公开(公告)号：US11824142B2

公开(公告)日：2023-11-21

申请号：US16969748

申请日：2019-02-05

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Sam Chou

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/50 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0091

Abstract: A radiation-emitting component (1) is specified with



a carrier (2) having a cavity (9),
a radiation-emitting semiconductor chip (3) which is arranged on a bottom surface delimiting the cavity (9) and which is configured to generate primary electromagnetic radiation, and
a first reflector layer (6) arranged above a top surface of the semiconductor chip (3), wherein
the carrier (2) is transparent in places to the primary electromagnetic radiation, and
the semiconductor chip (3) is spaced apart from at least one side surface delimiting the cavity (9).

公开(公告)号：US11508709B2

公开(公告)日：2022-11-22

申请号：US16979819

申请日：2019-02-07

Applicant: Osram OLED GmbH

Inventor： Martin Brandl ,  Zeljko Pajkic ,  Luca Haiberger

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L25/16 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01S5/40

Abstract: The invention relates to a method, an arrangement and an array, in which a structured contact layer and an elastic carrier layer arranged on a first side of the structured contact layer and connected to the structure contact layer by means of a bonded connection is produced, and in which at least one optoelectronic semiconductor component is arranged on the structured contact layer, on a second side of the structured contact layer, opposing the first side, and is electrically and mechanically connected to the structured contact layer, an elastic conversion layer in an irradiation region being applied to the structured contact layer and the elastic carrier layer in such a way that at least the optoelectronic semiconductor component is embedded in the conversion layer, at least in sections, and a connection region of the structure contact layer remains uncovered.

公开(公告)号：US11239396B2

公开(公告)日：2022-02-01

申请号：US16635470

申请日：2018-08-08

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Sam Chou

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/58 ,  H01L33/60

Abstract: A light-emitting device and a method for manufacturing a light-emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner, a foil element on the light-outcoupling surface, an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner and a gas-filled gap located at least in a partial region between the foil element and the optical element.

公开(公告)号：US20210184092A1

公开(公告)日：2021-06-17

申请号：US17183634

申请日：2021-02-24

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  David Racz ,  Matthias Sperl

IPC: H01L33/62 ,  H01L31/024 ,  H01L33/64 ,  H01L31/0224 ,  H01L31/02

Abstract: An optoelectronic component includes a radiation side, a contact side opposite the radiation side having at least two electrically conductive contact elements, and a semiconductor layer sequence having an active layer that emits or absorbs the electromagnetic radiation, wherein the at least two electrically conductive contact elements have different polarities, are spaced apart from each other and are completely or partially exposed at the contact side in an unmounted state of the optoelectronic component, a region of the contact side is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in a plan view of the contact side, the cooling element partially covers one or both of the at least two electrically conductive contact elements.

公开(公告)号：US10785359B2

公开(公告)日：2020-09-22

申请号：US16315448

申请日：2017-07-18

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger

IPC: H04M1/02 ,  H04M1/22 ,  H04N5/225

Abstract: A lighting device for a mobile terminal is disclosed. In an embodiment the lighting device includes a light-emitting component comprising a light-emitting semiconductor element and a first light emission face and a second light emission face, the light-emitting component configured to emit light radiation, a first optical waveguide for guiding the light radiation via the first light emission face to a first radiation element, a second optical waveguide for guiding the light radiation via the second light emission face to a second radiation element and at least one optical switch arranged in a region of the first light emission face or the second light emission face for controlling a quantity of light emitted from the light-emitting component via the respective light emission face.