Optical apertures for reducing spontaneous emissions in photodiodes
    11.
    发明授权
    Optical apertures for reducing spontaneous emissions in photodiodes 有权
    用于减少光电二极管自发辐射的光学孔

    公开(公告)号:US07418021B2

    公开(公告)日:2008-08-26

    申请号:US11026355

    申请日:2004-12-30

    IPC分类号: H01S5/00

    摘要: An optical structure that reduces the effects of spontaneous emissions from the active region of a laser. An optical structure includes optimizations to reduce the effects of spontaneous emissions. The optical structure includes a VCSEL with top and bottom DBR mirrors and an active region connected to the mirrors. The optical structure further includes a photodiode connected to the VCSEL. One or more optimizations may be included in the optical structure including optically absorbing materials, varying the geometry of the structure to change reflective angles, using optical apertures, changing the reflectivity of one or more mirrors, changing the photodiode to be more impervious to spontaneous emissions, and using ion implants to reduce photoluminescence efficiency.

    摘要翻译: 一种降低激光器有源区自发发射效应的光学结构。 光学结构包括优化以减少自发辐射的影响。 光学结构包括具有顶部和底部DBR反射镜的VCSEL和连接到反射镜的有源区域。 光学结构还包括连接到VCSEL的光电二极管。 可以在光学结构中包括一个或多个优化,包括光学吸收材料,改变结构的几何形状以改变反射角度,使用光学孔径,改变一个或多个反射镜的反射率,将光电二极管改变为对自发辐射更为不透明 ,并使用离子注入来降低光致发光效率。

    PROVIDING CURRENT CONTROL OVER WAFER BORNE SEMICONDUCTOR DEVICES USING TRENCHES
    12.
    发明申请
    PROVIDING CURRENT CONTROL OVER WAFER BORNE SEMICONDUCTOR DEVICES USING TRENCHES 有权
    通过使用TRENCHES的波形BORNE半导体器件提供电流控制

    公开(公告)号:US20100264511A1

    公开(公告)日:2010-10-21

    申请号:US10486780

    申请日:2002-08-12

    IPC分类号: H01L29/06 H01L21/762

    摘要: Disclosed are methods for providing wafer parasitic current control to a semiconductor wafer (1500) having a sub-state (1520), at least one active layer (1565) and a surface layer (1510), and electrical contacts (1515) formed on said surface layer (1510). Current control can be achieved with the formation of trenches (1525) around electrical contacts, where electrical contacts and associated layers define an electronic device. Insulating implants (1530) can be placed into trenches (1525) and/or sacrificial layers (1540) can be formed between electronic contacts (1515). Trenches control current by promoting current flow within active (e.g., conductive) regions (1560) and impeding current flow through inactive (e.g., nonconductive) regions (1550). Methods of and systems for wafer level burn-in (WLBI) of semiconductor devices are also disclosed. Current control at the wafer level is important when using WLBI methods and systems.

    摘要翻译: 公开了一种用于向具有子状态(1520),至少一个有源层(1565)和表面层(1510)的半导体晶片(1500)提供晶片寄生电流控制的方法,以及形成在所述 表面层(1510)。 可以通过在电触点周围形成沟槽(1525)来实现电流控制,其中电触点和相关层限定电子装置。 绝缘植入物(1530)可以放置在沟槽(1525)中,并且可以在电子触点(1515)之间形成牺牲层(1540)。 沟槽通过促进在有源(例如,导电)区域(1560)内的电流流动并阻止电流通过非活性(例如非导电)区域(1550)来控制电流。 还公开了半导体器件的晶片级老化(WLBI)的方法和系统。 使用WLBI方法和系统时,晶圆级的电流控制很重要。

    Methods of conducting wafer level burn-in of electronic devices
    13.
    发明授权
    Methods of conducting wafer level burn-in of electronic devices 有权
    进行电子器件晶圆级老化的方法

