公开(公告)号：US07312527B2

公开(公告)日：2007-12-25

申请号：US11305527

申请日：2005-12-16

Applicant: Sandeep B. Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

Inventor： Sandeep B. Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

IPC: H01L23/34

CPC classification number: H01L23/4275 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433

Abstract: A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

Abstract translation: 一种具有半导体封装的方法，装置和系统，包括封闭一定体积的热界面材料的热界面材料坝。

公开(公告)号：US20060042054A1

公开(公告)日：2006-03-02

申请号：US10925574

申请日：2004-08-25

Applicant: Kyle Kippes ,  Nitin Deshpande ,  Bruno Clark

Inventor： Kyle Kippes ,  Nitin Deshpande ,  Bruno Clark

IPC: A44B21/00

CPC classification number: H01L23/433 ,  H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

Abstract: A bridge clip can provide off center loading between a lid and a semiconductor package during curing of adhesive for attachment of the lid to the integrated circuit die. This may be done, in some embodiments, without requiring an inventory of different parts and a variety of different assembly techniques by providing a leaf spring on the bridge clip which may be adapted for off center loading. The leaf spring may have its apex or centroid displaced with respect to the length of the bridge clip, transversely thereto or some combination thereof as needed. Thus, in some embodiments, a different leaf spring is all that needs to be provided to implement off center loading.

Abstract translation: 桥接夹可以在用于将盖子附接到集成电路管芯的粘合剂固化期间在盖和半导体封装之间提供偏心加载。 在一些实施例中，可以通过在桥夹上提供适于偏心加载的板簧，而不需要不同部件的库存和各种不同的装配技术。 板簧可以根据需要相对于桥夹的横向方向或其一些组合而具有其顶点或质心位移。 因此，在一些实施例中，需要提供不同的板簧实现离心加载。

公开(公告)号：US07534715B2

公开(公告)日：2009-05-19

申请号：US11323526

申请日：2005-12-29

Applicant: Susheel Jadhav ,  Daoqiang Lu ,  Nitin Deshpande

Inventor： Susheel Jadhav ,  Daoqiang Lu ,  Nitin Deshpande

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13609 ,  H01L2224/75 ,  H01L2224/75314 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a plurality of first metal bumps on a first surface, and a plurality of second metal bumps on a second surface, wherein at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps, comprises a solder. The method also includes forming a metal region including indium and tin, on at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps. The method also includes positioning the first metal bumps on the second metal bumps, and heating the metal bumps and the metal region and melting the solder. Other embodiments are described and claimed.

Abstract translation: 描述了用于制造电子设备的电子设备和方法。 一种方法包括在第一表面上设置多个第一金属凸块，以及在第二表面上设置多个第二金属凸块，其中，（i）多个第一金属凸块中的至少一个，以及（ii）多个第二金属凸块 金属凸块，包括焊料。 该方法还包括在（i）多个第一金属凸块和（ii）多个第二金属凸块中的至少一个上形成包括铟和锡的金属区域。 该方法还包括将第一金属凸块定位在第二金属凸块上，并加热金属凸块和金属区域并熔化焊料。 描述和要求保护其他实施例。

公开(公告)号：US20080237364A1

公开(公告)日：2008-10-02

申请号：US11731224

申请日：2007-03-30

Applicant: Nitin Deshpande ,  Harikrishnan Ramanan ,  Ray Krick

Inventor： Nitin Deshpande ,  Harikrishnan Ramanan ,  Ray Krick

IPC: B05B7/06

CPC classification number: B05B7/0475 ,  B05B7/066 ,  B05B7/10

Abstract: Methods and apparatus to improve flux air cap and/or spray nozzle designs are described. In one embodiment, a flux nozzle may include a cylindrical portion and a conical portion. Other embodiments are also described.

Abstract translation: 描述了改善通量气帽和/或喷嘴设计的方法和设备。 在一个实施例中，磁通喷嘴可以包括圆柱形部分和锥形部分。 还描述了其它实施例。

公开(公告)号：US20080149692A1

公开(公告)日：2008-06-26

申请号：US11613490

申请日：2006-12-20

Applicant: Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

Inventor： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

IPC: B23K31/02 ,  B23K37/06

CPC classification number: B23K3/082 ,  B05B5/032 ,  B05B5/0403 ,  B05B7/0861 ,  B05B12/36 ,  B05B14/30 ,  B05B15/65 ,  B05C5/02 ,  B23K35/0244 ,  Y10T137/2931

Abstract: A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

Abstract translation: 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。

公开(公告)号：US20070152328A1

公开(公告)日：2007-07-05

申请号：US11323526

申请日：2005-12-29

Applicant: Susheel Jadhav ,  Daoqiang Lu ,  Nitin Deshpande

Inventor： Susheel Jadhav ,  Daoqiang Lu ,  Nitin Deshpande

IPC: H01L21/76

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13609 ,  H01L2224/75 ,  H01L2224/75314 ,  H01L2224/757 ,  H01L2224/7598 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81907 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a plurality of first metal bumps on a first surface, and a plurality of second metal bumps on a second surface, wherein at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps, comprises a solder. The method also includes forming a metal region including indium and tin, on at least one of (i) the plurality of first metal bumps, and (ii) the plurality of second metal bumps. The method also includes positioning the first metal bumps on the second metal bumps, and heating the metal bumps and the metal region and melting the solder. Other embodiments are described and claimed.

Abstract translation: 描述了用于制造电子设备的电子设备和方法。 一种方法包括在第一表面上设置多个第一金属凸块，以及在第二表面上设置多个第二金属凸块，其中，（i）多个第一金属凸块中的至少一个，以及（ii）多个第二金属凸块 金属凸块，包括焊料。 该方法还包括在（i）多个第一金属凸块和（ii）多个第二金属凸块中的至少一个上形成包括铟和锡的金属区域。 该方法还包括将第一金属凸块定位在第二金属凸块上，并加热金属凸块和金属区域并熔化焊料。 描述和要求保护其他实施例。