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公开(公告)号:US20240255358A1
公开(公告)日:2024-08-01
申请号:US18584534
申请日:2024-02-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangmin LEE , Sungyong BANG , Sunghun JUNG , Jongwoo KIM , Hakryoul KIM , Mooyoung KIM
IPC: G01K7/42
CPC classification number: G01K7/42
Abstract: According to an embodiment, an electronic device includes: at least one first component and at least one second component arranged in an internal space of the electronic device wherein the first and second components have temperatures that vary differently depending on the operation of the electronic device, a first temperature sensor configured to measure the temperature of the at least one first component, a second temperature sensor configured to measure the temperature of the at least one second component, a memory, and at least one processor operatively connected to the at least one first component, the at least one second component, the first temperature sensor, the second temperature sensor, and the memory, wherein at least one processor is configured to: identify a prediction model related to prediction of the outside temperature stored in the memory, acquire a first temperature of the at least one first component through the first temperature sensor according to a specified period, acquire a second temperature of the at least one second component through the second temperature sensor according to a specified period, and predict the outside temperature corresponding to the acquired first temperature and the acquired second temperature based on the identified prediction model.
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公开(公告)号:US20220394870A1
公开(公告)日:2022-12-08
申请号:US17847315
申请日:2022-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seongyu HWANG , Sangmin LEE , Myungjun KIM , Jongchul CHOI
Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing defining at least one surface of the electronic device. The housing may include: a metal plate comprising at least one penetration hole, a first nonmetallic part combined with the metal plate and surrounding at least a part of a side surface of the metal plate, and a second nonmetallic part at least partially disposed in the at least one penetration hole and providing a part of the one surface.
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公开(公告)号:US20220086565A1
公开(公告)日:2022-03-17
申请号:US17533651
申请日:2021-11-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaehong JUNG , Minsoo KIM , Sangmin LEE , Jiwoo LEE
Abstract: An electronic apparatus may include: a foldable housing which includes a hinge structure that can switch the foldable housing between a folding state or an unfolding state, a first housing structure that is connected to the hinge structure and includes a first face oriented in a first direction and a second face oriented in a second direction opposite to the first direction, and a second housing structure that is connected to the hinge structure, includes a third face oriented in a third direction and a fourth face oriented in a fourth direction opposite to the third direction, and comes into contact with the first housing structure by pivoting about the hinge structure; a first display which extends from the first face to the third face and forms the first face and the third face; a second display which forms at least a portion of the fourth face; and at least one audio input device which is disposed on at least one of the second face or the fourth face.
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公开(公告)号:US20200293093A1
公开(公告)日:2020-09-17
申请号:US16804165
申请日:2020-02-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minsoo KIM , Bongsub KIM , Taewon KIM , Sangmin LEE , Jongheon LEE , Jiwoo LEE
IPC: G06F1/16
Abstract: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.
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15.
公开(公告)号:US20200150060A1
公开(公告)日:2020-05-14
申请号:US16682555
申请日:2019-11-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangmin LEE , Jinwook Jung
IPC: G01N23/18 , G01N23/083 , G01N21/95
Abstract: Provided are a non-destructive inspection system for detecting the absence or presence of an internal defect of a semiconductor wafer and a location of the internal defect in a non-destructive manner without physically deforming the semiconductor wafer, and a method of operating the non-destructive inspection system. Also provided are a non-destructive inspection system for inspecting response characteristics with respect to X-rays or gamma-rays, and a method of operating the non-destructive inspection system.
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公开(公告)号:US20180033637A1
公开(公告)日:2018-02-01
申请号:US15443370
申请日:2017-02-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam-Gun KIM , Sangmin LEE , Sinhae DO , Seok-Won CHO , Taeseop CHOI , Kon HA
IPC: H01L21/311 , H01L21/033 , G03F7/20 , H01L21/308
CPC classification number: H01L21/31116 , G03F7/70033 , H01L21/0332 , H01L21/3081 , H01L21/31144 , H01L27/10894
Abstract: Example embodiments relate to a method for fabricating a semiconductor device. The method for fabricating a semiconductor device includes stacking on a substrate an etching target layer, a first mask layer, and a photoresist layer, irradiating extreme ultraviolet (EUV) radiation on the photoresist layer to form a photoresist pattern, patterning the first mask layer to form a first mask pattern using the photoresist pattern as an etching mask, and patterning the etching target layer to form a target pattern using the first mask pattern as an etching mask. The first mask layer includes at least one of a silicon layer and a titanium oxide layer.
