公开(公告)号：US11774286B2

公开(公告)日：2023-10-03

申请号：US17511593

申请日：2021-10-27

Applicant: Au Optronics Corporation

Inventor： Yen-Tang Huang

IPC: G01J3/28 ,  G01J1/42 ,  H01L31/0224 ,  H01L31/0232 ,  G01J1/02 ,  G01J1/04 ,  G01J1/44

CPC classification number: G01J3/28 ,  G01J1/4228 ,  H01L31/0224 ,  H01L31/02327 ,  G01J1/0209 ,  G01J1/0407 ,  G01J1/0488 ,  G01J1/44

Abstract: A light detection device including a substrate, a first light detector, a second light detector, and a switch element is provided. The first light detector is disposed on the substrate and includes a first active layer. The second light detector is disposed between the substrate and the first light detector and includes a second active layer. The switch element is disposed on the substrate. A horizontal projection of the second active layer on the substrate completely falls within a horizontal projection of the first active layer on the substrate. A negative electrode of the first light detector and a negative electrode of the second light detector are electrically connected to the switch element via a first metal layer.

公开(公告)号：US20180226530A1

公开(公告)日：2018-08-09

申请号：US15939636

申请日：2018-03-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  H01L31/167 ,  G01J1/02 ,  G01J1/04 ,  G01J1/06 ,  H01L31/0232 ,  H01L27/146 ,  H01L25/16 ,  G02B13/00 ,  G02B3/00 ,  G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02 ,  G01J5/00 ,  G01J1/42 ,  B29D11/00

CPC classification number: H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US09976894B2

公开(公告)日：2018-05-22

申请号：US15353397

申请日：2016-11-16

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

CPC classification number: G01J1/0295 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/0271 ,  H01L31/173

Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

公开(公告)号：US09945718B2

公开(公告)日：2018-04-17

申请号：US14591763

申请日：2015-01-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Ulrich Boettiger

IPC: H01L27/00 ,  G01J1/04 ,  G01J1/02 ,  G01J3/28 ,  G01J4/04 ,  G01J3/02 ,  G01J1/42 ,  H04N5/369 ,  H04N9/04 ,  G01J1/44

CPC classification number: G01J1/0488 ,  G01J1/0209 ,  G01J1/0411 ,  G01J1/4228 ,  G01J3/0208 ,  G01J3/0259 ,  G01J3/2803 ,  G01J4/04 ,  G01J2001/448 ,  H04N5/3696 ,  H04N9/045

Abstract: An imaging system may include several different types of pixels that are each configured to detect different characteristics of light received at the imaging system. An imaging system may include image sensing pixels that detect the wavelength and intensity of the light, direction sensing pixels that detect the directionality of the light, polarization sensing pixels that detect a polarization state of the light, and diffractive wavelength separation pixels that detect multiple different wavelength components of the light. One or more pixels of the different types may be arranged in a pixel cluster. A pixel cluster that includes different pixel types may detect spatially correlated information for multiple characteristics of the light. Multiple pixel clusters may be arranged in a pixel array that generates an image based on spatially correlated information for the different characteristics of the light.

公开(公告)号：US20170207352A1

公开(公告)日：2017-07-20

申请号：US15347664

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Chia Yun HSU ,  Tsung-Yu LIN

IPC: H01L31/0232 ,  G01J1/02 ,  H01L31/18 ,  H01L31/12 ,  H01L31/0203 ,  F21V8/00 ,  G01J1/04

CPC classification number: H01L31/02327 ,  G01J1/0209 ,  G01J1/0425 ,  G02B6/0028 ,  G06K9/00046 ,  H01L31/0203 ,  H01L31/125 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.

公开(公告)号：US20170179682A1

公开(公告)日：2017-06-22

申请号：US15379856

申请日：2016-12-15

Applicant: Toshihiro ISHII ,  Yoichiro TAKAHASHI ,  Sunao CHUBACHI ,  Masayuki FUJIWARA ,  Toshihide SASAKI ,  Kazuhiko ADACHI

Inventor： Toshihiro ISHII ,  Yoichiro TAKAHASHI ,  Sunao CHUBACHI ,  Masayuki FUJIWARA ,  Toshihide SASAKI ,  Kazuhiko ADACHI

IPC: H01S5/026 ,  H01S5/42 ,  G01N21/47 ,  G01J1/02 ,  A61B5/16 ,  H01L31/0232 ,  H01L31/0224 ,  H01L31/103 ,  A61B5/00 ,  H01S5/183 ,  H01L31/167

CPC classification number: H01S5/0262 ,  A61B5/0042 ,  A61B5/0073 ,  A61B5/0261 ,  A61B5/055 ,  A61B5/1455 ,  A61B5/165 ,  A61B5/4887 ,  A61B2505/09 ,  A61B2562/0233 ,  A61B2562/146 ,  A61B2562/16 ,  G01J1/0209 ,  G01J1/0411 ,  G01N21/359 ,  G01N21/4785 ,  G01N21/4795 ,  G01N21/49 ,  G01N2201/0612 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/103 ,  H01L31/167 ,  H01S5/02208 ,  H01S5/02288 ,  H01S5/0264 ,  H01S5/18347 ,  H01S5/18358 ,  H01S5/423

Abstract: An optical sensor, an optical examination device, and a method of detecting optical properties. The optical sensor includes an irradiation system including light irradiator to irradiate a test object with light, and a detection system to detect the light that is emitted from the irradiation system to the test object and has propagated through the test object. The light irradiator includes a multilayered structure having an active layer, and the multilayered structure includes a surface-emitting laser element and a photo-sensing element optically connected to the surface-emitting laser element. The optical examination device includes the optical sensor, and a controller to calculate optical properties of the test object based on a detection result of the optical sensor. The method includes performing optical simulation to obtain a detection light quantity distribution for an optical model and performing inverse problem estimation.

