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公开(公告)号：US10442681B2
公开(公告)日：2019-10-15
申请号：US15887567
申请日：2018-02-02
Applicant: Robert Bosch GmbH
Inventor： Daniel Haug , Hans-Peter Baer , Mike Schwarz , Volkmar Senz
Abstract: A micromechanical system including a sensitive element, the system including a first area in which the sensitive element is situated, and a second area which at least partially surrounds the first area. Furthermore, the system includes a holding element having an elastic property, which joins the first area to the second area, and a joining material, with the aid of which the second area may be joined to a substrate. A spacing area is provided between the first area and the second area. The joining material extends into the spacing area so that a possible movement of the first area caused by the elastic property of the holding element is limited.
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公开(公告)号：US20210130168A1
公开(公告)日：2021-05-06
申请号：US16477279
申请日：2017-12-15
Applicant: Robert Bosch GmbH
Inventor： Arne Dannenberg , Mike Schwarz , Thomas Friedrich
Abstract: A method for manufacturing a substrate including a region, which is mechanically decoupled from a support and has at least one component situated on the region; at least one recess being introduced on a front side of the substrate; an etching pattern being prepared on a back side of the substrate and etched anisotropically in such a manner, that vertical channels are produced on the back side of the substrate; and subsequently, a cavity being introduced at the back side of the substrate; the at least one recess on the front side of the substrate being connected to the cavity on the back side of the substrate; and in at least one region between the front side of the substrate and the cavity, at least two recesses or at least two segments of a recess being interconnected by at least one channel.
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公开(公告)号：US20210131897A1
公开(公告)日：2021-05-06
申请号：US16633266
申请日：2018-07-16
Applicant: Robert Bosch GmbH
Inventor： Friedjof Heuck , Mike Schwarz , Thomas Friedrich , Volkmar Senz
Abstract: A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.
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4.发明申请公开(公告)号：US20200225108A1
公开(公告)日：2020-07-16
申请号：US16330552
申请日：2017-08-24
Applicant: Robert Bosch GmbH
Inventor： Heiko Stahl , Arne Dannenberg , Daniel Haug , Daniel Kaercher , Michaela Mitschke , Mike Schwarz , Timo Lindemann
Abstract: A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.
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公开(公告)号：US20200088598A1
公开(公告)日：2020-03-19
申请号：US16471221
申请日：2017-12-08
Applicant: Robert Bosch GmbH
Inventor： Stefan Zehringer , Andreas Duell , Arne Dannenberg , Helmut Grutzeck , Jochen Franz , Mike Schwarz , Soeren Zimmermann , Stephan Oppl
Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm that spans the cavity; and a lever element that spans the diaphragm and has a first and a second end section, the end sections lying on opposite sides of a center section. A first joint element is fitted between the first end section and the substrate and a second joint element is fitted between the center section and the diaphragm, so that the lever element is able to be pivoted due to a deflection of the diaphragm. In addition, two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes of the sensors are disposed in such a way that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Moreover, the sensor includes an actuator for applying an actuating force between the lever element and the substrate.
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Patent Agency Ranking
公开(公告)号：US11952263B2
公开(公告)日：2024-04-09
申请号：US17419511
申请日：2020-02-05
Applicant: Robert Bosch GmbH
Inventor： Mike Schwarz , Pascal Gieschke , Valentina Kramer-Sinzinger
IPC: B81B3/00
CPC classification number: B81B3/0018 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/033
Abstract: A micromechanical sensor device and manufacturing method. The micromechanical sensor device is provided with a cap substrate, which has a first front side and a first back side, and which has a through-opening as a media entry region; and with a sensor substrate, which has a second front side and a second back side, and which has, on the second front side, a sensor region that is embedded in an island-like region suspended on the remaining sensor substrate. The island-like region is mechanically decoupled from the remaining sensor substrate by a lateral stress-relief trench and by a cavity situated in the sensor substrate, underneath the island-like region. The first back side is bonded to the second front side so that the through opening is situated above the sensor region. The sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially.
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公开(公告)号：US20220081281A1
公开(公告)日：2022-03-17
申请号：US17419511
申请日：2020-02-05
Applicant: Robert Bosch GmbH
Inventor： Mike Schwarz , Pascal Gieschke , Valentina Kramer-Sinzinger
IPC: B81B3/00
Abstract: A micromechanical sensor device and manufacturing method. The micromechanical sensor device is provided with a cap substrate, which has a first front side and a first back side, and which has a through-opening as a media entry region; and with a sensor substrate, which has a second front side and a second back side, and which has, on the second front side, a sensor region that is embedded in an island-like region suspended on the remaining sensor substrate. The island-like region is mechanically decoupled from the remaining sensor substrate by a lateral stress-relief trench and by a cavity situated in the sensor substrate, underneath the island-like region. The first back side is bonded to the second front side so that the through opening is situated above the sensor region. The sensor region is covered by a gel, which fills the through-opening and the stress-relief trench at least partially.
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公开(公告)号：US20220009769A1
公开(公告)日：2022-01-13
申请号：US17291864
申请日：2020-01-20
Applicant: Robert Bosch GmbH
Inventor： Arne Dannenberg , Mike Schwarz
Abstract: The invention relates to a MEMS sensor, including a deflectably situated functional layer, a conversion device for converting a deflection of the functional layer into an electrical signal, the conversion device including at least one electrical element, the at least one electrical element being at least partially electrically connected to a first area, and the first area being at least partially electrically connected to a second area, and the first and second areas and/or the first area and the at least one electrical element being electrically operable in a reverse direction and a forward direction, and a control unit, the control unit being designed to at least partially operate the at least one electrical element and the first area and/or the first area and the second area in the forward direction to provide thermal energy.
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公开(公告)号：US10914675B2
公开(公告)日：2021-02-09
申请号：US15740477
申请日：2016-05-25
Applicant: Robert Bosch GmbH
Inventor： Mike Schwarz , Thomas Friedrich , Timon Brueckner
Abstract: A sensor apparatus having a sensor unit. The sensor unit including pixel assemblages on a substrate upper side of a substrate located on a lower side of the sensor unit; a cap, on the substrate upper side, which covers the pixel assemblages, a cavity being formed between the substrate upper side and the cap; a plurality of filters that are transparent to wavelength regions that differ from one another, exactly one pixel assemblage being associated with each filter; and the filters being on the cap so that the infrared radiation propagated through an absorption gap of the sensor apparatus and the upper side of the sensor unit is detectable, through the respective filter, by the pixel assemblage associated with the respective filter; and a coating made of a light-absorbing and/or light-reflecting material being configured at least locally on a part of the cap which is not covered by the filters.
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10.发明申请公开(公告)号：US20180237290A1
公开(公告)日：2018-08-23
申请号：US15887567
申请日：2018-02-02
Applicant: Robert Bosch GmbH
Inventor： Daniel Haug , Hans-Peter Baer , Mike Schwarz , Volkmar Senz
CPC classification number: B81B3/0072 , B81B7/0016 , B81B2201/0235 , B81B2203/0127 , B81C1/00666 , B81C2201/0132 , B81C2203/0118 , B81C2203/032
Abstract: A micromechanical system including a sensitive element, the system including a first area in which the sensitive element is situated, and a second area which at least partially surrounds the first area. Furthermore, the system includes a holding element having an elastic property, which joins the first area to the second area, and a joining material, with the aid of which the second area may be joined to a substrate. A spacing area is provided between the first area and the second area. The joining material extends into the spacing area so that a possible movement of the first area caused by the elastic property of the holding element is limited.
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