    公开(公告)号:US07700379B2

    公开(公告)日:2010-04-20

    申请号:US10486661

    申请日:2002-08-12

    IPC分类号: H01L21/66 G01R31/26

    摘要: Methods of conducting wafer level burn-in (WLBI) of semiconductor devices are presented wherein systems are provided having at least two electrodes (210, 215). Electrical bias (920) and/or thermal power (925) is applied on each side of a wafer (100) having back and front electrical contacts for semiconductor devices borne by the wafer. A pliable conductive layer (910) is described for supplying pins on the device side of a wafer with electrical contact and/or also for providing protection to the wafer from mechanical pressure being applied to its surfaces. Use of a cooling system (950) is also described for enabling the application of a uniform temperature to a wafer undergoing burn-in. Wafer level burn-in is performed by applying electrical and physical contact (915) using an upper contact plate to individual contacts for the semiconductor devices; applying electrical and physical contact using a lower contact plate (910) to a substrate surface of said semiconductor wafer; providing electrical power (920) to said semiconductor devices through said upper and lower second contact plates from a power source coupled to said upper and lower contacts plates; monitoring and controlling electrical power (935) to said semiconductor devices for a period in accordance with a specified burn-in criteria; removing electrical power at completion of said period (955); and removing electrical and physical contact to said semiconductor wafer (965).

    摘要翻译: 提供了进行半导体器件的晶片级老化(WLBI)的方法,其中提供具有至少两个电极(210,215)的系统。 电晶体(920)和/或热功率(925)施加在具有由晶片承载的半导体器件的背面和前部电触头的晶片(100)的每一侧上。 描述了一种柔性导电层(910),用于在具有电接触的晶片的器件侧上提供引脚和/或用于为施加到其表面的机械压力提供对晶片的保护。 还描述了使用冷却系统(950),以使得能够对经历老化的晶片施加均匀的温度。 通过使用上接触板向半导体器件的单个触点施加电和物理接触(915)来执行晶片级老化; 使用下接触板(910)将电和物理接触施加到所述半导体晶片的衬底表面; 通过所述上和下第二接触板从耦合到所述上和下接触板的电源向所述半导体器件提供电力(920); 根据指定的老化标准对所述半导体器件监测和控制电力(935)一段时间; 在所述期间完成时移除电力(955); 以及去除与所述半导体晶片(965)的电和物理接触。

    Mirrors for reducing the effects of spontaneous emissions in photodiodes
    15.
    发明授权
    Mirrors for reducing the effects of spontaneous emissions in photodiodes 有权
    用于减少光电二极管中自发辐射影响的镜子

    公开(公告)号:US07184455B2

    公开(公告)日:2007-02-27

    申请号:US11026385

    申请日:2004-12-30

    IPC分类号: H01S5/00

    摘要: An optical structure that reduces the effects of spontaneous emissions from the active region of a laser. An optical structure includes optimizations to reduce the effects of spontaneous emissions. The optical structure includes a VCSEL with top and bottom DBR mirrors and an active region connected to the mirrors. The optical structure further includes a photodiode connected to the VCSEL. One or more optimizations may be included in the optical structure including optically absorbing materials, varying the geometry of the structure to change reflective angles, using optical apertures, changing the reflectivity of one or more mirrors, changing the photodiode to be more impervious to spontaneous emissions, and using ion implants to reduce photoluminescence efficiency.

    摘要翻译: 一种光学结构,其减少了来自激光器的有源区域的自发辐射的影响。 光学结构包括优化以减少自发辐射的影响。 光学结构包括具有顶部和底部DBR反射镜的VCSEL和连接到反射镜的有源区域。 光学结构还包括连接到VCSEL的光电二极管。 可以在光学结构中包括一个或多个优化,包括光学吸收材料,改变结构的几何形状以改变反射角度,使用光学孔径,改变一个或多个反射镜的反射率,将光电二极管改变为更多地不自发发射 ,并使用离子注入来降低光致发光效率。

