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公开(公告)号:US11023194B2
公开(公告)日:2021-06-01
申请号:US16314467
申请日:2017-06-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Thomas Schwarz , Frank Singer , Jürgen Moosburger , Karl Engl , Alexander Martin
Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.
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公开(公告)号:US20180358514A1
公开(公告)日:2018-12-13
申请号:US15570699
申请日:2016-04-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Sonja Tragl , Dominik Eisert , Stefan Lange , Nils Kaufmann , Alexander Martin , Krister Bergenek
CPC classification number: H01L33/502 , A61B1/0653 , A61B1/0661 , C09K11/77 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A radiation-emitting optoelectronic device, a method for using a radiation-emitting optoelectronic device and a method for making a radiation-emitting optoelectronic device are disclosed. In an embodiment, the device includes a semiconductor chip configured to emit a primary radiation and a conversion element including a conversion material which comprises Cr and/or Ni ions and a host material and which, during operation of the device, converts the primary radiation emitted by the semiconductor chip into a secondary radiation of a wavelength between 700 nm and 2000 nm, wherein the host material comprises EAGa12O19, AyGa5O(15+y)/2, AE3Ga2O14, Ln3Ga5GeO14, Ga2O3, Ln3Ga5.5D0.5O14 or Mg4D2O9, wherein EA=Mg, Ca, Sr and/or Ba, A=Li, Na, K and/or Rb, AE=Mg, Ca, Sr and/or Ba, Ln=La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and/or Lu and D=Nb and/or Ta, and wherein y=0.9-1.9.
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公开(公告)号:US09983057B2
公开(公告)日:2018-05-29
申请号:US15568913
申请日:2016-04-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Nils Kaufmann , Alexander Martin
CPC classification number: G01J3/108 , G01J3/0289 , G01J3/10 , G01J3/18 , G01J3/42 , H01L33/50 , H01L33/505 , H01L33/58
Abstract: An optoelectronic arrangement includes an optoelectronic semiconductor chip, a wavelength-converting element and a detector component, wherein the optoelectronic arrangement is configured to emit light with a first peak wavelength and to emit light with a second peak wavelength, the first peak wavelength is in the visible spectral range and the second peak wavelength is in the non-visible spectral range or the first peak wavelength is in the non-visible spectral range and the second peak wavelength is in the visible spectral range, and the optoelectronic arrangement emits the light whose peak wavelength is in the non-visible spectral range into a target area, and the detector component is configured to detect light backscattered from the target area and the peak wavelength of which is in the non-visible spectral range.
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