公开(公告)号：US20190376666A1

公开(公告)日：2019-12-12

申请号：US16432561

申请日：2019-06-05

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain COFFY ,  Jean-Michel RIVIERE

IPC: F21V15/01 ,  F21V19/00

Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.

公开(公告)号：US20190355864A1

公开(公告)日：2019-11-21

申请号：US16409714

申请日：2019-05-10

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Alexandre COULLOMB ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H01L31/16

Abstract: A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.

公开(公告)号：US20190304891A1

公开(公告)日：2019-10-03

申请号：US16365063

申请日：2019-03-26

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY

IPC: H01L23/498 ,  H01L21/50 ,  H01L23/10 ,  H01L23/31 ,  H01L23/00 ,  H01L31/0203

Abstract: A cover for an electronic device includes a support body having a through-passage. An optical element which allows light to pass is mounted on said support body in a position extending across the through-passage. A surface of the optical element includes an electrically-conducting track configured as a security detection element. At least two electrical connection leads are rigidly attached to the support body and include first uncovered portions internal to the support body and electrically connected to spaced apart locations on the electrically-conducting track. The at least two electrical connection leads further including second uncovered portions external to said support body. The cover is mounted on a support plate carrying an electronic chip situated in the through-passage at a distance from the optical element.

公开(公告)号：US20190189860A1

公开(公告)日：2019-06-20

申请号：US16218944

申请日：2018-12-13

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Jean-Michel RIVIERE ,  Romain COFFY ,  Karine SAXOD

IPC: H01L33/48 ,  H05K5/03 ,  H01L31/18 ,  H01L31/12 ,  H01L31/0232 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/162 ,  H01L31/18 ,  H01L33/005 ,  H01L33/58 ,  H05K5/03

Abstract: An electronic circuit including a cover crossed by an element and having a planar main inner surface.

公开(公告)号：US20240087977A1

公开(公告)日：2024-03-14

申请号：US18244534

申请日：2023-09-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Jerome LOPEZ

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498

CPC classification number: H01L23/3672 ,  H01L23/3735 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/18161 ,  H01L2924/351

Abstract: An integrated circuit includes an electronic chip having a face covered with a thermal interface material layer. A heat sink includes a mounting area fixed to the chip via the thermal interface material layer. The heat sink includes open notches extending into the mounting area to delimit fins separated from each other by the open notches.

公开(公告)号：US20240047407A1

公开(公告)日：2024-02-08

申请号：US18228898

申请日：2023-08-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Younes BOUTALEB ,  Julien CUZZOCREA ,  Romain COFFY

IPC: H01L23/00

CPC classification number: H01L24/30 ,  H01L24/29 ,  H01L24/27 ,  H01L24/94 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2224/48221 ,  H01L2224/48091 ,  H01L2224/94 ,  H01L2224/27848 ,  H01L2224/27416 ,  H01L2224/2761 ,  H01L2224/29012 ,  H01L2224/29011 ,  H01L2224/32221 ,  H01L2224/30051 ,  H01L2224/3003 ,  H01L2224/30505

Abstract: An integrated circuit package includes at least one electronic chip having a first face fastened onto a first face of a carrier substrate by an adhesive interface. The adhesive interface includes a crown formed of a first adhesive material that is fastened on the periphery of the first face of the electronic chip. The crown defining an internal housing. A second adhesive material, different than the first material, is deposited in the internal housing.

公开(公告)号：US20240038644A1

公开(公告)日：2024-02-01

申请号：US18377962

申请日：2023-10-09

Applicant: STMicroelectronics (Grenoble 2)SAS

Inventor： Romain COFFY ,  Fabien QUERCIA

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01Q1/22

CPC classification number: H01L23/49811 ,  H01L21/4817 ,  H01L21/4853 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/48227

Abstract: A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.

公开(公告)号：US20230318165A1

公开(公告)日：2023-10-05

申请号：US18119026

申请日：2023-03-08

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Ouafa HAJJI ,  Asma HAJJI ,  Fabien QUERCIA

IPC: H01Q1/22 ,  H01L23/58 ,  H01L23/544 ,  H01L21/56 ,  H01Q1/48

CPC classification number: H01Q1/2283 ,  H01L21/56 ,  H01L23/544 ,  H01L23/585 ,  H01Q1/48 ,  H01L24/16 ,  H01L2223/54426

Abstract: An electronic device includes an electronic integrated circuit chip assembled on a first region of a substrate. A radiation element of an antenna is mounted to the substrate in a manner where it is separated from the substrate by a second layer of a second dielectric material, and i\s further offset with respect to the first region of the substrate so that the radiation element does not cover the electronic integrated circuit chip. A first coating layer of a first coating material covers at least a surface of the electronic integrated circuit chip facing away from the substrate further covers a surface of the radiation element facing away from the substrate.

公开(公告)号：US20230266441A1

公开(公告)日：2023-08-24

申请号：US18112087

申请日：2023-02-21

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain COFFY ,  Younes BOUTALEB

IPC: G01S7/481 ,  H01L25/16

CPC classification number: G01S7/4813 ,  H01L25/167 ,  H01L25/165

Abstract: A time-of-flight sensor includes a first light ray generation circuit and a second light ray reception circuit. A resin layer encapsulates the first light ray generation circuit and the second light ray reception circuit. A first region configured to emit light rays of the first light ray generation circuit is exposed at a surface of the resin layer. A second region configured to receive light rays of the second light ray reception circuit is also exposed at that surface of the resin layer. The surface of the resin layer is configured to be directed towards a scene.

公开(公告)号：US20230245984A1

公开(公告)日：2023-08-03

申请号：US18128044

申请日：2023-03-29

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Denis FARISON ,  Romain COFFY ,  Jean-Michel RIVIERE

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/528 ,  H01L25/065

CPC classification number: H01L23/576 ,  H01L21/563 ,  H01L23/528 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49112 ,  H01L2225/06555 ,  H01L2924/14 ,  H04L9/002

Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.