公开(公告)号：US09818547B1

公开(公告)日：2017-11-14

申请号：US15486631

申请日：2017-04-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gun Jung Yoon ,  Hyun Hee Gu ,  Hye Young Choi ,  Jin Woo Lee ,  Jae Yeol Choi

IPC: H01G4/30 ,  H01G4/228 ,  H01G4/012 ,  H01G4/248 ,  H01G4/224 ,  H05K1/11 ,  H05K1/18 ,  H01G4/12

CPC classification number: H01G4/30 ,  C04B35/4686 ,  C04B35/47 ,  C04B2235/3244 ,  C04B2235/3251 ,  C04B2237/346 ,  C04B2237/68 ,  C04B2237/70 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/1254 ,  H01G4/1263 ,  H01G4/224 ,  H01G4/248 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636

Abstract: A multilayer ceramic electronic component includes a ceramic body including a plurality of dielectric layers stacked on each other and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, parallel to a stacking direction and connected to the first and second surfaces, and fifth and sixth surfaces opposing each other in a third direction and connected to the first to fourth surfaces, first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, first and second conductive thin films disposed on at least one of the third and fourth surfaces, connected to the first and second external electrodes, respectively, and having a thickness lower than that of the first and second external electrodes, and first and second solder preventing films disposed on the first and second external electrodes, respectively.

公开(公告)号：US09370102B2

公开(公告)日：2016-06-14

申请号：US13770887

申请日：2013-02-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Woo Lee ,  Eun Hyuk Chae ,  Byoung Hwa Lee

IPC: H01G4/005 ,  H05K1/18 ,  H05K1/16 ,  H01G4/30 ,  H01G4/232 ,  H01G4/12

CPC classification number: H05K1/162 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/185 ,  H05K2201/10015

Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers, having first and second lateral surfaces opposing one another, and having a thickness equal to or less than 250 μm; a first internal electrode and a second internal electrode disposed to face one another with the dielectric layer interposed therebetween; a first external electrode formed on the first lateral surface of the ceramic body and electrically connected to the first internal electrode and a second external electrode formed on the second lateral surface and electrically connected to the second internal electrode; and metal layers formed on the first external electrode and the second external electrode, respectively, and including copper (Cu), wherein when a thickness of the metal layers is tp, tp≧5 μm may be satisfied.

Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，其包括：陶瓷体，其包括电介质层，其具有彼此相对的第一和第二侧表面，并且具有等于或小于250μm的厚度; 第一内部电极和第二内部电极，其设置成彼此面对，其间插入介电层; 第一外部电极，其形成在陶瓷体的第一侧面上并电连接到第一内部电极，第二外部电极形成在第二侧面上并电连接到第二内部电极; 以及金属层，分别形成在第一外部电极和第二外部电极上，并且包括铜（Cu），其中当金属层的厚度为tp时，可以满足tp≥5μm。

公开(公告)号：US09099250B2

公开(公告)日：2015-08-04

申请号：US14067912

申请日：2013-10-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun Hyuk Chae ,  Jin Man Jung ,  Byoung Hwa Lee ,  Jin Woo Lee ,  Kyu Ree Kim

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01G4/232

Abstract: There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6.

Abstract translation: 提供一种嵌入板的多层陶瓷电容器，包括：陶瓷体; 第一和第二内部电极通过陶瓷体的端面交替地暴露; 形成在陶瓷体的端面上的第一外部电极和第二外部电极; 以及包围第一外部电极和第二外部电极的第一和第二电镀层，其中当从第一或第二外部电极的另一端的带的一端到另一端的距离为“A”时， 从第一或第二镀层的表面垂直间隔开的距离陶瓷体内部的带的一端的距离陶瓷体的长度方向3μm的点的1/2×A与陶瓷体的长度方向相交， 第二镀层为“B”，B /A≥0.6。

公开(公告)号：US08879237B2

公开(公告)日：2014-11-04

申请号：US13720171

申请日：2012-12-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Woo Lee ,  Chi Hyoun Ro ,  Yoon Hee Lee

IPC: H01G4/06 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  Y10T29/417

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.

Abstract translation: 提供了一种多层陶瓷电子部件，其包括：陶瓷体，其具有交替堆叠的电介质层和第一和第二内部电极; 以及第一和第二外部电极，电连接到第一和第二内部电极并形成在陶瓷体的两端，其中陶瓷体包括有助于电容形成的有效层和设置在上部和下部中的至少一个上的保护层 有效层的表面，保护层包括设置在其两端的一个或多个阶梯吸收层，使得多层陶瓷电子部件可以通过减少诸如电极扩散，裂纹，分层等的缺陷而具有优异的可靠性。