Abstract:
A semiconductor device includes multiple layers of integrated electronic components, and at least one electrical connection strip defining a fusible strip in one of the layers. An end of the fusible strip is connected to an integrated electronic component. An intermediate electrical connection and heat dissipation structure and a screen are disposed between the fusible strip and the integrated electronic component.
Abstract:
A FAMOS memory cell is electrically erased. The FAMOS memory cell may be electrically erased by applying to the substrate a voltage having a value at least 4 volts higher than the lower of a voltage applied to the source and a voltage applied to the drain. The voltage applied to the substrate is also less than a predetermined limit above which the memory cell is destroyed.
Abstract:
Reference cells are refreshed in a non-volatile memory that includes a plurality of memory cells. A selected reference cell and a non-used memory cell are read simultaneously, and a signal read from the reference cell is compared to a signal read from the non-used memory cell. A refresh signal for refreshing the reference cell is supplied when the signal read therefrom is less than the signal read from the non-used memory cell.
Abstract:
A non-volatile memory includes a floating gate extending in a substrate between source and drain regions. A channel region may be confined by two insulating layers. The invention is particularly applicable to EPROM, EEPROM, Flash and single-electron memories using CMOS technology.