公开(公告)号：US20180188157A1

公开(公告)日：2018-07-05

申请号：US15740477

申请日：2016-05-25

Applicant: Robert Bosch GmbH

Inventor： Mike Schwarz ,  Thomas Friedrich ,  Timon Brueckner

IPC: G01N21/25 ,  G01N21/3504 ,  G01N21/31 ,  G01N33/00

CPC classification number: G01N21/255 ,  G01J3/36 ,  G01J3/42 ,  G01J2003/1213 ,  G01N21/031 ,  G01N21/314 ,  G01N21/3504 ,  G01N33/004 ,  G01N2021/3137 ,  G01N2021/3166

Abstract: A sensor apparatus having a sensor unit. The sensor unit including pixel assemblages on a substrate upper side of a substrate located on a lower side of the sensor unit; a cap, on the substrate upper side, which covers the pixel assemblages, a cavity being formed between the substrate upper side and the cap; a plurality of filters that are transparent to wavelength regions that differ from one another, exactly one pixel assemblage being associated with each filter; and the filters being on the cap so that the infrared radiation propagated through an absorption gap of the sensor apparatus and the upper side of the sensor unit is detectable, through the respective filter, by the pixel assemblage associated with the respective filter; and a coating made of a light-absorbing and/or light-reflecting material being configured at least locally on a part of the cap which is not covered by the filters.

公开(公告)号：US12145840B2

公开(公告)日：2024-11-19

申请号：US17291864

申请日：2020-01-20

Applicant: Robert Bosch GmbH

Inventor： Arne Dannenberg ,  Mike Schwarz

IPC: B81B7/00 ,  G01K7/01 ,  G01L9/06

Abstract: A MEMS sensor. The MEMS sensor includes a deflectably situated functional layer, a conversion device for converting a deflection of the functional layer into an electrical signal, the conversion device including at least one electrical element, the at least one electrical element being at least partially electrically connected to a first area, and the first area being at least partially electrically connected to a second area, and the first and second areas and/or the first area and the at least one electrical element being electrically operable in a reverse direction and a forward direction, and a control unit, the control unit being designed to at least partially operate the at least one electrical element and the first area and/or the first area and the second area in the forward direction to provide thermal energy.

公开(公告)号：US11608264B2

公开(公告)日：2023-03-21

申请号：US16477279

申请日：2017-12-15

Applicant: Robert Bosch GmbH

Inventor： Arne Dannenberg ,  Mike Schwarz ,  Thomas Friedrich

IPC: B81C1/00 ,  B81B7/02

Abstract: A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.

公开(公告)号：US11486782B2

公开(公告)日：2022-11-01

申请号：US16633266

申请日：2018-07-16

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Mike Schwarz ,  Thomas Friedrich ,  Volkmar Senz

IPC: G01L19/06 ,  B81B3/00 ,  G01L9/00 ,  B81B7/00 ,  G01R27/26 ,  G01L19/14 ,  G01N27/12 ,  G01N33/18 ,  G01N27/04 ,  G01N27/22

Abstract: A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.

公开(公告)号：US11326969B2

公开(公告)日：2022-05-10

申请号：US16471221

申请日：2017-12-08

Applicant: Robert Bosch GmbH

Inventor： Stefan Zehringer ,  Andreas Duell ,  Arne Dannenberg ,  Helmut Grutzeck ,  Jochen Franz ,  Mike Schwarz ,  Soeren Zimmermann ,  Stephan Oppl

IPC: G01L9/00 ,  B81B3/00

Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

公开(公告)号：US11060937B2

公开(公告)日：2021-07-13

申请号：US16488470

申请日：2018-02-21

Applicant: Robert Bosch GmbH

Inventor： Ferenc Lukacs ,  Arne Dannenberg ,  Friedjof Heuck ,  Helmut Grutzeck ,  Mike Schwarz ,  Robert Maul ,  Tamas Dögei ,  Thomas Friedrich ,  Volkmar Senz

IPC: G01L19/14 ,  G01L19/06 ,  G01L9/06 ,  G01L9/00 ,  G01L19/00

Abstract: A micromechanical pressure sensor, having—a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and—a pressure sensor frame; and—a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

公开(公告)号：US10775253B2

公开(公告)日：2020-09-15

申请号：US16330552

申请日：2017-08-24

Applicant: Robert Bosch GmbH

Inventor： Heiko Stahl ,  Arne Dannenberg ,  Daniel Haug ,  Daniel Kaercher ,  Michaela Mitschke ,  Mike Schwarz ,  Timo Lindemann

IPC: H01L29/84 ,  G01L9/00 ,  H01L41/27 ,  B81B3/00 ,  B81C1/00

Abstract: A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.