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    Trenched-bonding-dam device and manufacturing method for same
    11.
    发明授权
    Trenched-bonding-dam device and manufacturing method for same 有权

    公开(公告)号：US10157943B2

    公开(公告)日：2018-12-18

    申请号：US15004584

    申请日：2016-01-22

    Applicant: OmniVision Technologies, Inc.

    Inventor： Teng-Sheng Chen ,  Chih-Hung Tu ,  Kuei-Cheng Liang ,  Chia-Yang Chang

    IPC: H01L27/146 ,  H01L23/544

    Abstract: Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner and outer dams. The device may further include an optics system including a lens and an adhesive positioned within a bonding region between a bottom surface of the optics system and a top surface of at least one of the inner and outer dams. The trench may be dimensioned to receive a portion of the excess adhesive flowing laterally out of the bonding region during bonding of the substrate to the optics system, laterally confining the excess adhesive and reducing lateral bleeding of the adhesive.

    Protective caps for small image sensor masking and mounting process
    12.
    发明授权
    Protective caps for small image sensor masking and mounting process 有权

    公开(公告)号：US10121820B1

    公开(公告)日：2018-11-06

    申请号：US15655494

    申请日：2017-07-20

    Applicant: OmniVision Technologies, Inc.

    Inventor： Teng-Sheng Chen ,  Yuan-Wen Cheng ,  Chia-Yang Chang ,  Yi Qin ,  Wen-Jian Xia

    IPC: A61B1/00 ,  H01L27/146 ,  A61B1/04

    Abstract: A method of processing an image sensor system, comprising steps of placing a first cover member on top of an image sensor; coating the image sensor and the first cover member with a dark coating agent; removing the first cover member from the image sensor; placing a second cover member on top of the image sensor; affixing the image sensor on to a permanent mount to form an electrical coupling between the image sensor and the permanent mount; removing the second cover member from the image sensor; wherein the first cover member completely covers a top portion of the image sensor; and wherein the second cover member includes an internal rib configured to form a contact seal with the image sensor.

    Interposer And Chip-Scale Packaging For Wafer-Level Camera
    14.
    发明申请
    Interposer And Chip-Scale Packaging For Wafer-Level Camera 审中-公开

    公开(公告)号：US20170294477A1

    公开(公告)日：2017-10-12

    申请号：US15091753

    申请日：2016-04-06

    Applicant: OmniVision Technologies, Inc.

    Inventor： Teng-Sheng Chen ,  Chia-Yang Chang ,  Yi Qin

    IPC: H01L27/146

    CPC classification number: H01L27/14685 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14687

    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.

    Optical Assemblies Including Dry Adhesive Layers And Associated Methods
    15.
    发明申请
    Optical Assemblies Including Dry Adhesive Layers And Associated Methods 有权
    光学组件包括干胶层和相关方法

    公开(公告)号：US20160276502A1

    公开(公告)日：2016-09-22

    申请号：US14659596

    申请日：2015-03-16

    Applicant: OmniVision Technologies, Inc.

    Inventor： Chun-Shan Huang ,  Chia-Yang Chang

    IPC: H01L31/0232 ,  H01L27/146 ,  H01L31/18

    CPC classification number: H01L31/02325 ,  H01L27/14625 ,  H01L31/18 ,  Y02P70/521

    Abstract: An optical assembly includes an image sensor, a lens module disposed over the image sensor in a first direction, a transparent glue layer, and a transparent dry adhesive layer formed of a different material than the transparent glue layer. Each of the transparent glue layer and the transparent dry adhesive layer are disposed between the image sensor and the lens module in the first direction. Each of the transparent glue layer and the transparent dry adhesive layer are optically coupled in series with the image sensor and the lens module. A method for forming an optical assembly includes joining an image sensor and a lens module using a transparent glue layer and a transparent dry adhesive layer formed of a different material than the transparent glue layer.

