公开(公告)号：US20230111149A1

公开(公告)日：2023-04-13

申请号：US17957428

申请日：2022-09-30

Applicant: SEMES CO., LTD.

Inventor： Sang Min LEE ,  Jin Se PARK ,  Ki Hoon CHOI

IPC: H01L21/67 ,  G01N1/10

Abstract: Provided is a concentration measuring apparatus, which measures a concentration of a fluid under a high-pressure environment, such as an environment in which a supercritical fluid is provided. The concentration measuring apparatus includes: a concentration meter for measuring a concentration of a first fluid contained in a fluid in the measurement line; a sampling line for transferring a process fluid of a processing space in which a substrate is treated in a high-pressure environment to the measurement line; a control valve for opening and closing the sampling line; a fluid pressure regulator installed downstream the control valve in the sampling line and configured to adjust the passing fluid to a set pressure; and a decompression tank installed between the sampling line and the measurement line.

公开(公告)号：US20240152056A1

公开(公告)日：2024-05-09

申请号：US18502628

申请日：2023-11-06

Applicant: SEMES CO., LTD.

Inventor： Sang Gun LEE ,  Ki Hoon CHOI ,  Hyun YOON ,  Seung Un OH ,  Jin Yeong SUNG ,  Jang Jin LEE ,  Tae Shin KIM

IPC: G03F7/42 ,  G03F7/40

CPC classification number: G03F7/423 ,  G03F7/40

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.

公开(公告)号：US20230205091A1

公开(公告)日：2023-06-29

申请号：US18066380

申请日：2022-12-15

Applicant: SEMES CO., LTD.

Inventor： Hyun YOON ,  Ki Hoon CHOI ,  Hyo Won YANG ,  Tae Hee KIM ,  In Ki JUNG

IPC: G03F7/20

CPC classification number: G03F7/2041

Abstract: Disclosed is a substrate treating apparatus including a support unit that supports and rotates a substrate, a heating unit including a laser irradiator that irradiates laser light in a pattern formed in the substrate, a movement module that changes a location of the laser irradiator by moving the heating unit, and a controller that controls the support unit and the heating unit, the movement module moves the heating unit between a heating location, at which the laser light is irradiated to the substrate, and a standby location that deviates from the substrate, and the movement module rotates and linearly moves the heating unit.

公开(公告)号：US20230205077A1

公开(公告)日：2023-06-29

申请号：US18146693

申请日：2022-12-27

Applicant: SEMES CO., LTD.

Inventor： Tae Hee KIM ,  In Ki JUNG ,  Ki Hoon CHOI ,  Hyo Won YANG ,  Won Sik SON ,  Hyun YOON

IPC: G03F1/72

CPC classification number: G03F1/72

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing; a support unit positioned within the housing and configured to support a substrate; a liquid supply unit configured to supply a treating liquid to the substrate supported on the support unit; and a laser module configured to irradiate a laser to the substrate to which the treating liquid is supplied; and a vision module for monitoring a point at which the laser is irradiated among the substrate.

公开(公告)号：US20230115826A1

公开(公告)日：2023-04-13

申请号：US17961460

申请日：2022-10-06

Applicant: SEMES CO., LTD.

Inventor： Jang Mi WOO ,  Ki Hoon CHOI ,  Young Hoon JEONG ,  Myung Jin KIM

IPC: B41J2/14

Abstract: A printing apparatus and a method of providing printing apparatus are provided. A printing apparatus according to at least one embodiment of the present disclosure includes a base panel or head base, at least one or more head packs installed on the head base, a head pack holder installed on each of the head packs and configured to handle and fix the head pack, and a fastening structure configured to mount the head pack holder to the head packs.

公开(公告)号：US20230067973A1

公开(公告)日：2023-03-02

申请号：US17901941

申请日：2022-09-02

Applicant: SEMES CO., LTD.

Inventor： Tae Hee KIM ,  Ki Hoon CHOI ,  Hyun YOON ,  Won Sik SON ,  Hyo Won YANG ,  In Ki JUNG

IPC: G03F1/66 ,  B08B3/02 ,  B08B13/00 ,  G03F1/60

Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and a controller configured to control the support unit and the heating unit, and wherein the support unit includes: a support part for supporting the mask; and a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.

公开(公告)号：US20250093768A1

公开(公告)日：2025-03-20

申请号：US18770090

申请日：2024-07-11

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO. LTD.

Inventor： Jin Yeong SUNG ,  Ki Hoon CHOI ,  Seung Un OH ,  Young Ho PARK ,  Sang Hyeon RYU ,  Jang Jin LEE ,  Hyun YOON ,  Sang Gun LEE ,  Yu Jin CHO ,  Ho Jong HWANG ,  Jong Ju PARK ,  Jong Keun OH ,  Yong Woo KIM

IPC: G03F1/72 ,  G03F1/84 ,  G06T7/20 ,  G06T7/66

Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.

公开(公告)号：US20240131624A1

公开(公告)日：2024-04-25

申请号：US18480393

申请日：2023-10-02

Applicant: SEMES CO., LTD.

Inventor： Tae Shin KIM ,  Ki Hoon CHOI ,  Tae Hee KIM ,  Sang Gun LEE ,  Jin Yeong SUNG ,  Jang Jin LEE

IPC: B23K26/12 ,  B23K26/08 ,  B23K26/362 ,  H01L21/768

CPC classification number: B23K26/128 ,  B23K26/0884 ,  B23K26/362 ,  H01L21/76894 ,  B23K2101/40

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.

公开(公告)号：US20240066887A1

公开(公告)日：2024-02-29

申请号：US18220766

申请日：2023-07-11

Applicant: SEMES CO., LTD.

Inventor： Jang Mi WOO ,  Jin Hyuck YANG ,  Ki Hoon CHOI ,  Young Hoon JEONG

IPC: B41J2/21 ,  B41J2/045 ,  B41J2/14

CPC classification number: B41J2/21 ,  B41J2/04505 ,  B41J2/14 ,  B41J2002/14362

Abstract: Proposed are an inkjet head unit capable of forming high-resolution pixels on a substrate and inkjet printing equipment including the same. An inkjet head unit of inkjet printing equipment according to one embodiment includes a head pack including a plurality of ejection heads configured to eject ink of the same color to a substrate; and a head base on which a plurality of head packs are installed to be repeatedly coaxially arranged in color order.

公开(公告)号：US20230185206A1

公开(公告)日：2023-06-15

申请号：US17901103

申请日：2022-09-01

Applicant: SEMES CO., LTD.

Inventor： Tae Hee KIM ,  Ki Hoon CHOI ,  Hyun YOON ,  Won Sik SON ,  Hyo Won YANG ,  In Ki JUNG

IPC: G03F7/20

CPC classification number: G03F7/70875 ,  G03F7/70025

Abstract: The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; a heating unit including a laser irradiation module and a moving module, the laser irradiation module having a laser irradiator for irradiating a laser light to the second pattern, the moving module configured to change a position of the laser irradiation module; and a controller configured to control the support unit and the heating unit, and wherein when a treating position is divided into four equal parts from a first quadrant to a fourth quadrant based on a center of the mask, the laser irradiator is positioned at the fourth quadrant and the first quadrant in a direction linearly moving from a standby position to the treating position, positioned at the third quadrant in a direction which is perpendicular to the fourth quadrant, and positioned at the second quadrant in a direction which is perpendicular to the first quadrant, and wherein the controller controls a rotation of the support unit so the second pattern is positioned at the fourth quadrant.