公开(公告)号：US11774664B2

公开(公告)日：2023-10-03

申请号：US17026819

申请日：2020-09-21

Applicant: STMicroelectronics SA

Inventor： Folly Eli Ayi-Yovo ,  Cédric Durand ,  Frédéric Gianesello

IPC: G02B6/36 ,  G02B6/02 ,  G02B6/30 ,  F21V8/00 ,  B23K26/00 ,  B23K26/364 ,  B23K26/402 ,  B23K26/0622 ,  G02B6/12 ,  B23K103/00

CPC classification number: G02B6/0065 ,  B23K26/00 ,  B23K26/0624 ,  B23K26/364 ,  B23K26/402 ,  G02B6/02152 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/3652 ,  B23K2103/54 ,  G02B2006/12176

Abstract: An embodiment optical device includes a glass plate, a first trench disposed in the glass plate, and a second trench disposed in the glass plate. The second trench crosses the first trench, and the first trench has an open end in a first wall of the second trench. The optical device includes a waveguide disposed inside the first trench, where the waveguide is formed of a material having a refractive index different from that of the glass plate, and a mirror on a second wall of the second trench opposite the first wall and waveguide. The optical device includes an encapsulation layer filling the second trench and covering all of an upper surface of the waveguide and having a refractive index that is different from the waveguide and the glass plate.

公开(公告)号：US10067291B2

公开(公告)日：2018-09-04

申请号：US15499261

申请日：2017-04-27

Applicant: STMicroelectronics SA

Inventor： Cédric Durand ,  Frédéric Gianesello ,  Folly Eli Ayi-Yovo

IPC: G02B6/02 ,  G02B6/30 ,  C03C23/00 ,  B23K26/364 ,  B23K26/402 ,  B23K26/0622 ,  B23K103/00

Abstract: A method of manufacturing a waveguide in a glass plate is disclosed. The glass plate is scanned with a laser beam directed orthogonally to the glass plate to form a trench according to a pattern of the waveguide to be formed. The scanning is performed by pulses of the laser beam having a duration between 2 and 500 femtoseconds. The glass plate with the trench is treated with hydrofluoric acid. After treating the glass plate, the trench is filled with a material having an index different from that of glass, and, after filling the trench, a cladding layer is deposited.

公开(公告)号：US09853345B2

公开(公告)日：2017-12-26

申请号：US14986315

申请日：2015-12-31

Applicant: STMicroelectronics SA

Inventor： Baudouin Martineau ,  Olivier Richard ,  Frédéric Gianesello

IPC: H04B1/40 ,  H01P5/12 ,  H01P5/16 ,  H01Q3/40 ,  H01Q25/00 ,  H03F3/24 ,  H03F3/60 ,  H03F3/68 ,  H03F3/189 ,  H03F3/20 ,  H03F3/19 ,  H03F3/21

CPC classification number: H01P5/12 ,  H01P5/16 ,  H01Q3/40 ,  H01Q25/00 ,  H03F3/189 ,  H03F3/19 ,  H03F3/20 ,  H03F3/211 ,  H03F3/24 ,  H03F3/602 ,  H03F3/68 ,  H03F2200/294 ,  H03F2200/451 ,  H03F2203/21106 ,  H04B1/40

Abstract: A multichannel splitter formed from 1 to 2 splitters. An input terminal of a first 1 to 2 splitter defines an input of the multichannel splitter. The 1 to 2 splitters are electrically series-connected. First respective outputs of the 1 to 2 splitters define output terminals of the multichannel splitter.