    Implant damaged oxide insulating region in vertical cavity surface emitting laser
    16.
    发明授权
    Implant damaged oxide insulating region in vertical cavity surface emitting laser 有权
    植入物在垂直腔表面发射激光器中损坏氧化物绝缘区域

    公开(公告)号:US07095771B2

    公开(公告)日:2006-08-22

    申请号:US10922028

    申请日:2004-08-19

    IPC分类号: H01S5/00

    摘要: Optical transmitters are disclosed, one example of which includes a vertical cavity surface emitting laser that includes a substrate upon which a lower mirror is disposed. In this example, a spacer is disposed between the lower mirror and an active region. Another spacer separates the active region and an upper mirror. The upper mirror includes an oxide insulating region that is damaged by ion implantation so that desirable effects are achieved with respect to lateral sheet resistance, and quantum well recombination centers in the active region.

    摘要翻译: 公开了光发射器,其一个示例包括垂直腔表面发射激光器,其包括其上设置有下反射镜的衬底。 在该示例中,间隔件设置在下反射镜和有源区域之间。 另一个隔离物分离有源区域和上反射镜。 上反射镜包括通过离子注入而损坏的氧化物绝缘区域,从而在有源区域中获得关于侧向薄层电阻和量子阱复合中心的期望效果。

    Providing current control over wafer borne semiconductor devices using overlayer patterns
    17.
    发明授权
    Providing current control over wafer borne semiconductor devices using overlayer patterns 有权
    使用覆盖图案提供对晶圆传输半导体器件的电流控制

    公开(公告)号:US08039277B2

    公开(公告)日:2011-10-18

    申请号:US10486665

    申请日:2002-08-12

    IPC分类号: G01R31/26 H01L21/66

    摘要: Disclosed are methods for providing wafer parasitic current control to a semiconductor wafer (1240) having a substrate (1240), at least one active layer (1240) and at least one surface layer (1240), Current control can be achieved through the formation of patterns (1240) surrounding contacts (1215), said patterns (1240) including insulating implants and/or sacrificial layers formed between active devices represented by said contacts (1215). Current flows through active regions (1260) associated with said contacts (1215) and active devices. Methods of and systems for wafer level burn-in (WLBI) of semiconductor devices are also disclosed. Current control at the wafer level is important when using WLBI methods and systems.

    摘要翻译: 公开了用于向具有衬底(1240),至少一个有源层(1240)和至少一个表面层(1240)的半导体晶片(1240)提供晶片寄生电流控制的方法,电流控制可以通过形成 围绕触点(1215)的图案(1240),所述图案(1240)包括在由所述触点(1215)表示的有源器件之间形成的绝缘植入物和/或牺牲层。 电流流过与所述触点(1215)和有源器件相关联的有源区(1260)。 还公开了半导体器件的晶片级老化(WLBI)的方法和系统。 使用WLBI方法和系统时,晶圆级的电流控制很重要。

    Geometric optimizations for reducing spontaneous emissions in photodiodes
    18.
    发明授权
    Geometric optimizations for reducing spontaneous emissions in photodiodes 有权
    减少光电二极管自发辐射的几何优化

    公开(公告)号:US07746911B2

    公开(公告)日:2010-06-29

    申请号:US11027383

    申请日:2004-12-30

    IPC分类号: H01S5/00

    摘要: An optical structure that reduces the effects of spontaneous emissions from the active region of a laser. An optical structure includes optimizations to reduce the effects of spontaneous emissions. The optical structure includes a VCSEL with top and bottom DBR mirrors and an active region connected to the mirrors. The optical structure further includes a photodiode connected to the VCSEL. One or more optimizations may be included in the optical structure including optically absorbing materials, varying the geometry of the structure to change reflective angles, using optical apertures, changing the reflectivity of one or more mirrors, changing the photodiode to be more impervious to spontaneous emissions, and using ion implants to reduce photoluminescence efficiency.

