公开(公告)号：US20200046210A1

公开(公告)日：2020-02-13

申请号：US16656648

申请日：2019-10-18

Applicant: OLYMPUS CORPORATION

Inventor： Takatoshi IGARASHI ,  Takahiro SHIMOHATA ,  Takuro SUYAMA

IPC: A61B1/05 ,  A61B1/00 ,  G06T7/00

Abstract: An image pickup module includes a stacked device in which a plurality of elements are stacked, adjacent elements are electrically connected together by element joints and a rear surface electrode is arranged on a rear surface, a wiring board in which a first electrode electrically connected to the rear surface electrode by a relay joint and a second electrode electrically connected to the first electrode via a relay wiring pattern are arranged, and a signal cable electrically connected to the second electrode via a cable joint, and in the stacked device, of a first region and a second region obtained by dividing the rear surface into two portions, the element joints are arranged only in a first space in which the first region is extended in an optical axis direction and the rear surface electrode is arranged only in the second region.

公开(公告)号：US20180122776A1

公开(公告)日：2018-05-03

申请号：US15851900

申请日：2017-12-22

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: H01L25/065 ,  H01L23/48 ,  H01L21/3065 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538 ,  H01L21/52 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00

Abstract: An electronic circuit board includes: electronic components; a silicon board that is plate shaped, includes a wiring pattern provided on at least one of a surface and a reverse surface thereof, and includes recessed portions where the electronic components are individually mounted; and a supporting board that is layered over the reverse surface of the silicon board, and includes a wiring pattern provided on at least one of a surface and a reverse surface thereof. Side faces of the recessed portions are perpendicular to the surface of the silicon board, the wiring pattern is connected to at least one of the electronic components mounted in the recessed portions, via at least one of a via and a bottom surface electrode provided in of the at least one of the recessed portions, and the recessed portions penetrate through the silicon board.

公开(公告)号：US20220368816A1

公开(公告)日：2022-11-17

申请号：US17868929

申请日：2022-07-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Ken YAMAMOTO ,  Takatoshi IGARASHI

IPC: H04N5/225 ,  A61B1/05

Abstract: An image pickup apparatus includes a stacked device in which a plurality of semiconductor devices respectively including a plurality of through electrodes are stacked, a first semiconductor device, among the plurality of semiconductor devices, in which thermal resistance of a through electrode is highest among the plurality of through electrodes, is disposed in front of a first surface on which a first circuit that is one of the semiconductor circuits having a largest heat generation amount is formed, the plurality of through electrodes of the first semiconductor device are conformal vias, and the plurality of through electrodes of semiconductor devices other than the first semiconductor device are filled vias.

公开(公告)号：US20190260917A1

公开(公告)日：2019-08-22

申请号：US16403782

申请日：2019-05-06

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takuro SUYAMA ,  Takahiro SHIMOHATA ,  Takatoshi IGARASHI ,  Hiroshi KOBAYASHI

IPC: H04N5/225 ,  A61B1/05 ,  H01L27/146

Abstract: An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor; and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.

公开(公告)号：US20180368661A1

公开(公告)日：2018-12-27

申请号：US16118865

申请日：2018-08-31

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: A61B1/00 ,  A61B1/05 ,  H01L27/146 ,  H01L23/00

Abstract: An image pickup apparatus includes an image pickup device including a wiring that connects a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, and a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and is bonded to the second electrode, and a sealing member that seals a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.

公开(公告)号：US20170311783A1

公开(公告)日：2017-11-02

申请号：US15650997

申请日：2017-07-17

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: A61B1/04 ,  A61B1/005 ,  A61B1/00

CPC classification number: A61B1/042 ,  A61B1/00165 ,  A61B1/005 ,  A61B1/0051 ,  A61B1/0057 ,  A61B1/04 ,  H01L27/14618 ,  H01L27/14636 ,  H04N2005/2255

Abstract: An image pickup apparatus includes a silicon layer, a rewiring layer including low-permittivity insulating bodies having a permittivity that is lower than a permittivity of silicon oxide, and a cover glass, and a cutout portion is provided in the silicon layer, wirings are provided on the cutout portion, the wirings do not cover at least a part of the low-permittivity insulating bodies in the rewiring layer, the low-permittivity insulating body being exposed at the cutout portion, and the cutout portion is covered by a second protection film including a metal material via a first protection film including an insulating material.

公开(公告)号：US20170123200A1

公开(公告)日：2017-05-04

申请号：US15402583

申请日：2017-01-10

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA

IPC: G02B23/24 ,  A61B1/00 ,  H04N5/225 ,  A61B1/04

CPC classification number: G02B23/2484 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/041 ,  A61B1/051 ,  H04N5/2256 ,  H04N2005/2255

Abstract: An image pickup unit of an embodiment includes: a first substrate on which an image pickup device is mounted; a first intermediate wiring board including a first wire, one end of the first wire electrically connected to the first substrate, the other end of the first wire including a first electrode pad; a second substrate on which an electronic component is mounted; and a second intermediate wiring board including a second wire, one end of the second wire electrically connected to the second substrate, and the other end of the second wire including a second electrode pad, wherein the first electrode pad and the second electrode pad coming into close contact and fixed in an electrically connected state are bent and deformed.

公开(公告)号：US20160358965A1

公开(公告)日：2016-12-08

申请号：US15241741

申请日：2016-08-19

Applicant: OLYMPUS CORPORATION

Inventor： Takuro SUYAMA ,  Takahiro SHIMOHATA

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/02

CPC classification number: H01L27/14632 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/335 ,  H05K1/028 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/0187 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09472 ,  H05K2201/09909 ,  H01L2924/00

Abstract: An image pickup apparatus is an image pickup apparatus including: an image pickup device including a plurality of electrode pads provided in a row on an outer peripheral portion of a light-receiving surface on which a light-receiving section is formed, the plurality of electrode pads being connected to the light-receiving section; and a wiring board including a plurality of inner leads connected to respective electrode pads, wherein each of the inner leads includes a distal end portion, a bent portion and a rear end portion, the distal end portion is connected to the corresponding electrode pad, the bent portion includes a first bent portion having a recess shape relative to the light-receiving surface and a second bent portion having a protruding shape relative to the light-receiving surface, and the rear end portion is disposed in parallel with a side face of the image pickup device.

Abstract translation: 图像拾取装置是一种图像拾取装置，包括：图像拾取装置，包括在其上形成有光接收部分的受光表面的外周部分上设置成一行的多个电极焊盘，所述多个电极 焊盘连接到光接收部分; 以及布线基板，其具有与各个电极焊盘连接的多个内部引线，其中，所述内部引线中的每一个包括前端部，弯曲部和后端部，所述前端部与相应的电极焊盘连接， 弯曲部分包括相对于光接收表面具有凹槽形状的第一弯曲部分和相对于光接收表面具有突出形状的第二弯曲部分，并且后端部分与第二弯曲部分 图像拾取装置。