公开(公告)号：US09374165B2

公开(公告)日：2016-06-21

申请号：US14295367

申请日：2014-06-04

Applicant: Samtec, Inc.

Inventor： Eric Zbinden ,  Randall Musser ,  Jean-Marc André Verdiell ,  John Mongold ,  Brian Vicich ,  Keith Guetig

IPC: G02B6/42 ,  H04B10/40 ,  H04B1/3827

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US08588562B2

公开(公告)日：2013-11-19

申请号：US13758464

申请日：2013-02-04

Applicant: Samtec, Inc.

Inventor： Eric Zbinden ,  Randall Musser ,  Jean-Marc André Verdiell ,  John Mongold ,  Brian Vicich ,  Keith Guetig

IPC: G02B6/12

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.

Abstract translation: 一种互连系统，包括主机电路板; 连接到主机电路板并包括第一连接器，IC电路板和IC管芯的IC封装; 以及收发器，布​​置成与第一连接器配合，使得至少一些传输到IC芯片的电信号仅在IC电路板上或通过IC电路板传输。

公开(公告)号：US10892585B2

公开(公告)日：2021-01-12

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh Shah ,  Jean Karlo Williams Barnett ,  Eric Zbinden

IPC: H01R13/631 ,  H01R13/627 ,  G02B6/42 ,  H01R12/71

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.

公开(公告)号：US09651752B2

公开(公告)日：2017-05-16

申请号：US15157548

申请日：2016-05-18

Applicant: Samtec, Inc.

Inventor： Eric Zbinden ,  Randall Musser ,  Jean-Marc André Verdiell ,  John Mongold ,  Brian Vicich ,  Keith Guetig

IPC: G02B6/42 ,  H04B1/3827 ,  H04B10/40 ,  H04B10/27 ,  H04B10/25 ,  H04B10/80 ,  H05K7/20 ,  H01R13/639

CPC classification number: G02B6/4284 ,  G02B6/4232 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4261 ,  G02B6/4269 ,  G02B6/4278 ,  G02B6/4279 ,  G02B6/428 ,  G02B6/4292 ,  G02B6/4293 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01R12/716 ,  H01R13/639 ,  H04B1/3833 ,  H04B10/2504 ,  H04B10/27 ,  H04B10/40 ,  H04B10/801 ,  H04B10/803 ,  H05K7/20418 ,  H01L2924/00014

Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

公开(公告)号：US09270373B2

公开(公告)日：2016-02-23

申请号：US13671061

申请日：2012-11-07

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Thomas Benjamin Troxell ,  Ashraf M. Wahba ,  David Daniel Stark ,  David A. Langsam

IPC: H04B10/08 ,  H04B17/00 ,  H04B10/00 ,  H04B10/25 ,  H04B10/40 ,  H04B10/079 ,  H04B10/077

CPC classification number: H04B10/2503 ,  H04B10/077 ,  H04B10/0799 ,  H04B10/40

Abstract: A data transport system for transporting data and auxiliary signals over an optical link comprises a transmitter, a receiver and an optical link. The transmitter and receiver are coupled to a first end of the optical link. The optical link includes a number of optical channels. A controller is coupled to the transmitter and the receiver, and controls the transmitter and the receiver to operate in a first state when data are detected at an input of the transmitter. Data are transported via the data transport system in the first state. The controller controls the transmitter and the receiver to operate in a second state when the data are detected as absent at the input of the transmitter. Data are prevented from being transported via the data transport system in the second state.

公开(公告)号：US09191109B2

公开(公告)日：2015-11-17

申请号：US13671168

申请日：2012-11-07

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Thomas Benjamin Troxell ,  Ashraf M. Wahba ,  David Daniel Stark ,  David A. Langsam

IPC: H04B10/08 ,  H04B17/00 ,  H04B10/00 ,  H04B10/25 ,  H04B10/40 ,  H04B10/079 ,  H04B10/077

CPC classification number: H04B10/2503 ,  H04B10/077 ,  H04B10/0799 ,  H04B10/40

Abstract: A data transport system for transporting data and auxiliary signals over an optical link comprises a transmitter, a receiver and an optical link. The transmitter and receiver are coupled to a first end of the optical link. The optical link includes a number of optical channels. A controller is coupled to the transmitter and the receiver, and controls the transmitter and the receiver to operate in a first state when data are detected at an input of the transmitter. Data are transported via the data transport system in the first state. The controller controls the transmitter and the receiver to operate in a second state when the data are detected as absent at the input of the transmitter. Data are prevented from being transported via the data transport system in the second state.

公开(公告)号：US20240069294A1

公开(公告)日：2024-02-29

申请号：US18504414

申请日：2023-11-08

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden

IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40

CPC classification number: G02B6/4278 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4283 ,  H04B10/25 ,  H04B10/40 ,  G02B6/428

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

公开(公告)号：US11846816B2

公开(公告)日：2023-12-19

申请号：US17386607

申请日：2021-07-28

Applicant: Samtec, Inc.

Inventor： Eric Zbinden

IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40

CPC classification number: G02B6/4278 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4283 ,  H04B10/25 ,  H04B10/40 ,  G02B6/428

Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

公开(公告)号：US11735844B2

公开(公告)日：2023-08-22

申请号：US17496558

申请日：2021-10-07

Applicant: SAMTEC INC.

Inventor： Liam Parkes ,  Eric Zbinden ,  Keith Guetig ,  Jignesh H. Shah ,  Jean Karlo Williams Barnett ,  Chadrick Paul Faith ,  R. Brad Bettman

IPC: H01R12/70 ,  G02B6/42 ,  H01R12/77 ,  H01R12/83 ,  H01R13/639 ,  H01R13/629

CPC classification number: H01R12/7029 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4277 ,  H01R12/7058 ,  H01R12/774 ,  H01R12/83 ,  H01R13/629 ,  H01R13/639

Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.

公开(公告)号：US11495899B2

公开(公告)日：2022-11-08

申请号：US16764142

申请日：2018-11-14

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.