Abstract:
Saturation of nonlinear ferromagnetic core material for on-chip inductors for high current applications is significantly reduced by providing a core design wherein magnetic flux does not form a closed loop, but rather splits into multiple sub-fluxes that are directed to cancel each other. The design enables high on-chip inductance for high current power applications.
Abstract:
Methods for forming multiple inductors on a semiconductor wafer are described. A plating layer and a photoresist layer are applied over a semiconductor wafer. Recess regions are etched in the photoresist layer using photolithographic techniques, which exposes portions of the underlying plating layer. Metal is electroplated into the recess regions in the photoresist layer to form multiple magnetic core inductor members. A dielectric insulating layer is applied over the magnetic core inductor members. Additional plating and photoresist layers are applied over the dielectric insulating layer. Recess regions are formed in the newly applied photoresist layer. Electroplating is used to form inductor windings in the recess regions. Optionally, a magnetic paste can be applied over the inductor coils.
Abstract:
In an ESD protection circuit for an EEPROM erase pin a snapback device is provided for discharging high ESD currents, whereas the snapback device is operated in active mode during low voltage electrical overstress and to discharge post ESD event current by connecting an RC circuit over the control electrode of the snapback device. In order to handle high voltage normal operating conditions the snapback device is deactivated once VDD is applied by pulling the control electrode to ground using a VDD controlled switch.
Abstract:
A method of erasing an NVM cell structure formed on a deep well of N-type semiconductor material, wherein the NVM cell structure includes a PMOS transistor formed in an N-type well, the PMOS transistor including spaced-apart p-type source and drain regions defining an n-type channel region therebetween, an NMOS transistor formed in a P-type well that is adjacent to the N-type well, the NMOS transistor including spaced-apart n-type source and rain regions defining a p-type channel region therebetween, a conductive floating gate that includes a first section that extends over the n-type channel region of the PMOS transistor and is separated therefrom by intervening dielectric material and a second section that extends over the p-type channel region and is separated therefrom by intervening dielectric material, and a conductive control gate formed over at least a portion of the second section of the floating gate and separated therefrom by intervening dielectric material, the erasing method comprising: biasing the deep N-type well at a selected erase voltage; holding the source and drain regions of the PMOS transistor at the erase voltage or floating; and holding the control gate at ground for a preselected erase time.
Abstract:
In a method and structure for current balancing the emitter current in a multi-finger n-emitter of a BJT or BSCR, back-end or polysilicon resistors are applied between the emitter fingers and the power rail, with the resistors chosen to be larger the closer the emitter fingers are to the collector.
Abstract:
In a grid-tie inverter, the DC input is phase and pulse-width modulated to define multiple phase shifted voltage pulses with the width of each pulse being modulated according to the grid AC amplitude for the corresponding portion of the AC phase.
Abstract:
In an NMOS active clamp device and an NMOS active clamp array with multiple source and drain contacts, the robustness against ESD events is increased by reducing channel resistance through the inclusion of one or more p+ regions formed at least partially in the source and electrically connected to the one or more source contacts.
Abstract:
The loss of photogenerated electrons to surface electron-hole recombination sites is minimized by utilizing a first p-type surface region to form a depletion region that functions as a first barrier that repels photogenerated electrons from the surface recombination sites, and a second p-type surface region that provides a substantial change in the dopant concentration.
Abstract:
In a dual direction ESD protection structure, first and second NMOS devices are serially connected back-to-back by connecting their drains or their sources using a common floating interconnect, while ensuring that the devices remain isolated from each other.
Abstract:
An NLDMOS SCR device based on an LDMOS fabrication process includes a dual gate to provide controllable switching characteristics to allow it to be used for ESD protection of fast switching voltage regulators.