SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20210126130A1

    公开(公告)日:2021-04-29

    申请号:US16643453

    申请日:2018-08-24

    Abstract: A semiconductor device with favorable reliability is provided. The semiconductor device includes a first insulator; a second insulator positioned over the first insulator; an oxide positioned over the second insulator; a first conductor and a second conductor positioned apart from each other over the oxide; a third insulator positioned over the oxide, the first conductor, and the second conductor; a third conductor positioned over the third insulator and at least partly overlapping with a region between the first conductor and the second conductor; a fourth insulator positioned to cover the oxide, the first conductor, the second conductor, the third insulator, and the third conductor; a fifth insulator positioned over the fourth insulator; and a sixth insulator positioned over the fifth insulator. An opening reaching the second insulator is formed in at least part of the fourth insulator; the fifth insulator is in contact with the second insulator through the opening; and the first insulator, the fourth insulator, and the sixth insulator have a lower oxygen permeability than the second insulator.

    SEMICONDUCTOR DEVICE
    12.
    发明申请

    公开(公告)号:US20190341495A1

    公开(公告)日:2019-11-07

    申请号:US16513826

    申请日:2019-07-17

    Abstract: To provide a transistor having a high on-state current. A semiconductor device includes a first insulator containing excess oxygen, a first oxide semiconductor over the first insulator, a second oxide semiconductor over the first oxide semiconductor, a first conductor and a second conductor which are over the second oxide semiconductor and are separated from each other, a third oxide semiconductor in contact with side surfaces of the first oxide semiconductor, a top surface and side surfaces of the second oxide semiconductor, a top surface of the first conductor, and a top surface of the second conductor, a second insulator over the third oxide semiconductor, and a third conductor facing a top surface and side surfaces of the second oxide semiconductor with the second insulator and the third oxide semiconductor therebetween. The first oxide semiconductor has a higher oxygen-transmitting property than the third oxide semiconductor.

    SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
    14.
    发明申请
    SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE 审中-公开
    半导体器件,其制造方法和电子器件

    公开(公告)号:US20160329434A1

    公开(公告)日:2016-11-10

    申请号:US15144123

    申请日:2016-05-02

    Abstract: The semiconductor device includes a first insulating layer; a first oxide insulating layer over the first insulating layer; an oxide semiconductor layer over the first oxide insulating layer; a source electrode layer and a drain electrode layer over the oxide semiconductor layer; a second oxide insulating layer over the oxide semiconductor layer, the source electrode layer, and the drain electrode layer; a gate insulating layer over the second oxide insulating layer; a gate electrode layer over the gate insulating layer; a second insulating layer over the first insulating layer, the source electrode layer, the drain electrode layer, the second oxide insulating layer, the gate insulating layer, and the gate electrode layer; and a third insulating layer over the first insulating layer, the source electrode layer, the drain electrode layer, and the second insulating layer.

    Abstract translation: 半导体器件包括第一绝缘层; 第一绝缘层上的第一氧化物绝缘层; 在所述第一氧化物绝缘层上的氧化物半导体层; 氧化物半导体层上的源电极层和漏电极层; 氧化物半导体层上的第二氧化物绝缘层,源电极层和漏电极层; 在所述第二氧化物绝缘层上的栅极绝缘层; 栅绝缘层上的栅电极层; 第一绝缘层上的第二绝缘层,源极电极层,漏极电极层,第二氧化物绝缘层,栅极绝缘层和栅极电极层; 以及第一绝缘层上的第三绝缘层,源极电极层,漏极电极层和第二绝缘层。

Patent Agency Ranking