads is provided on top surfaces of the dummy cores. An over-cladding layer is provided on side surfaces and a top surface of the light-path core, and projects to cover the core. The non-light-path dummy cores each have an elastic modulus that is set higher than the elastic modulus of the under-cladding layer and the elastic modulus of the over-cladding layer. The optical element is mounted on the mounting pads, and positioned above the projecting over-cladding layer.
Abstract translation: 提供了一种光电混合模块，其耐弯曲性和光学元件安装性优异。 在光电混合模块中，在下敷层的表面上设置有光波导路的光路芯，并且在光路芯的相对侧上设有非光路虚拟芯， 关于从下敷层的表面突出的光路芯。 具有安装焊盘的电路设置在虚拟芯的顶表面上。 在光路芯的侧表面和顶表面上设置上覆层，并突出覆盖芯。 非光路虚拟芯各自具有设定为高于下敷层的弹性模量和上敷层的弹性模量的弹性模量。 光学元件安装在安装焊盘上，并且位于突出的上敷层之上。
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公开(公告)号：US08837874B2
公开(公告)日：2014-09-16
申请号：US13866273
申请日：2013-04-19
Applicant: Nitto Denko Corporation
Inventor： Yuichi Tsujita , Yasuto Ishimaru , Hiroyuki Hanazono , Naoyuki Tanaka , Yasufumi Yamamoto , Shotaro Masuda , Mayu Ozaki
Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.
Abstract translation: 提供能够抑制光传播损耗增加和柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在绝缘层的背面上。 金属层形成在包覆层和绝缘层之间。 金属层的至少一部分形成为第一和第二图案之一。 第一图案包括点状突起的分布，第二图案包括点状凹部的分布。 第一包层填充通过图案化去除金属层的位置。
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公开(公告)号：US20130301980A1
公开(公告)日：2013-11-14
申请号：US13866273
申请日：2013-04-19
Applicant: NITTO DENKO CORPORATION
Inventor： Yuichi Tsujita , Yasuto Ishimaru , Hiroyuki Hanazono , Naoyuki Tanaka , Yasufumi Yamamoto , Shotaro Masuda , Mayu Ozaki
Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.
Abstract translation: 提供能够抑制光传播损耗增加和柔性优异的光电混合板及其制造方法。 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导形成在绝缘层的背面上。 金属层形成在包覆层和绝缘层之间。 金属层的至少一部分形成为第一和第二图案之一。 第一图案包括点状突起的分布，第二图案包括点状凹部的分布。 第一包层填充通过图案化去除金属层的位置。
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Patent Agency Ranking
公开(公告)号：US10996395B2
公开(公告)日：2021-05-04
申请号：US16473799
申请日：2017-11-28
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Yuichi Tsujita
Abstract: There is provided an opto-electric hybrid board with slight or no warpage. An opto-electric hybrid board according to the present disclosure includes an electric circuit board and an optical waveguide formed in a stacked manner on one surface of the electric circuit board. The optical waveguide includes an under cladding layer, cores for an optical path formed on a front surface of the under cladding layer, and over cladding layer formed on the front surface of the under cladding layer so as to cover the cores. A groove for prevention of warpage which has a bottom positioned below a top surface of the cores is formed at least in a front surface portion of the over cladding layer.
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公开(公告)号：US10446709B2
公开(公告)日：2019-10-15
申请号：US15315892
申请日：2015-06-02
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Yuichi Tsujita
IPC: H01L31/167 , H01L31/0232 , H01L33/50 , G02B6/00 , G02B6/12 , H01L25/16 , H01L31/16
Abstract: An optical sensor is installed in a device, and includes a light-emitting element, and a light-receiving element for receiving light emitted from the light-emitting element and traveling through a space. The optical sensor detects an object present in the space, based on a change of the light impinging upon the object. A first optical waveguide is connected to the light-emitting element so as to be capable of light propagation. The first optical waveguide has a front end portion serving as a light exit portion for exiting light emitted from the light-emitting element. A second optical waveguide is connected to the light-receiving element so as to be capable of light propagation. The second optical waveguide has a front end portion serving as a light entrance portion for receiving light exiting from the light exit portion of the first optical waveguide and traveling through the space.
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公开(公告)号：US20170133544A1
公开(公告)日：2017-05-11
申请号：US15315892
申请日：2015-06-02
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Yuichi Tsujita
IPC: H01L31/167 , H01L31/0232 , H01L33/50
Abstract: An optical sensor is installed in a device, and includes a light-emitting element, and a light-receiving element for receiving light emitted from the light-emitting element and traveling through a space. The optical sensor detects an object present in the space, based on a change of the light impinging upon the object. A first optical waveguide is connected to the light-emitting element so as to be capable of light propagation. The first optical waveguide has a front end portion serving as a light exit portion for exiting light emitted from the light-emitting element. A second optical waveguide is connected to the light-receiving element so as to be capable of light propagation. The second optical waveguide has a front end portion serving as a light entrance portion for receiving light exiting from the light exit portion of the first optical waveguide and traveling through the space.
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公开(公告)号：US09632246B2
公开(公告)日：2017-04-25
申请号：US14893245
申请日：2014-03-31
Applicant: NITTO DENKO CORPORATION
Inventor： Yuichi Tsujita , Yasuto Ishimaru
CPC classification number: G02B6/12002 , G02B6/43 , H05K1/0203 , H05K1/0274 , H05K1/028 , H05K2201/10121
Abstract: There is provided an opto-electric hybrid board in which a metal reinforcement layer is in intimate contact with an insulative layer of a flexible circuit board without an adhesive layer interposed therebetween, the metal reinforcement layer allowing the proper mounting of an element while deformation due to pressing load applied during the mounting is suppressed. In the opto-electric hybrid board, a flexible double-sided circuit board in which electrical interconnect lines are formed on the front and back surfaces of an insulative layer having flexibility is used as an electric circuit board. A metal reinforcement layer is formed by plating on at least part of the electrical interconnect line on the back surface side which corresponds to a mounting pad on the front surface side. An optical waveguide is formed in contact with the electrical interconnect line on the back surface side of the flexible double-sided circuit board.
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公开(公告)号：US09459419B2
公开(公告)日：2016-10-04
申请号：US14910048
申请日：2014-07-03
Applicant: NITTO DENKO CORPORATION
Inventor： Naoyuki Tanaka , Yasuto Ishimaru , Naoki Shibata , Yuichi Tsujita
CPC classification number: G02B6/4281 , G02B6/122 , G02B6/13 , G02B6/138 , G02B6/4214 , G02B6/4274 , G02B6/43
Abstract: An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.
Abstract translation: 提供了一种光电混合模块，其具有线性光路芯和包括安装焊盘的电路和设置在光波导的下敷层的表面上的电路体。 光学元件安装有其电极邻接安装垫。 除了芯形成部分和电路形成部分之外，电路体和下包层的表面的一部分被包括芯材料层和上敷层材料层的叠层覆盖。 存在于安装焊盘和电路体之间的堆叠的表面部分位于比存在于电路主体上的堆叠的表面部分更低的高度位置处。
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