公开(公告)号：US09446943B2

公开(公告)日：2016-09-20

申请号：US14288130

申请日：2014-05-27

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics (Malta) Ltd

Inventor： Kevin Formosa ,  Luca Maggi

IPC: H01L29/84 ,  B81B7/00 ,  H01L25/065 ,  H01L25/00 ,  B81B3/00 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: B81B7/007 ,  B81B3/0094 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/095 ,  B81B2207/097 ,  B81C1/00238 ,  B81C1/00301 ,  B81C2203/00 ,  B81C2203/0136 ,  B81C2203/0792 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/73 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/84 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wafer-level packaging, comprising: a first semiconductor body integrating a MEMS structure; a second semiconductor body, including a surface electrical-contact region and an ASIC coupled to the MEMS structure and to said electrical-contact region; a first coating layer, made of resin, which englobes and protects the first body, the second body, and the electrical-contact region; at least one first conductive through via, which extends through the first coating layer in an area corresponding, and electrically coupled, to the first electrical-contact region; an electrical-contact pad, which extends over the first coating layer, electrically coupled to the first conductive through via; a third semiconductor body, integrating an electronic circuit, glued on the first coating layer; a second coating layer, made of resin, which englobes and protects the third body; at least one second conductive through via, which extends completely through the second coating layer in an area corresponding, and electrically coupled, to the electrical-contact pad; and a further electrical-contact pad electrically coupled to the second conductive through via.

Abstract translation: 一种晶片级封装，包括：集成MEMS结构的第一半导体本体; 包括表面电接触区域和耦合到所述MEMS结构和所述电接触区域的ASIC的第二半导体本体; 由树脂制成的第一涂层，其包围并保护第一主体，第二主体和电接触区域; 至少一个第一导电通孔，其在与第一电接触区域对应并电耦合的区域中延伸穿过第一涂层; 电接触焊盘，其在所述第一涂层上延伸，电耦合到所述第一导电通孔; 第三半导体本体，集成在第一涂层上的电子电路; 由树脂制成的第二涂层，其缠绕并保护第三体; 至少一个第二导电通孔，其在对应于并电耦合到所述电接触焊盘的区域中完全延伸穿过所述第二涂层; 以及电耦合到第二导电通孔的另一个电接触焊盘。

公开(公告)号：US09390988B2

公开(公告)日：2016-07-12

申请号：US13630872

申请日：2012-09-28

Applicant: STMicroelectronics (Malta) Ltd

Inventor： Mark A. Azzopardi ,  Kevin Formosa ,  Ivan Ellul

IPC: B32B1/02 ,  B32B15/01 ,  H05K5/03 ,  B23K1/20 ,  H01L23/10 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/16152 ,  Y10T428/1241 ,  Y10T428/13 ,  H01L2924/00

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract translation: 一个实施例公开了一种用于将集成电子设备的盖焊接到支撑层的方法，包括以下步骤：提供支撑层; 提供包括第一材料的芯和第二材料的涂层的盖，所述第一和第二材料分别相对于焊料可润湿和不可湿润，所述涂层被布置为暴露所述第一材料的表面 核心; 将盖与支撑层联接; 并通过焊料将芯的表面焊接到支撑层。

公开(公告)号：US09253579B2

公开(公告)日：2016-02-02

申请号：US13648213

申请日：2012-10-09

Applicant: STMicroelectronics (Malta) Ltd

Inventor： Kevin Formosa

IPC: H01L23/12 ,  H01L23/02 ,  H01L21/00 ,  H04R19/00 ,  B81B7/00

CPC classification number: B81B7/0074 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00309 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4824 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.

Abstract translation: 一种封装的MEMS器件，其中至少两个支撑结构彼此堆叠并且由支撑层和彼此耦合并限定相应室的壁层形成。 第一支撑结构的腔室由第二支撑结构的支撑层向上限定。 第一和第二骰子容纳在由第一支撑结构的相应支撑层承载的相应的腔室中。 第二支撑结构的支撑层具有允许电线连接直接耦合第一和第二裸片的通孔。 耦合到第二支撑结构的盖基板封闭第二支撑结构的室。