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    MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME
    12.
    发明申请
    MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF, AND BOARD HAVING THE SAME 有权
    多层陶瓷电容器及其制造方法及其相关的板

    公开(公告)号：US20160005539A1

    公开(公告)日：2016-01-07

    申请号：US14527400

    申请日：2014-10-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jong Ho LEE ,  Myung Jun PARK ,  Doo Young KIM ,  Chang Hoon KIM

    IPC: H01G2/06 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/012

    CPC classification number: H01G2/065 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor may include: a ceramic body having first and second main surfaces opposing each other in a thickness direction and first and second end surfaces opposing each other in a length direction, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; a second external electrode disposed on the second end surface and having a greater thickness in a region thereof adjacent to the second main surface than in a region thereof adjacent to the first main surface; and first and second internal electrodes disposed in the ceramic body and connected to the first and second external electrodes, respectively.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其具有在厚度方向上彼此相对的第一和第二主表面以及在长度方向上彼此相对的第一和第二端面，陶瓷体的厚度大于其宽度; 第一外部电极，其设置在所述第一端面上，并且在与所述第二主表面相邻的区域中比在与所述第一主表面相邻的区域中具有更大的厚度; 第二外部电极，其设置在所述第二端面上并且在与所述第二主表面相邻的区域中具有比在与所述第一主表面相邻的区域中更大的厚度; 以及第一和第二内部电极，分别设置在陶瓷体中并连接到第一和第二外部电极。

    MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON
    14.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD WITH THE SAME MOUNTED THEREON 审中-公开
    多层陶瓷电容器及其安装的板

    公开(公告)号：US20150114701A1

    公开(公告)日：2015-04-30

    申请号：US14262345

    申请日：2014-04-25

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Hae Sock CHUNG ,  Doo Young KIM ,  Chang Hoon KIM ,  Sun Cheol LEE ,  Jong Hyun YOON ,  Ki Won KIM

    IPC: H01G4/12 ,  H01G2/06

    CPC classification number: H01G4/12 ,  H01G2/065 ,  H01G4/1227 ,  H01G4/224 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor may include a ceramic body including dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other, the dielectric layer being interposed between the first and second internal electrodes, and first and second external electrodes covering both end surfaces of the ceramic body. The ceramic body may include an active layer as a capacitance forming part and a cover layer as a non-capacitive part disposed on at least one surface of upper and lower surfaces of the active layer, the cover layer including at least one buffer layer, and when a thickness of the cover layer is defined as tc, and a thickness of the buffer layer is defined as ti, ti/tc being in a range of 0.15 to 0.90 (0.15≦ti/tc≦0.90).

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其包括电介质层，设置在陶瓷体中的第一和第二内部电极相互面对，介电层插入在第一和第二内部电极之间，第一和第二外部电极覆盖两端 陶瓷体的表面。 陶瓷体可以包括作为电容形成部分的有源层和作为设置在有源层的上表面和下表面的至少一个表面上的非电容部分的覆盖层，覆盖层包括至少一个缓冲层，以及 当覆盖层的厚度定义为tc，缓冲层的厚度定义为ti时，ti / tc在0.15〜0.90（0.15＆nlE; ti / tc＆nlE; 0.90）的范围内。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    15.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20140233149A1

    公开(公告)日：2014-08-21

    申请号：US13902628

    申请日：2013-05-24

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Byung Jun JEON ,  Kyu Ha LEE ,  Hyun Hee GU ,  Chang Hoon KIM ,  Myung Jun PARK

    IPC: H01G4/005 ,  H01G4/12

    CPC classification number: H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T≦10 μm, TA/TC>0.8, and t≦5 μm, so that a multilayer ceramic electronic component having excellent reliability may be realized.

    Abstract translation: 提供了一种多层陶瓷电子部件，其包括形成有内部电极的陶瓷体，形成在陶瓷体的外表面上并与内部电极连接的外部电极，以及形成在内部电极与内部电极之间的接触面的缓冲层 在陶瓷体的内部方向上的陶瓷体的外表面中的外部电极，其中当外部电极的厚度由T表示时，缓冲层的厚度由t表示，有源区的厚度为 由TA表示，陶瓷体的厚度由Tc，T＆nlE，10μm，TA / TC> 0.8，t＆nlE;5μm表示，可以实现具有优异的可靠性的多层陶瓷电子部件。

    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
    16.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号：US20140022692A1

    公开(公告)日：2014-01-23

    申请号：US13839781

    申请日：2013-03-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seok Hyun YOON ,  Byoung Hwa LEE ,  Chang Hoon KIM ,  Sang Hoon KWON

    IPC: H01G4/12

    CPC classification number: H01G4/12 ,  H01G4/1227 ,  H01G4/30

    Abstract: There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.

    Abstract translation: 提供层叠陶瓷电子部件及其制造方法。 层叠陶瓷电子部件包括：陶瓷体，其包括电介质层; 以及第一和第二内部电极，所述第一和第二内部电极彼此相对设置，所述陶瓷体在陶瓷体内具有介电层，其中所述陶瓷体包括作为电容形成部的有源层和形成为非电容形成部的覆盖层 在活性层的上表面和底面中的至少一个上，当陶瓷体的厚度为t，覆盖层的厚度为T时，满足T@t×0.05，当平均粒径 在有源层中的电介质晶粒为Da，覆盖层中的电介质晶粒的平均粒径为Dc，满足0.7 @ Dc / Da @ 1.5。

    MULTILAYER CERAMIC CAPACITOR AND ASSEMBLY BOARD HAVING THE SAME
    20.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND ASSEMBLY BOARD HAVING THE SAME 有权
    多层陶瓷电容器及其组装板

    公开(公告)号：US20150287533A1

    公开(公告)日：2015-10-08

    申请号：US14444587

    申请日：2014-07-28

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Jong Ho LEE ,  Doo Young KIM ,  Chang Hoon KIM ,  Myung Jun PARK

    IPC: H01G4/30 ,  H01G4/248 ,  H05K1/11 ,  H01G2/06 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/1218 ,  H01G4/232 ,  H01G4/236 ,  H01G4/248 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor may include: a ceramic body having upper and lower surfaces opposing each other in a thickness direction thereof and first and second end surfaces opposing each other in a length direction thereof, a thickness of the ceramic body being greater than a width thereof; a first external electrode disposed on the first end surface to allow a predetermined region of the first end surface adjacent to the upper surface to be exposed; a second external electrode disposed on the second end surface to allow a predetermined region of the second end surface adjacent to the upper surface to be exposed; and first and second internal electrodes disposed within the ceramic body, stacked in a width direction of the ceramic body, and connected to the first and second external electrodes, respectively.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其具有在其厚度方向上彼此相对的上表面和下表面以及在其长度方向上彼此相对的第一和第二端表面，陶瓷体的厚度大于其宽度 ; 设置在所述第一端面上以允许所述第一端面的与所述上表面相邻的预定区域被暴露的第一外部电极; 第二外部电极，设置在所述第二端面上，以允许所述第二端面的与所述上表面相邻的预定区域被露出; 以及设置在所述陶瓷体内的第一和第二内部电极，其分别在所述陶瓷体的宽度方向上层叠，并且分别与所述第一外部电极和所述第二外部电极连接。

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