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11.发明公开公开(公告)号：US20230257884A1
公开(公告)日：2023-08-17
申请号：US18137062
申请日：2023-04-20
Applicant: SAMSUNG ELECTRONICS CO, LTD. , INTOPS CO, LTD.
Inventor： Chunghyo JUNG , Wonjun KO , Hyein PARK , Yongsub LEE , Jaedeok LIM , Bumjin CHO , Chiyoung YOON , Keunha KIM , Kyungha KOO , Hongki MOON
CPC classification number: C23C18/2013 , H05K5/0247 , B23C3/30 , C23C18/1651 , C23C18/1689 , B23K26/364
Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.
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12.发明公开公开(公告)号：US20230156965A1
公开(公告)日：2023-05-18
申请号：US18099522
申请日：2023-01-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Haein CHUNG , Kyungha KOO , Dongku KANG , Kangsik KIM , Wonmin KIM , Jihong KIM , Chihwan JEONG
CPC classification number: H05K7/20336 , H04M1/0283
Abstract: Disclosed is a heat-dissipating structure comprising: a case including: a first body and a second body spaced apart from each other; a wick disposed in a space between the first body and the second body, the wick including a plurality of wires arranged in a first direction and in a second direction intersecting the first direction, and having a working fluid passage formed along at least one opening formed between the plurality of wires; and a channel formed between the first body and the wick and in which the working fluid is moved through the at least one opening according to a change in state of the working fluid.
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公开(公告)号：US20230075973A1
公开(公告)日：2023-03-09
申请号：US18055271
申请日：2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki MOON , Kihyun KIM , Jae-Il SEO , Jihong KIM , Yoon-Sun PARK , Wooram LEE , Se-Young JANG , Jongchul HONG , Kyungha KOO
Abstract: According to various embodiments, a wireless charging device can comprise: a first housing, which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and includes at least one hole; a second housing arranged on the second surface of the first housing in the second direction; a coil unit arranged between the first housing and the second housing and configured to transmit power to an external device; a shielding member arranged adjacent to the coil unit and including at least one hole; and a fan arranged adjacent to the coil unit and configured to rotate.
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公开(公告)号：US20220272868A1
公开(公告)日：2022-08-25
申请号：US17673099
申请日：2022-02-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki MOON , Kyungha KOO , Yoonsun PARK , Youngjae YOU , Hyunjoo LEE , Joseph AHN
IPC: H05K7/20
Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.
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公开(公告)号：US20190364695A1
公开(公告)日：2019-11-28
申请号：US16515275
申请日：2019-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin LEE , Kyungha KOO , Chunghyo JUNG , Se-Young JANG , Jungje BANG , Jaeheung YE , Chi-Hyun CHO
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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Patent Agency Ranking
公开(公告)号：US20220330457A1
公开(公告)日：2022-10-13
申请号：US17435928
申请日：2021-09-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
Abstract: A vapor chamber and an electronic device are provided. The vapor chamber includes a first sheet including a first flat portion and a first bending portion bent, at an edge of the first flat portion, to be inclined at a first angle for the first flat portion, a second sheet including a second flat portion and a second bending portion bent, at an edge of the second flat portion, to be inclined at a second angle for the second flat portion, and a side portion formed by bonding the first bending portion and the second bending portion. A bonding surface between the first bending portion and the second bending portion may be disposed to be inclined from or perpendicular to an outer surface of the side portion.
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公开(公告)号：US20220167530A1
公开(公告)日：2022-05-26
申请号：US17534157
申请日：2021-11-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
IPC: H05K7/20 , B23K26/323 , F28D15/02 , B23K26/24
Abstract: An electronic device according to various embodiments may include: a housing, a printed circuit board disposed in the housing, an electrical element disposed on the printed circuit board, and a dissimilar metal structure disposed adjacent to the electrical element. The dissimilar metal structure may include a first metal portion comprising a first material, a second metal portion comprising a second material different from the first material, wherein at least a part of the second metal portion is bonded to the first metal portion, a vapor passage disposed in a space surrounded by the first metal portion and the second metal portion, and a wick disposed in contact with at least a part of the vapor passage in the space, wherein when viewed from above the dissimilar metal structure, a welded portion (e.g., bead) of the second metal portion, the welded portion being disposed at an interface between the first metal portion and the second metal portion, is disposed to surround at least a part of the first metal portion.
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公开(公告)号：US20210391636A1
公开(公告)日：2021-12-16
申请号：US17402055
申请日：2021-08-13
Applicant: Samsung Electronics Co., Ltd. , Amotech Co., Ltd.
Inventor： Seunghoon KANG , Jinhyoung LEE , Kyungha KOO , Jinmyoung KIM , Hongki MOON , Yoonsun PARK , Seyoung JANG , Seungjae HWANG
Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.
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公开(公告)号：US20210341229A1
公开(公告)日：2021-11-04
申请号：US17375626
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin LEE , Kyungha KOO , Chunghyo JUNG , Se-Young JANG , Jungje BANG , Jaeheung YE , Chi-Hyun CHO
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US20210161034A1
公开(公告)日：2021-05-27
申请号：US16952595
申请日：2020-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chihwan JEONG , Kyungha KOO , Jihong KIM , Dongku KANG , Kuntak KIM , Yunjeong PARK , Kyuhwan LEE , Haejin LEE , Seyoung JANG , Hyuntae JANG
Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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