公开(公告)号：US12237444B2

公开(公告)日：2025-02-25

申请号：US18489511

申请日：2023-10-18

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Sam Chou

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/60

Abstract: A radiation-emitting component is specified with a carrier having a cavity, a radiation-emitting semiconductor chip which is arranged on a bottom surface delimiting the cavity and which is configured to generate primary electromagnetic radiation, and a first reflector layer arranged above a top surface of the semiconductor chip, wherein the carrier is transparent in places to the primary electromagnetic radiation, and the semiconductor chip is spaced apart from at least one side surface delimiting the cavity.

公开(公告)号：US12009460B2

公开(公告)日：2024-06-11

申请号：US16768515

申请日：2018-12-05

Applicant: Osram OLED GmbH

Inventor： Luca Haiberger

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/46 ,  H01L33/48 ,  H01L33/52 ,  H01L33/60

CPC classification number: H01L33/505 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a conversion element having the following steps: providing a frame having an opening; applying a sacrificial layer at least to a side surface of the at least one opening; applying a reflective layer to the sacrificial layer; introducing a conversion material into the at least one opening, the conversion material covering the reflective layer; and removing the sacrificial layer and the frame.

公开(公告)号：US11588088B2

公开(公告)日：2023-02-21

申请号：US17183634

申请日：2021-02-24

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  David Racz ,  Matthias Sperl

IPC: H01L33/00 ,  H01L33/62 ,  H01L31/024 ,  H01L33/64 ,  H01L31/0224 ,  H01L31/02 ,  H01L33/38 ,  H01L33/54 ,  H01L31/0304 ,  H01L31/0352 ,  H01L33/06 ,  H01L33/30

Abstract: An optoelectronic component includes a radiation side, a contact side opposite the radiation side having at least two electrically conductive contact elements, and a semiconductor layer sequence having an active layer that emits or absorbs the electromagnetic radiation, wherein the at least two electrically conductive contact elements have different polarities, are spaced apart from each other and are completely or partially exposed at the contact side in an unmounted state of the optoelectronic component, a region of the contact side is partially or completely covered with an electrically insulating, contiguously formed cooling element, the cooling element is in direct contact with the contact side and has a thermal conductivity of at least 30 W/(m·K), and in a plan view of the contact side, the cooling element partially covers one or both of the at least two electrically conductive contact elements.

公开(公告)号：US11480744B2

公开(公告)日：2022-10-25

申请号：US17252908

申请日：2019-07-16

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Daniel Richter

IPC: G02B6/42 ,  H01L33/58 ,  H01L25/075

Abstract: In one embodiment, the optoelectronic component comprises a first emission zone, which emits electromagnetic radiation during operation. Furthermore, the component comprises an optical waveguide with an entrance side facing the first emission zone, a distribution element and with output coupling structures on a side of the distribution element facing away from the first emission zone. The optical waveguide is a simply connected solid body. In a top view of the side of the optical waveguide facing away from the first emission zone, the distribution element completely covers the first emission zone. The output coupling structures are individual, spaced-apart elevations, each of which extends away from the distribution element and comprises an output coupling surface at an end facing away from the distribution element. A structure that is nontransmissive to the radiation of the first emission zone is arranged on the optical waveguide in the region between the output coupling structures.

公开(公告)号：US11417639B2

公开(公告)日：2022-08-16

申请号：US16650316

申请日：2018-10-09

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Matthias Sperl

IPC: H01L25/16 ,  H01L31/153 ,  H01L33/64

Abstract: An optoelectronic device is specified, with a radiation-emitting semiconductor chip configured to generate electromagnetic radiation, and an active element configured to change a physical state, wherein the active element is embedded in a component of the component, and the physical change of state comprises the following: temperature change, sound generation, mechanical motion.

