公开(公告)号：US20160117015A1

公开(公告)日：2016-04-28

申请号：US14839604

申请日：2015-08-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Veneri ,  Stefano Bosco ,  Alessandro Morcelli

IPC: G06F3/044 ,  G06F3/043 ,  G06F3/041

CPC classification number: G06F3/044 ,  B81B7/0058 ,  B81B2201/0285 ,  B81B2207/012 ,  G01H11/06 ,  G06F3/0412 ,  G06F3/0433 ,  H01L2224/48137

Abstract: A microelectromechanical vibration sensor includes: a first chamber; a second chamber; a semiconductor membrane between the first chamber and the second chamber; a reference electrode, capacitively coupled to the membrane; and a package structure, which encapsulates and insulates acoustically from the outside world the first chamber, the second chamber, and the membrane.

Abstract translation: 微机电振动传感器包括：第一室; 第二个房间 第一室和第二室之间的半导体膜; 电容耦合到膜的参比电极; 以及封装结构，其从外界在声学上封装并绝缘第一腔室，第二腔室和膜。

公开(公告)号：US09286382B2

公开(公告)日：2016-03-15

申请号：US14038377

申请日：2013-09-26

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro Morcelli ,  Marco Veneri

IPC: G06F17/30 ,  H04H60/92 ,  H04H60/80 ,  H04N21/414 ,  H04N21/81 ,  H04N21/41 ,  H04N21/4367 ,  H04N21/432 ,  H04L7/00 ,  H04J3/06 ,  H04N21/8358

CPC classification number: G06F17/3074 ,  H04H60/80 ,  H04H60/92 ,  H04J3/0632 ,  H04L7/0008 ,  H04N21/4126 ,  H04N21/41407 ,  H04N21/4325 ,  H04N21/4367 ,  H04N21/8106 ,  H04N21/8358 ,  H04R2420/07

Abstract: A method for simultaneous playback of audio tracks from digital transceiver devices, which are adapted to define a communication network. The digital devices store audio tracks to be played. One of the digital devices is actuated as a Master device (M) and the remaining N digital devices as Slave devices. The master device generates a pilot signal by selecting a pilot audio track to be played from among stored audio tracks and by adding a synchronization frequency (fS) to the pilot audio track, having an assigned value that falls out of the sound wave frequency range. The Slave devices receive a pilot portion of the pilot signal and extract the synchronization frequency and the received part of the pilot audio track. The slave devices use the pilot to identify a stored track to be played using the synchronization frequency as a sampling frequency.

Abstract translation: 一种用于从数字收发器设备同时重放音轨的方法，其适于定义通信网络。 数字设备存储要播放的音轨。 其中一个数字设备被激活为主设备（M），其余的N个数字设备作为从设备启动。 主装置通过从存储的音轨中选择要播放的导频音轨并通过将具有落在声波频率范围之外的分配值的导频音轨添加同步频率（fS）来生成导频信号。 从设备接收导频信号的导频部分并提取同步频率和导频音轨的接收部分。 从设备使用飞行员使用同步频率来识别要播放的存储的轨道作为采样频率。

公开(公告)号：US20150124981A1

公开(公告)日：2015-05-07

申请号：US14532960

申请日：2014-11-04

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Marco Veneri ,  Alessandro Morcelli

IPC: H04R29/00 ,  H04R3/00

CPC classification number: H04R29/004 ,  H04R3/00 ,  H04R3/005 ,  H04R29/005

Abstract: An interface for expanding a signal starting from a first sensing signal and a second sensing signal, wherein a receiving intensity measuring element generates an intensity signal; and a selector is controlled to select each time the first sensing signal, the second sensing signal, or a combined signal deriving from a weighted combination of these signals. The selector uses a plurality of thresholds variable as a function of the intensity signal.

Abstract translation: 一种用于从第一感测信号和第二感测信号开始扩展信号的接口，其中接收强度测量元件产生强度信号; 并且控制选择器以每次选择第一感测信号，第二感测信号或从这些信号的加权组合导出的组合信号。 选择器使用多个阈值作为强度信号的函数而变化。

公开(公告)号：US20140319630A1

公开(公告)日：2014-10-30

申请号：US14265053

申请日：2014-04-29

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Matteo Perletti ,  Roberto Carminati ,  Lorenzo Baldo ,  Alessandro Morcelli

IPC: H04R19/00

CPC classification number: H04R19/005 ,  H01L29/84 ,  H04R1/04 ,  H04R19/04

Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.

Abstract translation: MEMS传感器装置的组件设想：第一管芯，集成微机械检测结构并具有外部主面; 集成了可操作地耦合到微机械检测结构的电子电路，电和机械耦合到第一管芯并且具有相应的外部主面。 第一模具和第二模具的外部主面都被设置成与组件外部的环境直接接触，而不插入封装件。