    摘要翻译: 一种降低激光器有源区自发发射效应的光学结构。 光学结构包括优化以减少自发辐射的影响。 光学结构包括具有顶部和底部DBR反射镜的VCSEL和连接到反射镜的有源区域。 光学结构还包括连接到VCSEL的光电二极管。 可以在光学结构中包括一个或多个优化,包括光学吸收材料,改变结构的几何形状以改变反射角度,使用光学孔径,改变一个或多个反射镜的反射率,将光电二极管改变为对自发辐射更为不透明 ,并使用离子注入来降低光致发光效率。

    Optimizing mirror reflectivity for reducing spontaneous emissions in photodiodes
    19.
    发明授权
    Optimizing mirror reflectivity for reducing spontaneous emissions in photodiodes 有权
    优化镜面反射率,以减少光电二极管中的自发辐射

    公开(公告)号:US07366217B2

    公开(公告)日:2008-04-29

    申请号:US11027717

    申请日:2004-12-30

    IPC分类号: H01S5/00 H01S3/06

    摘要: An optical structure that reduces the effects of spontaneous emissions from the active region of a laser. An optical structure includes optimizations to reduce the effects of spontaneous emissions. The optical structure includes a VCSEL with top and bottom DBR mirrors and an active region connected to the mirrors. The optical structure further includes a photodiode connected to the VCSEL. One or more optimizations may be included in the optical structure including optically absorbing materials, varying the geometry of the structure to change reflective angles, using optical apertures, changing the reflectivity of one or more mirrors, changing the photodiode to be more impervious to spontaneous emissions, and using ion implants to reduce photoluminescence efficiency.

    摘要翻译: 一种降低激光器有源区自发发射效应的光学结构。 光学结构包括优化以减少自发辐射的影响。 光学结构包括具有顶部和底部DBR反射镜的VCSEL和连接到反射镜的有源区域。 光学结构还包括连接到VCSEL的光电二极管。 可以在光学结构中包括一个或多个优化,包括光学吸收材料,改变结构的几何形状以改变反射角度,使用光学孔径,改变一个或多个反射镜的反射率,将光电二极管改变为更多地不自发发射 ,并使用离子注入来降低光致发光效率。

    Methods for identifying and removing an oxide-induced dead zone in a semiconductor device structure
    20.
    发明授权
    Methods for identifying and removing an oxide-induced dead zone in a semiconductor device structure 失效
    用于识别和去除半导体器件结构中的氧化物诱导死区的方法

    公开(公告)号:US06949473B2

    公开(公告)日:2005-09-27

    申请号:US10156324

    申请日:2002-05-24

    IPC分类号: H01S5/183 H01S5/20 H01L21/31

    CPC分类号: H01S5/18313 H01S5/2068

    摘要: A method and system for identifying and/or removing an oxide-induced dead zone in a VCSEL structure is disclosed herein. In general, a VCSEL structure can be formed having at least one oxide layer and an oxide-induced dead zone thereof. A thermal annealing operation can then be performed upon the VCSEL structure to remove the oxide-induced dead zone, thereby permitting oxide VCSEL structures thereof to be reliably and consistently fabricated. An oxidation operation may initially be performed upon the VCSEL structure to form the oxide layer and the associated oxide-induced dead zone. The thermal annealing operation is preferably performed upon the VCSEL after performing a wet oxidation operation upon the VCSEL structure.

    摘要翻译: 本文公开了用于识别和/或去除VCSEL结构中的氧化物诱导死区的方法和系统。 通常,可以形成具有至少一个氧化物层和氧化物诱导的死区的VCSEL结构。 然后可以在VCSEL结构上进行热退火操作以去除氧化物诱导的死区,从而允许可靠且一致地制造其氧化物VCSEL结构。 最初可以在VCSEL结构上进行氧化操作以形成氧化物层和相关联的氧化物诱导的死区。 优选在对VCSEL结构进行湿氧化操作之后,对VCSEL执行热退火操作。