摘要:
A method and apparatus for improved metal oxide chemical vapor deposition on a substrate surface where the application boundary layer is reduced and where the uniformity of the application boundary layer is greatly enhanced in a reactor. Primary and secondary sonic or other disturbance sources are introduced to the interior chamber or an oscillating chuck is incorporated to influence the boundary layer thickness and uniformity.
摘要:
A method and apparatus for improved metal oxide chemical vapor deposition on a substrate surface where the application boundary layer is reduced and where the uniformity of the application boundary layer is greatly enhanced in a reactor. Primary and secondary sonic or other disturbance sources are incorporated for introducing disturbance into the interior chamber of the reactor, or an oscillating or vibrating chuck is incorporated within the interior chamber, to influence the boundary layer thickness and uniformity.
摘要:
A cluster tool module for dry process cleaning of substrates. A substrate process reactor body assembly includes a gas inlet and gas outlet on opposing sides of a ceramic reactor body. A linear xenon flash lamp in a light bar provides a UV source for uniform distribution over a substrate by use of a light filter. Infrared heating is also provided by a plurality of infrared lamps in the light box. A moisturizer is provided for safe introduction of water vapor into the gas flow.
摘要:
The present invention relates to a method for lithiation of an intercalation-based anode or a non-reactive plating-capable foil or a reactive alloy capable anode, whereby utilization of said lithiated intercalation-based anode or a plating-capable foil or reactive alloy capable anode in a rechargeable battery or electrochemical cell results in an increased amount of lithium available for cycling, and an improved reversible capacity during charge and discharge.
摘要:
A system and method for processing substrates that achieves isothermal and uniform fluid flow processing conditions for a plurality of substrates. In one aspect, the invention is a system and method that utilizes matching the emissivity value of the surfaces of a process chamber that oppose exposed surfaces of the substrates with the emissivity value of the exposed surfaces to achieve isothermal conditions throughout a substrate stack. In another aspect, the invention is system and method of processing substrates in a process chamber that exhibits excellent fluid flow uniformity by eliminating cavities or geometrical irregularities in the process chamber profile due to substrate loading openings. In yet anther aspect, the invention is a system and method of processing substrates wherein the process chamber comprises a liner and a shell, the liner constructed of a highly thermally conductive material, such as carbon, and the shell is constructed of a non-porous material, such as stainless steel.
摘要:
Chemical vapor deposition reactor incorporating gas flow vortex formation for uniform chemical vapor deposition upon a stationary wafer substrate. Gas flow including chemical vapors is introduced in tangential fashion to the interior of the heated reactor to provide for suitable uniform boundary layer control within the reactor upon the stationary wafer substrate.
摘要:
Megasonic cleaning system for use in cleaning of electronic or other items such as semiconductor wafers or semiconductor substrates in a wafer carrier. Formed piezoelectric transducers are bonded to a tubular envelope at a low temperature and are excited at a first frequency or a second higher frequency for cleaning of items in a cleaning tank. A novel sealing assembly accommodates tubular envelopes of varying diameters.
摘要:
The rotary fluid coupling decreases the possibility of microcontaminates entering the fluid flow line and is thus especially suitable for processing equipment in manufacturing of wafers and other components for the microcomputer industry. The rotary fluid coupling interconnects a fluid conveying passageway and a spindle element to a duct in a second element such that the two elements are rotatable with respect to each other. An axial channel is provided along the length of the spindle. A planar faced plate is mounted on the spindle. A bore in the spindle plate is in axial alignment with the spindle channel, generally forming a single continuous fluid conveying passageway. A second element has a generally planar distal faced plate. A fluid conducting duct extends from an aperture on the distal face of the second plate to a fluid source with the two faces generally aligned in parallel relationship to each other creating a fluid permeable gap. A fluid flow resistant labyrinth may be provided on one or both faces. In use, fluid flowing from the fluid source through the fluid conducting duct and the aperture in the second element crosses the fluid permeable gap to enter the fluid conveying passageway in the spindle elements. Synthetic resin coating is further provided within the fluid conveying passageway of the spindle element serving to prevent microcontaminates from being generated by corrosion of the metallic surface by the action of the fluid flowing therethrough.
摘要:
Oxides are etched with a halide-containing species and a low molecular weight organic molecule having a high vapor pressure at standard conditions, where etching is performed at preset wafer temperature in an enclosed chamber at a pressure such that all species present in the chamber, including water, are in the gas phase and condensation of species present on the etched surface is controlled. Thus all species involved remain in the gas phase even if trace water vapor appears in the process chamber. Preferably, etching is performed in a cluster dry tool apparatus.