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    MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230215653A1

    公开(公告)日：2023-07-06

    申请号：US17890615

    申请日：2022-08-18

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Ha Jeong KIM ,  Kangha LEE ,  Jun Hyeong KIM ,  Eui Hyun JO ,  Myung Jun PARK

    IPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G2/06

    CPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008 ,  H01G2/065

    摘要： A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.

    MULTILAYER ELECTRONIC COMPONENT
    5.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230238182A1

    公开(公告)日：2023-07-27

    申请号：US17943606

    申请日：2022-09-13

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Hyung Jong CHOI ,  Yoo Jeong LEE ,  Chung Yeol LEE ,  Kwang Yeun WON ,  So Jung AN ,  Kang Ha LEE ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

    IPC分类号： H01G4/224 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

    CPC分类号： H01G4/224 ,  H01G4/30 ,  H01G4/248 ,  H01G4/2325

    摘要： A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

    MULTILAYER ELECTRONIC COMPONENT
    6.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230223195A1

    公开(公告)日：2023-07-13

    申请号：US17972722

    申请日：2022-10-25

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Hyung Jong CHOI ,  Yoo Jeong LEE ,  Chung Yeol LEE ,  Kwang Yeun WON ,  So Jung AN ,  Kang Ha LEE ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

    IPC分类号： H01G4/232 ,  H01G4/30 ,  H01G4/012

    CPC分类号： H01G4/2325 ,  H01G4/30 ,  H01G4/012

    摘要： A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.