    Abstract translation: 光学组件包括图像传感器，在第一方向上设置在图像传感器上方的透镜模块，透明胶层和由透明胶层形成的透明干燥粘合剂层。 透明胶层和透明干粘合层中的每一个沿着第一方向设置在图像传感器和透镜模块之间。 每个透明胶层和透明干粘合剂层与图像传感器和透镜模块串联光学耦合。 一种用于形成光学组件的方法，包括使用透明胶层和透明干燥粘合剂层连接图像传感器和透镜模块，该透明干燥粘合剂层由与透明胶层不同的材料形成。

    Apparatus and method for molding optical lense during a puddle dispensing process
    16.
    发明授权
    Apparatus and method for molding optical lense during a puddle dispensing process 有权
    在水坑分配过程中模制光学透镜的装置和方法

    公开(公告)号：US09151878B2

    公开(公告)日：2015-10-06

    申请号：US14028076

    申请日：2013-09-16

    Applicant: OmniVision Technologies, Inc.

    Inventor： Huiyan Neo ,  Regis Sh-Louen Fan ,  Chia-Yang Chang

    IPC: G02B27/10 ,  G02B3/00 ,  B29C33/42 ,  B29C39/02 ,  B29D11/00 ,  B29L11/00

    CPC classification number: G02B3/0037 ,  B29C33/42 ,  B29C39/026 ,  B29D11/00298 ,  B29D11/0048 ,  B29L2011/0016 ,  G02B3/0031

    Abstract: An optical mold including a spacer cavity portion, a lens cavity portion and a flow stop control portion for allowing optical lens material to flow between the spacer cavity portion and the lens cavity portion and an optical lens array formed therefrom. The optical mold may further include a pedestal located within the spacer cavity portion for supporting the mold during a puddle dispensing process. A method for using the optical mold including the spacer cavity portion, the lens cavity portion, and the flow cavity portion, and optionally the pedestal.

    Abstract translation: 一种光学模具，包括间隔空腔部分，透镜腔部分和用于允许光学透镜材料在间隔空腔部分和透镜腔部分之间流动的流动停止控制部分和由其形成的光学透镜阵列。 光学模具还可以包括位于间隔空腔部分内的基座，用于在熔池分配过程期间支撑模具。 一种使用包括间隔件空腔部分，透镜腔部分和流动空腔部分的光学模具以及可选的底座的方法。

    Interposer and chip-scale packaging for wafer-level camera
    17.
    发明授权
    Interposer and chip-scale packaging for wafer-level camera 有权

    公开(公告)号：US10734437B2

    公开(公告)日：2020-08-04

    申请号：US16267370

    申请日：2019-02-04

    Applicant: OmniVision Technologies, Inc.

    Inventor： Teng-Sheng Chen ,  Chia-Yang Chang ,  Yi Qin

    IPC: H01L27/146

    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.

    Interposer and chip-scale packaging for wafer-level camera
    18.
    发明授权
    Interposer and chip-scale packaging for wafer-level camera 有权

    公开(公告)号：US10217789B2

    公开(公告)日：2019-02-26

    申请号：US15091753

    申请日：2016-04-06

    Applicant: OmniVision Technologies, Inc.

    Inventor： Teng-Sheng Chen ,  Chia-Yang Chang ,  Yi Qin

    IPC: H01L27/146

    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.

    Trenched-substrate based lens manufacturing methods, and associated systems
    20.
    发明授权
    Trenched-substrate based lens manufacturing methods, and associated systems 有权

    公开(公告)号：US09952415B2

    公开(公告)日：2018-04-24

    申请号：US14693014

    申请日：2015-04-22

    Applicant: OmniVision Technologies, Inc.

    Inventor： Shao Fan Kao ,  Chia-Yang Chang

    IPC: G02B13/00 ,  B29D11/00 ,  G02B3/00

    CPC classification number: G02B13/0085 ,  B29D11/00307 ,  G02B3/0031 ,  G02B3/0062 ,  G02B3/0068 ,  G02B3/0075

    Abstract: A trenched-substrate based lens manufacturing method includes depositing lens material on a first side of a substrate, wherein the first side of the substrate has a plurality of trenches. The method further includes shaping a plurality of lens elements from the lens material. The method includes shaping the plurality of lens elements, on a respective plurality of surface portions of the first side, by contacting a mold to the first side. Each of the surface portions are adjacent a respective one of the trenches. Additionally, the method includes accommodating an excess portion of the lens material in the trenches. A lens system, manufactured using this method, includes a substrate with a planar surface and a trench embedded in the planar surface. The lens system further includes a lens element molded on the planar surface adjacent to the trench.

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