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    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    11.
    发明申请
    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130250480A1

    公开(公告)日：2013-09-26

    申请号：US13671419

    申请日：2012-11-07

    Applicant: SAMSUNG ELECTRO-MECHANICS

    Inventor： Chul Soon AHN ,  Jae Yeol CHOI ,  Jae Hyuk SHIM ,  Young Sook LEE ,  Hye Young CHOI ,  Eun Young NA

    IPC: H01G4/12

    CPC classification number: H01G4/129 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

    Abstract: There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.

    Abstract translation: 提供了一种多层陶瓷电子部件，其包括：层叠有多个电介质层的陶瓷烧结体; 形成在陶瓷烧结体中的第一和第二内部电极; 第一和第二外部电极，其形成在陶瓷烧结体的两端，同时覆盖其周围，并且电连接到第一和第二内部电极; 以及包括玻璃成分并形成在陶瓷烧结体的外表面与第一外部电极和第二外部电极的端部之间的间隙中的密封部。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    12.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20200075255A1

    公开(公告)日：2020-03-05

    申请号：US16274771

    申请日：2019-02-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Gwang Hyeon PARK ,  Jang Yeol LEE ,  Yong PARK ,  Hye Young CHOI ,  Jong Ho LEE ,  Ji Hong JO

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/248 ,  H01G4/008

    Abstract: A multilayer ceramic electronic component includes a ceramic body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween, and first and second external electrodes disposed on outer surfaces of the ceramic body. The first and second external electrodes include, respectively, first and second base electrode layers and first and second plating layers. The first and second plating or base electrodes layers have at least one hole positioned in at least one corner of the ceramic body, and the hole includes a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending ina thickness direction and drawn through an end in a width direction of an exposed edge of one of the first and second internal electrodes exposed in a surface in which first or second internal electrodes contact first or second external electrodes.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    13.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20190180941A1

    公开(公告)日：2019-06-13

    申请号：US16281825

    申请日：2019-02-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Young CHOI ,  Jae Yeol CHOI ,  Hyun Hee GU ,  Bum Su KIM

    IPC: H01G4/30 ,  H01G4/232

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8≤T2/T1≤1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.

    CAPACITOR AND METHOD OF MANUFACTURING SAME
    15.
    发明申请
    CAPACITOR AND METHOD OF MANUFACTURING SAME 审中-公开

    公开(公告)号：US20180226192A1

    公开(公告)日：2018-08-09

    申请号：US15944376

    申请日：2018-04-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Young CHOI ,  Jae Yeol CHOI ,  Hyun Hee GU ,  Bum Su KIM

    IPC: H01G4/005 ,  H01G4/30 ,  H01G4/232

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232

    Abstract: A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion exposed to the second surface, a first external electrode and a second external electrode formed on the second surface of the body, and electrically connected to the first internal electrode and the second internal electrode, respectively, and dummy electrodes formed on the third surface and the fourth surface of the body and extending from edges at which the second surface meets the third surface and the fourth surface.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    17.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20170287640A1

    公开(公告)日：2017-10-05

    申请号：US15398264

    申请日：2017-01-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hye Young CHOI ,  Jae Yeol CHOI ,  Hyun Hee GU ,  Bum Su KIM

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers electrically connected to the internal electrodes and the seed layers, and plating layers disposed on the seed layers and the first electrode layers, respectively, and 0.8≦T2/T1≦1.2, where T1 is a thickness of each of the first electrode layers in a central region of the ceramic body in the thickness direction, and T2 is a thickness of each of the first electrode layers at a point at which an outermost internal electrode, among the internal electrodes, is positioned.

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