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公开(公告)号:US20230325293A1
公开(公告)日:2023-10-12
申请号:US18208092
申请日:2023-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangmin LEE , Sungyong BANG , Jongwoo KIM , Hakryoul KIM , Mooyoung KIM
CPC classification number: G06F11/3058 , G06F1/206
Abstract: An electronic device, including: at least one sensor; a communication circuit; a memory; and at least one processor operationally connected with the at least one sensor, the communication circuit, and the memory, wherein the at least one processor is configured to: identify an internal temperature of the electronic device using the at least sensor; provide, to an external device, internal temperature data associated with the internal temperature of the electronic device; receive a surface temperature prediction model for predicting a surface temperature of the electronic device from the external device; predict the surface temperature of the electronic device based on the surface temperature prediction model and information associated with a module location, the information being stored in the memory; and select at least one heat source to enter heating control from among a plurality of modules of the electronic device based on the predicted surface temperature.
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公开(公告)号:US20210044743A1
公开(公告)日:2021-02-11
申请号:US16647366
申请日:2018-07-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeon-Cheol JO , Hwayong KANG , Dongsoo KIM , Mingyoung PARK , Sangmin LEE , Younkwon YOON , Jonghoon WON , Kihuk LEE
Abstract: An electronic device according to various embodiments can include: a first image sensor; a second image sensor electrically connected to the first image sensor through a first designated interface; and a processor connected to the first image sensor through a second designated interface and connected to the second image sensor through a third designated interface, wherein the processor can be set to obtain, from the second image sensor, a second image outputted through the third designated interface, and obtain, from the first image sensor, a first image outputted through the second designated interface, in response to a signal provided to the first image sensor through the first designated interface at the starting time of the output of the second image.
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19.
公开(公告)号:US20200326754A1
公开(公告)日:2020-10-15
申请号:US16847794
申请日:2020-04-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minsoo KIM , Bongsub KIM , Taewon KIM , Sangmin LEE , Jongheon LEE , Jiwoo LEE
Abstract: According to an embodiment of the disclosure, an electronic device comprises a first housing structure; and a second housing structure hingedly connected to the first housing structure along a hinge axis, wherein a first surface of the first housing structure faces a first surface of the second housing structure in a folded configuration of the electronic device, and the first surface of the first housing structure and the first surface of the second housing structure are planar in an unfolded configuration of the electronic device; a first display disposed on the first surface of the first housing structure and the first surface of the second housing structure, and bendable about the hinge axis; and a sliding structure retractably disposed in the first housing structure, configured to protrude to the outside of the first housing structure in a direction substantially co-planar to the first surface of the first housing structure, the sliding structure comprising at least one optical input module facing a direction substantially orthogonal to the first surface.
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20.
公开(公告)号:US20200267295A1
公开(公告)日:2020-08-20
申请号:US16643262
申请日:2018-08-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangmin LEE , Hwayong KANG , Dongsoo KIM , Minyoung PARK , Hyeon-Cheol JO , Youngkwon YOON , Jonghoon WON , Kihuk LEE
Abstract: Provided in various embodiments are an electronic device and a method therefor, the electronic device comprising: a first image sensor; a second image sensor electrically connected through a designated interface to the first image sensor; and a processor, wherein the processor is set to determine parameter information, for controlling the first image sensor and the second image sensor, in relation to photographing and transmit the determined parameter information to the first image sensor and the second image sensor, and the first image sensor is set to transmit a reflection signal through the designated interface to the second image sensor such that the second image sensor uses the parameter information in response to the reflection signal. In addition, other embodiments are possible.
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