公开(公告)号：US20240152056A1

公开(公告)日：2024-05-09

申请号：US18502628

申请日：2023-11-06

Applicant: SEMES CO., LTD.

Inventor： Sang Gun LEE ,  Ki Hoon CHOI ,  Hyun YOON ,  Seung Un OH ,  Jin Yeong SUNG ,  Jang Jin LEE ,  Tae Shin KIM

IPC: G03F7/42 ,  G03F7/40

CPC classification number: G03F7/423 ,  G03F7/40

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes supplying a liquid to a substrate; and heating the substrate after the supplying the liquid, and wherein the supplying the liquid includes: supplying a first liquid to the substrate; and supplying a second liquid which is different from the first liquid to a substrate to which the first liquid is supplied, and wherein the second liquid is supplied as a test to the substrate and a contact angle between the second liquid which is supplied and the substrate is measured to determine a degree of hydrophilization of the substrate, and a supply mechanism of the second liquid supplied to the substrate is determined based on the degree of hydrophilization of the substrate which is determined, before the supplying the second liquid is performed.

公开(公告)号：US20230350304A1

公开(公告)日：2023-11-02

申请号：US17732565

申请日：2022-04-29

Applicant: SEMES CO, LTD.

Inventor： Hae Won CHOI ,  Joon Ho WON ,  Koriakin ANTON ,  Ki Hoon CHOI ,  Eung Su KIM ,  Pil Kyun HEO ,  Min Woo KIM ,  Jin Yeong SUNG ,  Hyo Soo KIM

IPC: G03F7/30 ,  G03F7/32

CPC classification number: G03F7/3021 ,  G03F7/327

Abstract: There are provided an apparatus and a method for providing a substrate, which can suppress any additional reaction between a developing solution and a photoresist (PR) film and prevent any PR remnants from being generated from such additional reaction. The method includes: supplying an organic developing solution onto a substrate while rotating the substrate at a first revolutions per minute (rpm); substituting the organic developing solution with a nonpolar rinse solution by supplying the nonpolar rinse solution onto the substrate while rotating the substrate at a second rpm, which is lower than the first rpm; continuing to supply the nonpolar rinse solution while rotating the substrate at a third rpm, which is higher than the second rpm; and continuing to supply the nonpolar rinse solution while rotating the substrate at a fourth rpm, which is between the second rpm and the third rpm.

公开(公告)号：US20220290921A1

公开(公告)日：2022-09-15

申请号：US17692395

申请日：2022-03-11

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Anton KORIAKIN ,  Joon Ho WON ,  Min Woo KIM ,  Ki Hoon CHOI ,  Eung Su KIM ,  Tae Hee KIM ,  Pil Kyun HEO ,  Jang Jin LEE ,  Jin Yeong SUNG

IPC: F26B5/00

Abstract: The inventive concept provides a method for treating a substrate. The method for treating a substrate comprises: a pressurization step for increasing a pressure of an inner space of a chamber by supplying a treating fluid to the inner space, after taking the substrate into the inner space; a flow step for generating a flow of the treating fluid by combination of supplying and discharging the treating fluid to and from the inner space; and a depressurization step of decreasing the pressure of the inner space by discharging the treating fluid from the inner space, and wherein the pressurization step comprises: a bottom side supply process for increasing the pressure of the inner space by supplying the treating fluid to a backside of the substrate taken into the inner space;
and a top side supply process of increasing the pressure of the inner space by supplying the treating fluid to a top side of the substrate taken into the inner space.

公开(公告)号：US20250093768A1

公开(公告)日：2025-03-20

申请号：US18770090

申请日：2024-07-11

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO. LTD.

