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公开(公告)号:US20210183660A1
公开(公告)日:2021-06-17
申请号:US17115313
申请日:2020-12-08
Applicant: SEMES CO., LTD.
Inventor: Jung Suk GOH , Jae Seong LEE , Do Youn LIM , Kuk Saeng KIM , Young Dae CHUNG , Tae Shin KIM , Jee Young LEE , Won Geun KIM , Ji Hoon JEONG , Kwang Sup KIM , Pil Kyun HEO , Yoon Ki SA , Ye Rim YEON , Hyun YOON , Do Yeon KIM , Yong Jun SEO , Byeong Geun KIM , Young Je UM
IPC: H01L21/311 , H01L21/66 , H01L21/67
Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.
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公开(公告)号:US20210134614A1
公开(公告)日:2021-05-06
申请号:US17079445
申请日:2020-10-24
Applicant: SEMES CO., LTD.
Inventor: Young Dae CHUNG , Won Geun KIM , Jee Young LEE , Ji Hoon JEONG , Tae Shin KIM , Jung Suk GOH , Cheng Bin CUI , Ye Rim YEON
IPC: H01L21/67
Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.
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公开(公告)号:US20210118701A1
公开(公告)日:2021-04-22
申请号:US17073342
申请日:2020-10-17
Applicant: SEMES CO., LTD.
Inventor: Young Dae CHUNG , Won Geun KIM , Jee Young LEE , Ji Hoon JEONG , Tae Shin KIM , Se Hoon OH , Pil Kyun HEO , Hyun Goo PARK
IPC: H01L21/67 , H01L21/306
Abstract: Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate.
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