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公开(公告)号：US20170297332A1
公开(公告)日：2017-10-19
申请号：US15636491
申请日：2017-06-28
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon DODD , Joe SCHEFFELIN , Dave HUNT , Matt GIERE , Dana GRUENBACHER , Faiz SHERMAN
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US20190217612A1
公开(公告)日：2019-07-18
申请号：US16357100
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon DODD , David S. HUNT , Joseph Edward SCHEFFELIN , Dana GRUENBACHER , Stefan H. HOLLINGER , Uwe SCHOBER , Peter JANOUCH
CPC classification number: B41J2/1433 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17553 , B41J2002/14362 , B41J2002/14491
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US20190217611A1
公开(公告)日：2019-07-18
申请号：US16357077
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon DODD , David S. HUNT , Joseph Edward SCHEFFELIN , Dana GRUENBACHER , Stefan H. HOLLINGER , Uwe SCHOBER , Peter JANOUCH
CPC classification number: B41J2/1433 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17553 , B41J2002/14362 , B41J2002/14491
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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4.发明申请公开(公告)号：US20180281402A1
公开(公告)日：2018-10-04
申请号：US15884186
申请日：2018-01-30
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico GIUSTI , Marco FERRERA , Carlo Luigi PRELINI , Simon DODD
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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公开(公告)号：US20160101619A1
公开(公告)日：2016-04-14
申请号：US14975540
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon DODD , Joe SCHEFFELIN , Dave HUNT , Matt GIERE , Dana GRUENBACHER , Faiz SHERMAN
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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Patent Agency Ranking
公开(公告)号：US20200070511A1
公开(公告)日：2020-03-05
申请号：US16676070
申请日：2019-11-06
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
Inventor： Domenico GIUSTI , Marco FERRERA , Carlo Luigi PRELINI , Simon DODD
Abstract: Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.
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公开(公告)号：US20180056319A1
公开(公告)日：2018-03-01
申请号：US15803630
申请日：2017-11-03
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon DODD , Joe SCHEFFELIN , Dave HUNT , Matt GIERE , Dana GRUENBACHER , Faiz SHERMAN
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US20170311446A1
公开(公告)日：2017-10-26
申请号：US15253615
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS S.R.L.
Inventor： Simon DODD , Roberto BRIOSCHI
CPC classification number: H05K1/181 , B81C1/0023 , H01L2924/1461 , H05K1/0272 , H05K1/0293 , H05K1/0306 , H05K1/111 , H05K3/10 , H05K3/4007 , H05K2201/0175 , H05K2201/0338 , H05K2201/0391 , H05K2201/09727 , H05K2201/09763 , H05K2201/09827 , H05K2201/10083 , H05K2201/10159 , H05K2201/10181 , H05K2203/171 , H05K2203/175
Abstract: The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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公开(公告)号：US20170190174A1
公开(公告)日：2017-07-06
申请号：US15253601
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon DODD , David S. HUNT , Joseph Edward SCHEFFELIN , Dana GRUENBACHER
IPC: B41J2/14
CPC classification number: B41J2/1433 , B41J2/14072 , B41J2/14201 , B41J2/1753 , B41J2/17553 , B41J2002/14362 , B41J2002/14491
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US20170232739A1
公开(公告)日：2017-08-17
申请号：US15277825
申请日：2016-09-27
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS (MALTA) LTD
Inventor： Simon DODD , Ivan ELLUL , Christopher BRINCAT
IPC: B41J2/14
CPC classification number: B41J2/01 , B41J2/04548 , B41J2/14072 , B41J2/14201 , B41J2/1433 , B41J2002/14362 , B41J2002/14491
Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.
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