公开(公告)号：US10141480B2

公开(公告)日：2018-11-27

申请号：US14091985

申请日：2013-11-27

Applicant: Seoul Viosys Co., Ltd.

Inventor： Sum Geun Lee ,  Sang Ki Jin ,  Jin Cheol Shin ,  Jong Kyu Kim ,  So Ra Lee

IPC: H01L33/46 ,  H01L27/15 ,  H01L33/00

Abstract: Exemplary embodiments of the present invention disclose a light emitting diode chip including a substrate having a first surface and a second surface, a light emitting structure arranged on the first surface of the substrate and including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, a distributed Bragg reflector arranged on the second surface of the substrate, the distributed Bragg reflector to reflect light emitted from the light emitting structure, and a metal layer arranged on the distributed Bragg reflector, wherein the distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range.

公开(公告)号：US09431377B2

公开(公告)日：2016-08-30

申请号：US14138917

申请日：2013-12-23

Applicant: Seoul Viosys Co., Ltd.

Inventor： Won Cheol Seo ,  Joon Hee Lee ,  Jong Kyun You ,  Chang Youn Kim ,  Jin Cheol Shin ,  Hwa Mok Kim ,  Jang Woo Lee ,  Yeo Jin Yoon ,  Jong Kyu Kim

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/46

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/46 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Disclosed are a light emitting device and a method of fabricating the same. The light emitting device comprises a substrate. A plurality of light emitting cells are disposed on top of the substrate to be spaced apart from one another. Each of the light emitting cells comprises a first upper semiconductor layer, an active layer, and a second lower semiconductor layer. Reflective metal layers are positioned between the substrate and the light emitting cells. The reflective metal layers are prevented from being exposed to the outside.

公开(公告)号：US20140103388A1

公开(公告)日：2014-04-17

申请号：US14140950

申请日：2013-12-26

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Sum Geun LEE ,  Jin Cheol Shin ,  Yeo Jin Yoon

IPC: H01L33/62

CPC classification number: H01L33/387 ,  H01L27/153 ,  H01L33/08 ,  H01L33/20 ,  H01L33/38 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode according to an exemplary embodiment of the present invention includes at least two light emitting cells disposed on a substrate and spaced apart from each other, wherein each of the at least two light emitting cells comprises a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. Each of the at least two light emitting cells comprises a cathode disposed on the first conductivity-type semiconductor layer, an anode disposed on the second conductivity-type semiconductor layer, and the cathode of a first light emitting cell of the at least two light emitting cells is electrically connected in series to the anode of a second light emitting cell of the at least two light emitting cells adjacent to the first light emitting cell by an interconnecting section.

Abstract translation: 根据本发明的示例性实施例的发光二极管包括至少两个设置在基板上并彼此间隔开的发光单元，其中至少两个发光单元中的每一个包括第一导电类型半导体层 ，有源层和第二导电型半导体层。 所述至少两个发光单元中的每一个包括设置在所述第一导电类型半导体层上的阴极，设置在所述第二导电类型半导体层上的阳极和所述至少两个发光的第一发光单元的阴极 电池通过互连部分串联连接到与第一发光单元相邻的至少两个发光单元的第二发光单元的阳极。