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公开(公告)号:US20240313189A1
公开(公告)日:2024-09-19
申请号:US18674482
申请日:2024-05-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gunwoo KIM , Seongho SON , Jongsung LEE , Changjoon LEE , Seonghwan SHIN , Tackmo LEE , Soonmin HONG
CPC classification number: H01L33/644 , H01L25/167 , H01L27/124
Abstract: A display apparatus includes: a display module array including a plurality of display modules arranged in a matrix, wherein each display module of the plurality of display modules includes: a substrate including a mounting surface and a rear surface opposite to the mounting surface; a plurality of inorganic light-emitting elements mounted on the mounting surface of the substrate; a metal plate adhered to the rear surface of the substrate and configured to dissipate heat generated by the substrate; a front cover covering the mounting surface; a first conductive layer on the mounting surface; and a second conductive layer between the front cover and the first conductive layer.
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公开(公告)号:US20240274773A1
公开(公告)日:2024-08-15
申请号:US18642363
申请日:2024-04-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Kyungwoon JANG
IPC: H01L33/62 , H01L23/00 , H01L25/075
CPC classification number: H01L33/62 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L2224/29028 , H01L2224/32225 , H01L2224/83203 , H01L2924/12041 , H01L2933/0066
Abstract: A display panel manufacturing method includes: putting a first substrate into a liquid; putting a plurality of light emitting diodes into the liquid in which the first substrate is put; performing fluidic self-assembly to attach the plurality of light emitting diodes to the first substrate; transferring the plurality of light emitting diodes attached to the first substrate to a second substrate; and thermally compressing the plurality of light emitting diodes transferred to the second substrate onto the second substrate.
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公开(公告)号:US20230103123A1
公开(公告)日:2023-03-30
申请号:US18076985
申请日:2022-12-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Seongho Son , Jongsung Lee , Wonsoon Park , Donghun Lee
IPC: H01L33/38 , H01L25/075 , H01L33/62
Abstract: A light emitting diode (LED) module includes: a substrate; a plurality of first electrodes arranged on a top surface of the substrate; a second electrode provided on the top surface of the substrate among the plurality of first electrodes; and an LED electrically connected to the plurality of first electrodes.
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公开(公告)号:US20200350476A1
公开(公告)日:2020-11-05
申请号:US16863069
申请日:2020-04-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Seongho SON , Jongsung LEE , Youngki JUNG
IPC: H01L33/62 , G02B1/14 , H01L25/075 , G09F9/302 , G09G3/32
Abstract: A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.
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公开(公告)号:US20200321229A1
公开(公告)日:2020-10-08
申请号:US16761905
申请日:2018-12-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Byunghoon LEE , Min PARK , Kyungwoon JANG , Jeonggen YOON , Hyuntae JANG
IPC: H01L21/67 , H01L25/075 , B65G47/90
Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
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公开(公告)号:US20240265839A1
公开(公告)日:2024-08-08
申请号:US18638228
申请日:2024-04-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Jinyoung KIM , Sungyong MIN , Kyungwoon JANG , Changkyu CHUNG , Daesuck HWANG
IPC: G09G3/00 , H01L25/075 , H01L33/38 , H01L33/62
CPC classification number: G09G3/006 , H01L25/0753 , H01L33/382 , H01L33/62 , G09G2330/12
Abstract: An electroluminescence inspection apparatus includes a first substrate; a plurality of electrodes provided at a first surface of the first substrate; a driving circuit provided at a second surface of the first substrate opposite of the first surface and configured to apply a current to a plurality of light emitting diodes provided at a second substrate through the plurality of electrodes; and a plurality of wirings configured to electrically connect the plurality of electrodes with the driving circuit. At least one electrode of the plurality of electrodes includes a plurality of protrusions configured to contact the plurality of light emitting diodes of the second substrate.
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公开(公告)号:US20230177986A1
公开(公告)日:2023-06-08
申请号:US17942775
申请日:2022-09-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Seongho SON , Jongsung LEE , Jinyoung KIM , Youngki JUNG
CPC classification number: G09G3/006 , G09G3/32 , G09G2300/0426 , G09G2330/04 , G09G2330/12
Abstract: A display panel in which a resistance structure is provided on a test pattern to prevent a circuit of the display panel from being damaged by static electricity introduced into the test pattern, and a display apparatus having the same are provided. The display panel includes: a substrate; a plurality of pixel circuits provided on the substrate and configured to drive a plurality of inorganic light emitting devices; a test line provided on the substrate and extending from an edge of the substrate; an insulating layer provided on the test line; and a resistance structure provided on the test line, the resistance structure including: at least two vertical interconnect accesses (vias) passing through the insulating layer; and a resistance layer provided on the insulating layer and extending between the at least two vias, wherein the at least two vias connect the test line and the resistance layer to each other, and the test line is discontinuous at an area between the at least two vias, and wherein the resistance layer is configured to receive, through one of the at least two vias, a current applied to the test line.
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公开(公告)号:US20220375908A1
公开(公告)日:2022-11-24
申请号:US17881238
申请日:2022-08-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changjoon LEE , Wonsoon PARK , Seongho SON , Jongsung LEE , Chulyong JUNG
Abstract: A display device includes a thin film transistor substrate including a mounting surface on which a plurality of electrode pads are formed, a plurality of inorganic light emitting device groups each forming a pixel and each including a plurality of inorganic light emitting devices respectively mounted on the mounting surface, and a mesh plate including a plurality of openings in which the plurality of inorganic light emitting device groups are respectively positioned, and a partition wall covering at least one portion of a non-mounted area between the plurality of inorganic light emitting device groups. The mesh plate includes an attaching surface facing the mounting surface and a reflective surface which is opposite the attaching surface. A moth eye pattern including a plurality of micro protrusions is formed on the reflective surface.
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公开(公告)号:US20210351205A1
公开(公告)日:2021-11-11
申请号:US17383992
申请日:2021-07-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungwoon JANG , Wonsoon PARK , Dongmyung SON , Sangmin SHIN , Changjoon LEE , Youngki JUNG , Seongphil CHO , Gyun HEO , Soonmin HONG
Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.
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公开(公告)号:US20200235078A1
公开(公告)日:2020-07-23
申请号:US16650578
申请日:2018-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyung Woon JANG , Hyun-Tae JANG , Youngjun MOON , Changjoon LEE
IPC: H01L25/075 , H01L33/62 , H01L33/24 , H01L27/12
Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.
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