Inventor： Jin Yeong SUNG ,  Ki Hoon CHOI ,  Seung Un OH ,  Young Ho PARK ,  Sang Hyeon RYU ,  Jang Jin LEE ,  Hyun YOON ,  Sang Gun LEE ,  Yu Jin CHO ,  Ho Jong HWANG ,  Jong Ju PARK ,  Jong Keun OH ,  Yong Woo KIM

IPC: G03F1/72 ,  G03F1/84 ,  G06T7/20 ,  G06T7/66

Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.

公开(公告)号：US20240131624A1

公开(公告)日：2024-04-25

申请号：US18480393

申请日：2023-10-02

Applicant: SEMES CO., LTD.

Inventor： Tae Shin KIM ,  Ki Hoon CHOI ,  Tae Hee KIM ,  Sang Gun LEE ,  Jin Yeong SUNG ,  Jang Jin LEE

IPC: B23K26/12 ,  B23K26/08 ,  B23K26/362 ,  H01L21/768

CPC classification number: B23K26/128 ,  B23K26/0884 ,  B23K26/362 ,  H01L21/76894 ,  B23K2101/40

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.

公开(公告)号：US20240227075A9

公开(公告)日：2024-07-11

申请号：US18480393

申请日：2023-10-03

Applicant: SEMES CO., LTD.

Inventor： Tae Shin KIM ,  Ki Hoon CHOI ,  Tae Hee KIM ,  Sang Gun LEE ,  Jin Yeong SUNG ,  Jang Jin LEE

IPC: B23K26/12 ,  B23K26/08 ,  B23K26/362 ,  H01L21/768

CPC classification number: B23K26/128 ,  B23K26/0884 ,  B23K26/362 ,  H01L21/76894 ,  B23K2101/40

Abstract: Embodiments of the inventive concept provide a substrate treating apparatus and a substrate treating method for not letting an irradiation region of a laser deviate from a target region, even if a shaking angle of a chemical deviates from an allowable range due to a vibration or an airflow. The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes: a substrate support unit configured to support a substrate having a chemical coated thereon; a laser generation unit configured to irradiate a laser to the substrate; and a light-transmitter positioned along a path at which the laser is irradiated.

公开(公告)号：US20240153791A1

公开(公告)日：2024-05-09

申请号：US18502531

申请日：2023-11-06

Applicant: SEMES CO., LTD.

Inventor： Jin Yeong SUNG ,  Ki Hoon CHOI ,  Hyun YOON ,  Sang Hyeon RYU ,  Young Ho PARK

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67069 ,  H01L21/67115 ,  H01L21/68764

Abstract: The inventive concept provides a substrate treating method for etching a specific region on a substrate. The substrate treating method includes supplying a treating liquid to the substrate; and irradiating a laser to the specific region to locally heat the specific region; and wherein at the irradiating the laser, the laser is irradiated a plurality of times within the specific region, and the laser is irradiated to a region which does not overlap on the substrate, but which overlaps within the specific region.

公开(公告)号：US20230113184A1

公开(公告)日：2023-04-13

申请号：US17865386

申请日：2022-07-15

Applicant: SEMES CO., LTD.

Inventor： Jae Won SHIN ,  Jae Seong LEE ,  Hae Won CHOI ,  Joon Ho WON ,  Koriakin ANTON ,  Min Woo KIM ,  Hyung Seok KANG ,  Eung Su KIM ,  Pil Kyun HEO ,  Jin Yeong SUNG

IPC: H01L21/67

Abstract: The present disclosure relates to a flow resistance generating unit that generates a flow resistance in a pipe to solve a flow imbalance problem due to a bent pipe and stabilizes an internal airflow, and a substrate treating apparatus including the same. The substrate treating apparatus comprises a fluid supply unit for supplying fluid for treating a substrate and including an upper fluid supply module for supplying the fluid to an upper portion of the substrate, a lower fluid supply module for supplying the fluid to a lower portion of the substrate, and a supply pipe connected to at least one of the upper fluid supply module and the lower fluid supply module, and a flow resistance generating unit installed in the supply pipe and for generating a flow resistance with respect to the fluid passing through the supply pipe.