METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    13.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20150050775A1

    公开(公告)日:2015-02-19

    申请号:US14529525

    申请日:2014-10-31

    Abstract: An object is to provide a semiconductor device including an oxide semiconductor, which has stable electrical characteristics and high reliability. In a manufacturing process of a bottom-gate transistor including an oxide semiconductor layer, heat treatment in an atmosphere containing oxygen and heat treatment in vacuum are sequentially performed for dehydration or dehydrogenation of the oxide semiconductor layer. In addition, irradiation with light having a short wavelength is performed concurrently with the heat treatment, whereby elimination of hydrogen, OH, or the like is promoted. A transistor including an oxide semiconductor layer on which dehydration or dehydrogenation treatment is performed through such heat treatment has improved stability, so that variation in electrical characteristics of the transistor due to light irradiation or a bias-temperature stress (BT) test is suppressed.

    Abstract translation: 目的在于提供一种具有稳定的电气特性和高可靠性的氧化物半导体的半导体装置。 在包括氧化物半导体层的底栅晶体管的制造工艺中,在氧化物气氛中进行热处理,在真空中进行热处理,依次进行氧化物半导体层的脱水或脱氢。 此外,与热处理同时进行具有短波长的光的照射,由此促进氢,OH等的消除。 包括通过这种热处理进行脱水或脱氢处理的氧化物半导体层的晶体管具有改善的稳定性,从而抑制了由于光照射或偏压温度应力(BT)测试而导致的晶体管的电特性的变化。

    SEMICONDUCTOR DEVICE
    14.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20150041801A1

    公开(公告)日:2015-02-12

    申请号:US14447875

    申请日:2014-07-31

    Abstract: A semiconductor device includes a semiconductor layer, a gate electrode overlapping with the semiconductor layer, a first gate insulating layer between the semiconductor layer and the gate electrode, and a second gate insulating layer between the first gate insulating layer and the gate electrode. The first gate insulating layer includes an oxide in which the nitrogen content is lower than or equal to 5 at. %, and the second gate insulating layer includes charge trap states.

    Abstract translation: 半导体器件包括半导体层,与半导体层重叠的栅极电极,在半导体层和栅电极之间的第一栅极绝缘层,以及位于第一栅极绝缘层和栅电极之间的第二栅极绝缘层。 第一栅极绝缘层包括其中氮含量低于或等于5at的氧化物。 %,第二栅极绝缘层包括电荷陷阱状态。

    TRANSISTOR AND DISPLAY DEVICE
    15.
    发明申请

    公开(公告)号:US20210384356A1

    公开(公告)日:2021-12-09

    申请号:US17349974

    申请日:2021-06-17

    Abstract: To provide a transistor having a favorable electric characteristics and high reliability and a display device including the transistor. The transistor is a bottom-gate transistor formed using an oxide semiconductor for a channel region. An oxide semiconductor layer subjected to dehydration or dehydrogenation through heat treatment is used as an active layer. The active layer includes a first region of a superficial portion microcrystallized and a second region of the rest portion. By using the oxide semiconductor layer having such a structure, a change to an n-type, which is attributed to entry of moisture to the superficial portion or elimination of oxygen from the superficial portion, and generation of a parasitic channel can be suppressed. In addition, contact resistance between the oxide semiconductor layer and source and drain electrodes can be reduced.

    LAMINATION SYSTEM, IC SHEET, SCROLL OF IC SHEET, AND METHOD FOR MANUFACTURING IC CHIP

    公开(公告)号:US20190147312A1

    公开(公告)日:2019-05-16

    申请号:US16248349

    申请日:2019-01-15

    Abstract: Thin film integrated circuits are peeled from a substrate and the peeled thin film integrated circuits are sealed, efficiently in order to improve manufacturing yields. The present invention provides laminating system comprising transporting means for transporting a substrate provided with a plurality of thin film integrated circuits; first peeling means for bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate; second peeling means for bonding second surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and sealing means for interposing the thin film integrated circuits between the second sheet member and a third sheet member to seal the thin film integrated circuit with the second sheet member and the third sheet member.

    LAMINATING SYSTEM
    19.
    发明申请
    LAMINATING SYSTEM 审中-公开
    层压系统

    公开(公告)号:US20140220745A1

    公开(公告)日:2014-08-07

    申请号:US14217519

    申请日:2014-03-18

    Abstract: It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

    Abstract translation: 本发明的目的是提高密封薄膜集成电路的生产效率并防止损坏和断裂。 此外,本发明的另一个目的是防止薄膜集成电路在运输中受损,并且使得更容易处理薄膜集成电路。 本发明提供了一种层压系统,其中辊子用于供应用于密封的基板,接收IC芯片,分离和密封。 通过旋转辊可以连续地进行多个薄膜集成电路的分离,密封和接收; 从而可以极大地提高生产效率。 此外,由于使用了彼此相对的一对辊,所以能够容易地密封薄膜集成电路。

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