公开(公告)号：US20130214425A1

公开(公告)日：2013-08-22

申请号：US13654850

申请日：2012-10-18

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Dominique Marais ,  Jacques Chavade ,  Rémi Brechignac ,  Eric Saugier ,  Romain Coffy ,  Luc Petit

IPC: H01L23/535

CPC classification number: H01L25/0652 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Abstract translation: 电子封装包括具有互连网络的衬底晶片。 第一芯片固定到基板的前部，连接到互连网络并由主体封装。 第二芯片放置在基板晶片的背面，并通过设置在基板的背面和第二芯片的前侧之间的背面连接元件连接到互连网络。 前端连接元件放置在基板的正面并连接到互连网络。 连接元件延伸超出身体的正面。 封装可以安装在具有插入的导热材料的板上。

公开(公告)号：US09006904B2

公开(公告)日：2015-04-14

申请号：US13654850

申请日：2012-10-18

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Dominique Marais ,  Jacques Chavade ,  Rémi Brechignac ,  Eric Saugier ,  Romain Coffy ,  Luc Petit

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/367 ,  H01L25/065 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L25/0652 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053

Abstract: An electronic package includes a substrate wafer with an interconnect network. A first chip is fixed to a front of the substrate, connected to the interconnect network and encapsulated by a body. A second chip is placed on a back side of the substrate wafer and connected to the interconnect network by back-side connection elements interposed between the back side of the substrate and a front side of the second chip. Front-side connection elements are placed on the front side of the substrate and connected to the interconnect network. The connection elements extend beyond the frontal face of the body. The package may be mounted on a board with an interposed thermally conductive material.

Abstract translation: 电子封装包括具有互连网络的衬底晶片。 第一芯片固定到基板的前部，连接到互连网络并由主体封装。 第二芯片放置在基板晶片的背面，并通过设置在基板的背面和第二芯片的前侧之间的背面连接元件连接到互连网络。 前端连接元件放置在基板的正面并连接到互连网络。 连接元件延伸超出身体的正面。 封装可以安装在具有插入的导热材料的板上。

公开(公告)号：US10955289B2

公开(公告)日：2021-03-23

申请号：US16377498

申请日：2019-04-08

Applicant: STMicroelectronics (Research & Development) Limited ,  STMicroelectronics (Grenoble 2) SAS

Inventor： William Halliday ,  Eric Saugier ,  Roy Duffy

IPC: G01J1/42 ,  G01J1/44 ,  G01S7/481 ,  H04N5/225 ,  G01S17/04

Abstract: An electronic module includes an ambient light sensor and a proximity sensor. The ambient light sensor includes an ambient light photodetector. The proximity sensor includes an infrared photoemitter, a reference infrared photodetector and another infrared photodetector. The ambient light sensor is arranged in a stack over the proximity sensor with a position that allows infrared photons transmitted by the infrared photoemitter to be received by the reference infrared photodetector.

公开(公告)号：US10833208B2

公开(公告)日：2020-11-10

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.