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公开(公告)号：US20210351338A1
公开(公告)日：2021-11-11
申请号：US17137220
申请日：2020-12-29
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Carlo Luigi PRELINI , Marco FERRERA , Carla Maria LAZZARI , Luca SEGHIZZI , Nicolo' BONI , Roberto CARMINATI , Fabio QUAGLIA
Abstract: The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.
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12.发明申请公开(公告)号：US20180281402A1
公开(公告)日：2018-10-04
申请号：US15884186
申请日：2018-01-30
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico GIUSTI , Marco FERRERA , Carlo Luigi PRELINI , Simon DODD
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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13.发明公开公开(公告)号：US20230381816A1
公开(公告)日：2023-11-30
申请号：US18320876
申请日：2023-05-19
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Fabio QUAGLIA , Marco FERRERA
IPC: B06B1/06
CPC classification number: B06B1/0603 , B06B1/0629
Abstract: Micromachined pressure transducer including: a fixed body of semiconductor material, which laterally delimits a main cavity; a transduction structure, which is suspended on the main cavity and includes at least a pair of deformable structures and a movable region, which is formed by semiconductor material and is mechanically coupled to the fixed body through the deformable structures. Each deformable structure includes: a support structure of semiconductor material, which includes a first and a second beam, each of which has ends fixed respectively to the fixed body and to the movable region, the first beam being superimposed, at a distance, on the second beam; and at least one piezoelectric transduction structure, mechanically coupled to the first beam. The piezoelectric transduction structures are electrically controllable so that they cause corresponding deformations of the respective support structures and a consequent translation of the movable region along a translation direction.
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14.发明申请公开(公告)号：US20230019422A1
公开(公告)日：2023-01-19
申请号：US17949712
申请日：2022-09-21
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Domenico GIUSTI , Marco FERRERA
Abstract: Various embodiments of the present disclosure provide a read/write device for a hard-disk memory system. The read/write device includes a fixed structure; a membrane region including a first and a second membrane, which are constrained to the fixed structure, and a central portion, interposed between the first and second membranes; a first and a second piezoelectric actuator, mechanically coupled, respectively, to the first and second membranes; and a read/write head, which is fixed to the central portion of the membrane region. The first and second piezoelectric actuators can be controlled so as to cause corresponding deformations of the first and second membranes, said deformations of the first and second membranes causing corresponding movements of the read/write head with respect to the fixed structure.
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Patent Agency Ranking
15.发明申请公开(公告)号：US20220306456A1
公开(公告)日：2022-09-29
申请号：US17839131
申请日：2022-06-13
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Fabio QUAGLIA , Marco FERRERA , Marco DEL SARTO
Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.
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公开(公告)号：US20200070511A1
公开(公告)日：2020-03-05
申请号：US16676070
申请日：2019-11-06
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico GIUSTI , Marco FERRERA , Carlo Luigi PRELINI , Simon DODD
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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17.发明申请公开(公告)号：US20200024131A1
公开(公告)日：2020-01-23
申请号：US16518865
申请日：2019-07-22
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Fabio QUAGLIA , Marco FERRERA , Marco DEL SARTO
Abstract: A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.
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公开(公告)号：US20190217618A1
公开(公告)日：2019-07-18
申请号：US16249752
申请日：2019-01-16
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Domenico GIUSTI , Marco FERRERA , Carlo Luigi PRELINI , Mauro CATTANEO , Andrea NOMELLINI
CPC classification number: B41J2/1626 , B41J2/14201 , B41J2/1606 , B41J2/1607 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2002/14241 , B81C1/00087
Abstract: A method for manufacturing a device for ejecting a fluid, comprising the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.
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19.发明申请公开(公告)号：US20190127214A1
公开(公告)日：2019-05-02
申请号：US16165828
申请日：2018-10-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Dario PACI , Marco FERRERA , Andrea PICCO
Abstract: A MEMS device comprising a body, having a first surface and a second surface; a diaphragm cavity in the body extending from the second surface of the body; a deformable portion in the body between the first surface and the diaphragm cavity; and a piezoelectric actuator, extending on the first surface of the body, over the deformable portion. The MEMS device is characterized in that it comprises a recess structure extending in the body and delimiting a stopper portion for the deformable portion.
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