公开(公告)号：US20200259052A1

公开(公告)日：2020-08-13

申请号：US16635470

申请日：2018-08-08

Applicant: OSRAM OLED GMBH

Inventor： Luca Haiberger ,  Sam Chou

IPC: H01L33/50 ,  H01L33/00 ,  H01L33/58 ,  H01L33/60

Abstract: A light-emitting device and a method for manufacturing a light-emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip with a light-outcoupling surface surrounded laterally by a first reflective material in a form-locking manner, a foil element on the light-outcoupling surface, an optical element on the foil element laterally surrounded by a second reflective material in a form-locking manner and a gas-filled gap located at least in a partial region between the foil element and the optical element.

公开(公告)号：US11473221B2

公开(公告)日：2022-10-18

申请号：US16766442

申请日：2018-11-30

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Siegfried Herrmann

IPC: D02G3/44 ,  D03D1/00 ,  D03D15/00 ,  F21S4/15 ,  F21V8/00 ,  D03D15/47 ,  D03D15/547

Abstract: The invention relates to an embodiment in which the textile component comprises at least one flexible thread that can be woven. A plurality of semiconductor columns are attached in or on the thread and are configured to generate radiation. Furthermore, a plurality of electrical lines are located in or on the thread, by means of which lines the semiconductor columns are electrically contacted. An average height (H) of the semiconductor columns in a direction transverse to a longitudinal direction (L) of the thread is at most 20% of an average diameter (D) of the thread.

公开(公告)号：US11469220B2

公开(公告)日：2022-10-11

申请号：US16769202

申请日：2018-12-07

Applicant: OSRAM OLED GmbH

Inventor： Zeljko Pajkic ,  Luca Haiberger ,  Martin Brandl

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/48 ,  H01L23/31 ,  H01L23/495 ,  H01L31/147 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/045 ,  H01L33/50

Abstract: The invention relates to a component comprising a first part, a second part, a housing body, and a first electrode, wherein the housing body encloses the first electrode in lateral directions at least in some regions. The first electrode has a front face and a rear face facing away from the front face, and the front and rear faces are free of a cover produced by a material of the housing body at least in some regions. The first part is arranged on the front face, and the second part is arranged on the rear face, and both the first and second parts are connected to the first electrode in an electrically conductive manner. The first electrode is designed to be continuous and is arranged between the first part and the second part in the vertical direction. Also described is a method for producing the component.

公开(公告)号：US10763245B2

公开(公告)日：2020-09-01

申请号：US15719810

申请日：2017-09-29

Applicant: OSRAM OLED GmbH

Inventor： Luca Haiberger ,  Matthias Sperl

IPC: H01L25/075 ,  H01L23/31 ,  H01L33/58 ,  H01L23/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L33/52 ,  H01L33/30

Abstract: An optoelectronic component includes a carrier, wherein a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are arranged above a top side of the carrier, the optoelectronic semiconductor chips each include a top side, an underside situated opposite the top side, and side faces extending between the top side and the underside, the undersides of the optoelectronic semiconductor chips face the top side of the carrier, a first potting material is arranged above the top side of the carrier, the first potting material covering parts of the side faces of the first optoelectronic semiconductor chip, and a second potting material is arranged above the top side of the carrier, and the second potting material covering the first potting material.

公开(公告)号：US20210161433A1

公开(公告)日：2021-06-03

申请号：US17262647

申请日：2019-07-23

Applicant: OSRAM OLED GmbH

Inventor： Martin Brandl ,  Zeljko Pajkic ,  Luca Haiberger

IPC: A61B5/1455 ,  G01N33/487 ,  A61B5/00

Abstract: In an embodiment a portable electronic device includes a sensor device including at least one light emitter, at least one light detector, a housing in which the at least one light emitter and the at least one light detector are arranged and at least one channel forming a passageway through the housing, wherein the at least one light emitter and the at least one light detector are arranged such that light emitted from the at least one light emitter passes through the at least one channel and is thereafter detected by the at least one light detector.