公开(公告)号：US09683890B2

公开(公告)日：2017-06-20

申请号：US14755745

申请日：2015-06-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Orit Skorka ,  Salman Kabir

IPC: H01L27/00 ,  G01J1/44 ,  G01J1/02 ,  G01J1/04 ,  H01L27/146

CPC classification number: G01J1/44 ,  G01J1/0209 ,  G01J1/0411 ,  G01J1/0488 ,  G01J2001/446 ,  G01J2001/448 ,  H01L27/1461 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685

Abstract: An image sensor with an array of pixels is provided. In order to achieve high image quality, it may be desirable to improve well capacity of individual pixels within the array by forming deep photodiodes in a thick substrate. When forming the array of pixels, conductive contacts may be formed in a back surface of the substrate opposing ground contacts located on a front side of the substrate. A conductive grid layer may be formed over the conductive contacts. A color filter layer may be formed over the conductive grid layer that may include a barrier grid in which color filter material is deposited. The conductive grid layer and conductive contacts may be biased to a voltage to improve the strength of electric fields in the substrate. Conductive contacts will thereby improve charge collection and electrical isolation and prevent electrical crosstalk and blooming.

公开(公告)号：US20170034922A1

公开(公告)日：2017-02-02

申请号：US15222976

申请日：2016-07-29

Applicant: Industrial Technology Research Institute

Inventor： Ming-Hsien Wu ,  Yen-Hsiang Fang ,  Shih-Hao Wang ,  Yi-Chen Lin

IPC: H05K3/30

CPC classification number: G02B6/34 ,  G01J1/0209 ,  G01J1/0407 ,  G01J1/0422 ,  G02B6/12004 ,  G02B6/305 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4298 ,  G02B2006/12121 ,  G02B2006/12147 ,  H01S5/0425 ,  H01S5/12 ,  H04B10/079 ,  H05K3/30 ,  H05K2203/0147 ,  H05K2203/163

Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.

Abstract translation: 提供了包括以下步骤的电子设备的检测方法。 检测方法包括：提供电子器件基板; 通过电子设备传送模块附接电子设备基板的电子设备的一部分，其中电子设备传送模块包括与电子设备的该部分对应的多个检测元件，并且每个检测元件包括至少一对 的电极; 检测所述至少一对电极之间的传导路径是否产生，以确认所述电子设备的所述部分与所述接触目标之间的接触状态; 以及将附接到电子设备传送模块的电子设备的部分传送到目标基板。 还提供了一种具有检测元件的电子设备传送模块。

公开(公告)号：US20170031104A1

公开(公告)日：2017-02-02

申请号：US15222961

申请日：2016-07-29

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hsin Chao ,  Yen-Hsiang Fang ,  Chun-Hsing Lee ,  Kai-Ning Ku

IPC: G02B6/34 ,  G01J1/02 ,  G01J1/04 ,  G02B6/42

CPC classification number: G02B6/34 ,  G01J1/0209 ,  G01J1/0407 ,  G01J1/0422 ,  G02B6/12004 ,  G02B6/305 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4298 ,  G02B2006/12121 ,  G02B2006/12147 ,  H01S5/0425 ,  H01S5/12 ,  H04B10/079 ,  H05K3/30 ,  H05K2203/0147 ,  H05K2203/163

Abstract: An optical receiver including a photodetector and a waveguide is provided. The photodetector includes a plurality of photosensitive regions arranged in an array. The waveguide is disposed on the photodetector and includes a plurality of gratings, a plurality of optical channels, and a plurality of light-deflection elements. The gratings are respectively adapted to collect light beams incident on the waveguide at different angles. The optical channels are adapted to propagate the light beams collected by the gratings. The light-deflection elements are disposed on transmission paths of the light beams propagating in the optical channels and are located above the photosensitive regions. The light-deflection elements are adapted to propagate the light beams propagating in the optical channels to the photosensitive regions. An optical transceiver is also provided.

Abstract translation: 提供了一种包括光电检测器和波导的光学接收器。 光电检测器包括以阵列排列的多个感光区域。 波导设置在光电检测器上，并且包括多个光栅，多个光通道和多个光偏转元件。 光栅分别适于以不同的角度收集入射在波导上的光束。 光通道适于传播由光栅收集的光束。 光偏转元件设置在光通道中传播的光束的传输路径上，并位于光敏区域之上。 光偏转元件适于将在光通道中传播的光束传播到感光区域。 还提供光收发器。

公开(公告)号：US20160091364A1

公开(公告)日：2016-03-31

申请号：US14536210

申请日：2014-11-07

Applicant: Lingsen Precision Industries, Ltd.

Inventor： Ming-Te TU ,  Yu-Chang HUANG

IPC: G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0271 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/42 ,  G01S7/4813 ,  G01S7/4815 ,  G01S17/026

Abstract: An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.

Abstract translation: 光学传感模块包括基板，盖，多个发光芯片，光接收芯片和多个密封剂。 盖子设置在基板上。 在盖和基板之间形成多个第一室和第二室。 盖具有分别与第一室连通的多个发光孔和与第二室连通的光接收孔。 发光芯片分别设置在基板和第一室中。 光接收芯片设置在基板和第二室中。 密封剂填充第一和第二室并且分别包围发光芯片和光接收芯片。 因此，其特征在于：将发光芯片和受光芯片配置在基板上，发光芯片以不同的颜色发射光束，以提高发光效率。