公开(公告)号：US20170345641A1

公开(公告)日：2017-11-30

申请号：US15604267

申请日：2017-05-24

Applicant: SEMES CO., LTD.

Inventor： YOUNG HUN LEE ,  EUI SANG LIM

IPC: H01L21/02 ,  B08B3/10 ,  B08B3/08 ,  H01L21/67 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B2203/0229

Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.

公开(公告)号：US20230415191A1

公开(公告)日：2023-12-28

申请号：US18097408

申请日：2023-01-16

Applicant: SEMES CO., LTD.

Inventor： JUN YOUNG CHOI ,  GUI SU PARK ,  YOUNG HUN LEE ,  YOUNG JIN JANG ,  JUN HYUN LIM

IPC: B05C3/10 ,  B08B3/04 ,  B08B3/10 ,  B08B3/08

CPC classification number: B05C3/10 ,  B08B3/041 ,  B08B3/10 ,  B08B3/08

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a batch-type treating bath for treating a substrate in a batch-type manner; a single-type treating chamber for treating the substrate in a single-type manner; and a buffer chamber positioned on a transfer path of the substrate transferred between the batch-type treating bath and the single-type treating chamber, and supplying a liquid for maintaining a wetting state of the substrate.

公开(公告)号：US20220351968A1

公开(公告)日：2022-11-03

申请号：US17867813

申请日：2022-07-19

Applicant: SEMES CO., LTD.

Inventor： JINWOO JUNG ,  YOUNG HUN LEE ,  YONG HEE LEE ,  EUI SANG LIM

IPC: H01L21/02 ,  F26B3/02 ,  H01L21/67 ,  F26B21/14

Abstract: A method for treating a substrate is provided. The method includes the following steps: performing a process of treating the substrate by dispensing a supercritical fluid onto the substrate. A treating fluid flows through a treating fluid supplying regulator regulating an amount of the treating fluid before dispensed onto the substrate. The treating fluid is heated to a set temperature or more by a first heater before passing through the treating fluid supplying regulator, and the treating fluid is heated by a second heater when the treating fluid is passed through the treating fluid supplying regulator. The temperature of the treating fluid is lowered in rear region of the treating fluid supplying regulator. The set temperature is a temperature that allows the lowered temperature to be maintained at a critical temperature or more.

公开(公告)号：US20220189795A1

公开(公告)日：2022-06-16

申请号：US17547182

申请日：2021-12-09

Applicant: SEMES CO., LTD.

Inventor： SANG MIN LEE ,  YOUNG HUN LEE ,  MYUNG SEOK CHA

IPC: H01L21/67

Abstract: The inventive concept provides a temperature controlling method. The temperature controlling method for controlling a temperature of a tank storing a treating fluid transferred to the chamber, comprises supplying the treating fluid to the inner space of the tank, heating the treating fluid at the inner space, and transferring the heated treating fluid to the chamber, wherein the temperature of the inner space is controlled based on a measured pressure of the inner space.

公开(公告)号：US20220178446A1

公开(公告)日：2022-06-09

申请号：US17544950

申请日：2021-12-08

Applicant: SEMES CO., LTD.

Inventor： SEUNG HOON OH ,  SANG MIN LEE ,  JONG DOO LEE ,  JIN MO JAE ,  YOUNG HUN LEE

IPC: F16J15/3204 ,  B08B7/00

Abstract: A sealing member for use in sealing a chamber for treating a substrate, the sealing member inserted in a groove formed in the chamber, includes a bottom part, a top part opposite the bottom part, an inner part connecting a first side of the bottom part to the top part, an outer part opposite the inner part and connecting a second side of the bottom part to the top part, and a recessed portion between the top part and the outer part.

公开(公告)号：US20180033655A1

公开(公告)日：2018-02-01

申请号：US15657137

申请日：2017-07-22

Applicant: SEMES CO., LTD.

Inventor： HEEHWAN KIM ,  YOUNG HUN LEE

IPC: H01L21/67 ,  B08B7/00 ,  B08B3/08 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B7/0021 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/68735

Abstract: Disclosed are an apparatus and a method for treating a substrate. The method includes supplying a mixture liquid obtained by mixing an additive with an organic solvent onto a substrate, and after the supplying of the mixture liquid, removing the mixture liquid from the substrate by supplying a supercritical fluid to the substrate and dissolving the mixture liquid in the supercritical fluid, wherein the additive has a surface tension that is lower than that of the organic solvent and a boiling point that is lower than that of the organic solvent.